ASM3P2775A November 2006 rev 0.3 Low Power Peak EMI Reducing Solution Features • The ASM3P2775A uses the most efficient and optimized modulation profile approved by the FCC and is Generates an EMI optimized clock signal at the implemented by using a proprietary all digital method. output. • Integrated loop filter components. • Operates with a 3.3V Supply. • Operating current less than 4mA. • Low power CMOS design. • Input frequency range: 13MHz to 30MHz • Generates a 1X low EMI spread spectrum clock The ASM3P2775A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering of the input frequency. • EMI by increasing a signal’s bandwidth is called ‘spread Frequency deviation: ±1.75% (Typ) @14.7MHz spectrum clock generation’. Input Frequency. Available in 6-pin TSOT-23, 8-pin SOIC and 8- • Applications pin TSSOP packages. The ASM3P2775A is targeted towards all portable Product Description devices with very low power requirements like MP3 players and digital still cameras. The ASM3P2775A is a versatile spread spectrum frequency modulator designed specifically for a wide Key Specifications range of clock frequencies. The ASM3P2775A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of Description all clock Specification dependent signals. The ASM3P2775A allows significant Supply voltages VDD = 3.3V ± 0.3V system cost savings by reducing the number of circuit Cycle-to-Cycle Jitter 200pS (Max) board layers, ferrite beads and shielding that are Output Duty Cycle 45/55% (worst case) traditionally required to pass EMI regulations. Modulation Rate Equation FIN/640 Frequency Deviation ±1.75% (Typ) @ 14.7MHz Block Diagram VDD PD PLL Modulation XIN/CLKIN XOUT Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ModOUT ASM3P2775A November 2006 rev 0.3 Pin Configuration (6-pin TSOT- 23 Package) PD 1 XOUT 2 6 VSS 5 ModOUT 4 VDD ASM3P2775A XIN / CLKIN 3 Pin Description Pin# Pin Name Type Description Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. 1 PD I 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 XIN / CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 4 VDD P Power supply for the entire chip. 5 ModOUT O Spread spectrum clock output. 6 VSS P Ground connection. Pin Configuration (8-pin SOIC and TSSOP Package) 8 VDD 7 NC PD 3 6 ModOUT NC 4 5 VSS XIN / CLKIN 1 XOUT 2 ASM3P2775A Pin Description Pin# Pin Name Type Description 1 XIN/CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 PD I Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. 4 NC – No connect. 5 VSS P Ground connection. 6 ModOUT O Spread spectrum clock output. 7 NC – No connect. 8 VDD P Power supply for the entire chip. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 2 of 10 ASM3P2775A November 2006 rev 0.3 Modulation Profile Specifications Description Specification Frequency Range 13MHz < CLKIN < 30MHz Modulation Equation FIN/640 Frequency Deviation ±1.75% (Typ) @ 14.7MHz Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TSTG TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 3 of 10 ASM3P2775A November 2006 rev 0.3 DC Electrical Characteristics (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol Parameter Min Typ Max Unit VIL Input low voltage VSS - 0.3 – 0.8 V VIH Input high voltage 2.0 – VDD + 0.3 V IIL Input low current – – -35 µA IIH Input high current – – 35 µA IXOL XOUT output low current (@0.4V, VDD=3.3V) – 3 – mA IXOH XOUT output high current (@2.5V, VDD=3.3V) – 3 – mA VOL Output low voltage (VDD = 3.3 V, IOL = 8 mA) – – 0.4 V VOH Output high voltage (VDD = 3.3 V, IOH = 8 mA) 2.5 – – V IDD Static supply current* – – 10 uA ICC Dynamic supply current (3.3V, 16MHz and no load) – 3.5 – mA 3.0 3.3 3.6 V VDD tON ZOUT Operating voltage Power-up time (first locked cycle after power-up)** – – 5 mS Output impedance – 45 – Ω * XIN /CLKIN pin and PD pin are pulled low ** VDD and XIN/CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics Symbol CLKIN ModOUT fd Parameter Input frequency Output frequency Frequency Deviation Input Frequency = 13MHz Input Frequency = 30MHz Min Typ Max Unit 13 – 30 MHz 13 – 30 MHz – – ±1.8% ±1.1% – – % tLH* Output rise time (measured from 0.8 to 2.0V) 0.5 1.1 1.3 nS tHL * Output fall time (measured at 2.0V to 0.8V) 0.3 0.8 1.0 nS tJC Jitter (cycle to cycle) – 200 – pS tD Output duty cycle 45 50 55 % *tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 4 of 10 ASM3P2775A November 2006 rev 0.3 Typical Crystal Oscillator Circuit Crystal C1 = 27 pF R1 = 510Ω C2 = 27 pF Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency 14.31818MHz Frequency tolerance ± 50 ppm or better at 25°C Operating temperature range -25°C to +85°C Storage temperature -40°C to +85°C Load capacitance 18pF Shunt capacitance 7pF maximum ESR 25 Ω Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 5 of 10 ASM3P2775A November 2006 rev 0.3 Package Information 6-pin TSOT-23 Package Dimensions Symbol Inches Min Max Millimeters Min Max A ….. 0.04 …… 1.00 A1 0.00 0.004 0.00 0.10 A2 0.033 0.036 0.84 0.90 b 0.012 0.02 0.30 0.50 H 0.005 BSC 0.127 BSC D 0.114 BSC 2.90 BSC B 0.06 BSC 1.60 BSC e 0.0374 BSC 0.950 BSC C 0.11 BSC 2.80 BSC L 0.0118 0.02 0.30 0.50 θ 0° 4° 0° 4° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 6 of 10 ASM3P2775A November 2006 rev 0.3 8-Pin SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Millimeters Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 7 of 10 ASM3P2775A November 2006 rev 0.3 8-Pin TSSOP Package H E D A2 A C θ e A1 L B Dimensions Symbol Inches Millimeters Min Max Min Max A …… 0.043 …… 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 8 of 10 ASM3P2775A November 2006 rev 0.3 Ordering Information Part Number Marking Package Type Temperature ASM3P2775AF-06OR X4LL 6-Pin TSOT-23, TAPE & REEL, Pb Free Commercial ASM3P2775AF-08TT 3P2775AF 8-Pin TSSOP, TUBE, Pb Free Commercial ASM3P2775AF-08TR 3P2775AF 8-Pin TSSOP, TAPE & REEL, Pb Free Commercial ASM3P2775AF-08ST 3P2775AF 8-Pin SOIC, TUBE, Pb Free Commercial ASM3P2775AF-08SR 3P2775AF 8-Pin SOIC, TAPE & REEL, Pb Free Commercial ASM3P2775AG-06OR X3LL 6-Pin TSOT-23, TAPE & REEL, Green Commercial ASM3P2775AG-08TT 3P2775AG 8-Pin TSSOP, TUBE, Green Commercial ASM3P2775AG-08TR 3P2775AG 8-Pin TSSOP, TAPE & REEL, Green Commercial ASM3P2775AG-08ST 3P2775AG 8-Pin SOIC, TUBE, Green Commercial ASM3P2775AG-08SR 3P2775AG 8-Pin SOIC, TAPE & REEL, Green Commercial Device Ordering Information A S M 3 P 2 7 7 5 A G - 0 8 T R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under U.S Patent Nos 5,488,627 and 5,631,921 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 9 of 10 ASM3P2775A November 2006 rev 0.3 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008. Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © Alliance Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P2775A Document Version: v0.3 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 10 of 10