KNOWLES SPM0205HD4H

SPM0205HD4H
Digital SiSonic™ Microphone Specification
Halogen Free
Knowles Acoustics
1151 Maplewood Drive
Itasca, IL 60143
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Elect r onics, LLC.
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SPM0205HD4H
1. DESCRIPTION AND APPLICATION
1.1 Description
Digital Surface Mount Silicon Microphone – Halogen Free
1.2 Application
Hand-held consumer electronic devices
2. PART MARKING
Identification Number Convention
Identification
Number
S
1
2
3
4
5
6
7
S: Manufacturing Location
“S” – Knowles Electronics Suzhou
Suzhou, China
“No Alpha Character” – Knowles Electronics Itasca
Itasca, IL USA
“E” – Engineering Samples
Pin 1
Digits 1 – 7: Job Identification Number
3. TEMPERATURE RANGE
3.1 Operating Temperature Range: -40°C to +100°C
3.2 Storage Temperature Range:
-40°C to +100°C
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SPM0205HD4H
4. (a) ACOUSTIC & ELECTRICAL SPECIFICATIONS
Absolute Maximums
Supply Voltage, Vdd to Ground
-0.5, +5.0 VDC
Output Short Circuit
indefinite to either supply rail
ESD Tolerance
4kV
Limits
Symbol
Condition
Unit
Min.
Nom.
Max.
Test Conditions: Vdd=1.8V, fclock=2.4MHz, Ta = 25C unless otherwise noted
Directivity
Omni-directional
Sensitivity
S
1kH, 1Pa, ref Full Scale
Current Consumption
Idd
Output Open Circuit
Signal to Noise Ratio
SNR
@ 1kHz (0dB=1V/Pa)
Operating Voltage
Vdd
Maximum Input Signal
-30
-26
f=1kHz, THD<10%
115
1
ISC
Output grounded
Load Capacitance
Cout
Standby Current
(sleep mode)
I
600
uA
dB
3.6
V
dB
10
mA
Maxim load capacitance
100
pF
fclk < 1kHz
50
uA
Lid to Ground Resistance
100
Data Format
Clock Frequency
dB
FS
56
1.6
Short Circuit Output
Current
-22
½ Cycle PDM
fclock
Clock Duty Cycle
1.0
3.25
MHz
40
60
%
Logic Low
VOL
-0.3
Vss
0.35x Vdd
V
Logic High
VOH
0.65x Vdd
Vdd
Vdd +0.3
V
Delay time for valid data
tdv
20
40
ns
Delay time for High Z
tdz
0
15
ns
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SPM0205HD4H
4. (b) TIMING DIAGRAM
Clock
Vdd
Data2
Valid
data
High
Z
High
Z
Valid
data
Vss
Vdd
Data1
Vss
tdz
tdv
5. FREQUENCY RESPONSE CURVE
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SPM0205HD4H
6. MECHANICAL SPECIFICATIONS
3.76 mm
3.05 mm
1.25 mm
ø 0.91 mm
2.84 mm
0.71 mm
1.88 mm
0.91 mm
1.32 mm
6
1
5
2
4
3
2.36 mm
0.71 mm
4.72 mm
ø 0.91 mm
4.01 mm
ø 0.91 mm
ø 0.84 mm
Pin Output
Item
Dim.
Tol. (+/-)
Units
Height
1.25
0.10
mm
Length
4.72
0.10
mm
Pin #
Function
Width
3.76
0.10
mm
1
Ground
Short Edge to
C.L. Port
1.32
0.25
mm
2
Left/Right
3
Ground
Long Edge to
C.L. Port
1.88
0.25
mm
4
Clock
Coplanarity
<0.1
mm
5
Data
Acoustic Seal
I.D. (typical)
1.55
mm
6
Power (Vdd)
Weight
0.07
grams
Note: (Tolerance +/-0.15mm unless otherwise specified)
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SPM0205HD4H
7. RECOMMENDED CUSTOMER LAND PATTERN
2.34 mm
2.13 mm
ø 0.91 mm
1.65 mm
3.30 mm
ø 0.91 mm
ø 0.91 mm
8. RECOMMENDED SOLDER STENCIL PATTERN
N/A
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SPM0205HD4H
9. RECOMMENDED INTERFACE CIRCUIT
Vdd
L/R
Clock
Data2 mic
Gnd
Data
Vdd
Data1 mic
DSP
L/R
Gnd
Label:
L/R:
Drives data after:
High-Z after:
Data2
High
Rising clock edge
Falling clock edge
Data1
Low
Falling clock edge
Rising clock edge
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SPM0205HD4H
10. PACKAGING DETAIL
Pin 1 Location
Model Number
Suffix
Reel
Diameter
Quantity
per Reel
Tape &
Reel
Available in 13” and 7”
diameter.
SPM0205HD4H
-2
7”
1,200
Empty
Units
SPM0205HD4H
-6
13”
4,800
No consecutive empty
pockets; No more than 3
empty pockets per reel. (Does
not include empty pockets for
leader/follower)
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SPM0205HD4H
11. MAXIMUM SOLDER REFLOW PROFILE
260°C
230°C
170–180°C
Pre-heat
Solder Melt
120 sec.
100 sec.
Stage
Temperature Profile
Time (maximum)
Pre-heat
170 ~ 180 C
120 sec.
Solder Melt
Above 230 C
100 sec.
Peak
260 C maximum
30 sec.
Notes:
1.
Do not pull a vacuum over the port hole of the microphone. Pulling a
vacuum over the port hole can damage the device.
2.
Do not board wash after the reflow process. Board washing and
cleaning agents can damage the device. Do not expose to ultrasonic
processing or cleaning.
3.
Number of Reflow = recommend no more than 3 cycles.
12. ADDITIONAL NOTES
(A)
(B)
(C)
(D)
Packaging (reference SiSonic_Packaging_Spec.pdf)
Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened
ESD moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.
Exposure: Devices should not be exposed to high humidity, high temperature environment.
MSL (moisture sensitivity level) Class 2A.
Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum
conditions of 30ºC/70% R.H.
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SPM0205HD4H
13. RELIABILITY SPECIFICATIONS
Note: After test conditions are performed, the sensitivity of the microphone shall not deviate more
than 3dB from its initial value.
Test
Description
Thermal Shock
100 cycles of air-air thermal shock from -40C to +125C
with 15min soaks. (ICE 68-2-4)
High Temperature
Storage
+105C environment for 1,000 hours. (IEC 68-2-2 Test Ba)
Low Temperature
Storage
-40C environment for 1,000 hours. (IEC 68-2-2 Test Aa)
High Temperature Bias
+105C environment while under bias for 1,000 hours. (IEC
68-2-2 Test Ba)
Low Temperature Bias
-40C environment while under bias for 1,000 hours. (IEC
68-2-2 Test Aa)
Temperature / Humidity
Bias
+85C/85% RH environment while under bias for 1,000
hours. (JESD22-A101A-B)
Vibration
4 cycles lasting 12 minutes from 20 to 2,000Hz in X, Y, and
Z direction with a peak acceleration of 20g. (MIL 883E,
Method 2007.2, A)
Electrostatic Discharge
3 discharges at +/- 8kV direct contact to the lid when unit is
grounded (IEC 1000-4-2) and 3 discharges at +/- 2kV
direct contact to the I/O pins (MIL 883E, Method 3015.7)
Reflow
5 reflow cycles with peak temperature of 260C.
Mechanical Shock
3 pulses of 5,000g in the X, Y, and Z direction. (IEC 68-227, Test Ea)
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SPM0205HD4H
14. SPECIFICATION REVISIONS
Revision
Detailed Specification Changes
Date
A
Specification Release
06-30-2008
The information contained in this literature is based on our experience to date and is believed to be reliable and it is subject to
change without notice. It is intended as a guide for use by persons having technical skill at their own discretion and risk. We do
not guarantee favorable results or assume any liability in connection with its use. Dimensions contained herein are for
reference purposes only. For specific dimensional requirements consult factory. This publication is not to be taken as a license
to operate under, or recommendation to infringe any existing patents. This supersedes and voids all previous literature.
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