ASM3P2180A February 2008 rev 1.2 Peak Reducing EMI Solution Features clock and data dependent signals. ASM3P2180A allows • Generates a 1x EMI optimized clock output. significant system cost savings by reducing the number • Input frequency: 6MHz - 10MHz of circuit board layers, and shielding that are traditionally 18MHz - 30MHz • required to pass EMI regulations. ASM3P2180A Output frequency: 6MHz - 10MHz modulates the output of a single PLL in order to 18MHz - 30MHz “spread” the bandwidth of a synthesized clock, thereby • Two selectable down spread options. decreasing the peak amplitudes of its harmonics. This • Selectable frequency range. results in significantly lower system EMI compared to • Integrated loop filter components. the typical narrow band signal produced by oscillators • Operates with a 3.3V supply. and most clock generators. Lowering EMI by increasing • Low-power CMOS design. a signal’s bandwidth is called spread spectrum clock • Commercial temperature range generation. ASM3P2180A uses the most efficient and • 8-pin SOIC and 8-pin TSSOP packages. optimized modulation profile approved by the FCC and is implemented by using a proprietary all-digital method. Product Description Applications The ASM3P2180A is a versatile spread spectrum The ASM3P2180A is targeted towards notebook LCD frequency modulator designed specifically for a wide displays, other displays using an LVDS interface, PC range of clock frequencies. ASM3P2180A reduces peripheral devices and embedded systems. electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of down stream Block Diagram VDD FS Modulation CLKIN / XIN XOUT SS% Crystal Oscillator CLKOUT PLL GND PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ASM3P2180A February 2008 rev 1.2 Pin Diagram CLKIN / XIN 1 8 XOUT 2 3P2180A NC 7 FS GND 3 6 VDD SS% 4 5 CLKOUT Pin Description Pin# Pin Name Type Description 1 CLKIN / XIN I Crystal connection or external reference clock input. 2 XOUT O Connection for an external crystal. If using an external reference, this pin must be left unconnected. 3 GND P Ground to entire chip. 4 SS% I Spread Selection Input. Has an internal pull-up resistor. 5 CLKOUT O Modulated Clock Output. 6 VDD P Power supply for the entire chip. 7 FS I Frequency selection bit. This pin selects the frequency range of operation. (Refer to the Frequency Range Selection Table). Has an internal pull-up resistor. 8 NC - No connect. Frequency Range Selection FS Frequency Range (MHz) 0 6 -10 1 18-30 Spread Selection table SS% 0 1 Frequency (MHz) FS=0 FS=1 6 18 8 24 10 30 6 18 8 24 10 30 Deviation (%) (typ) -2 -1.5 -1 -4 -3 -2 Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 2 of 8 ASM3P2180A February 2008 rev 1.2 Absolute Maximum Ratings Symbol VDD, VIN TSTG Rating Unit Voltage on any pin with respect to Ground Parameter -0.5 to +4.6 V Storage temperature -65 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics Symbol Max Unit VIL Input low voltage Parameter GND – 0.3 Min Typ 0.8 V VIH Input high voltage 2.0 VDD + 0.3 V IIL Input low current (pull-up resistors on inputs SS%, FS) -27 µA IIH Input high current 18 µA IXOL XOUT output low current (@ 0.4V, VDD = 3.3V) 3 mA IXOH XOUT output high current (@2.5V, VDD = 3.3V) 4 mA VOL Output low voltage (VDD = 3.3V, IOL = 4mA) VOH 2.5 IDD * Output high voltage (VDD = 3.3V, IOH = 4mA) Dynamic supply current normal mode (3.3V and 10pF loading) Static supply current standby mode VDD Operating voltage 2.8 ICC tON ZOUT 0.4 10 Power up time (first locked clock cycle after power up) Clock output impedance V V 15 3.3 25 mA 7 mA 3.7 V 0.18 mS 50 Ω *CLKIN pin pulled to GND Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 3 of 8 ASM3P2180A February 2008 rev 1.2 AC Electrical Characteristics Symbol CLKIN CLKOUT tLH* Parameter Input frequency Output frequency Min Typ Max FS=0 6 10 FS=1 18 30 FS=0 6 10 FS=1 18 30 Output rise time (measured at 0.8V to 2.0V) 1.2 tHL* Output fall time (measured at 2.0V to 0.8V) 0.8 tJC Jitter (cycle to cycle) tD Output duty cycle MHz MHz 1.3 1.4 nS 0.9 1.0 nS 325 45 Unit 50 pS 55 % *tLH and tHL are measured into a capacitive load of 15pF Typical Test Circuit +3.3V Crystal XIN VDD C1 0.1uF XOUT C2 CLKOUT GND Spread spectrum output (EMI suppressed) CLOAD Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 4 of 8 ASM3P2180A February 2008 rev 1.2 Package Information 8-Pin SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 5 of 8 ASM3P2180A February 2008 rev 1.2 8-Pin TSSOP Package H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 6 of 8 ASM3P2180A February 2008 rev 1.2 Ordering Codes Part number Marking Package Type Temperature ASM3P2180AF-08ST ASM3P2180AF 8-pin SOIC, tube, Pb Free Commercial ASM3P2180AF-08SR ASM3P2180AF 8-pin SOIC, tape and reel, Pb Free Commercial ASM3P2180AF-08TT ASM3P2180AF 8-pin TSSOP, tube, Pb Free Commercial ASM3P2180AF-08TR ASM3P2180AF 8-pin TSSOP, tape and reel, Pb Free Commercial ASM3P2180AG-08ST ASM3P2180AG 8-pin SOIC, tube, Green Commercial ASM3P2180AG-08SR ASM3P2180AG 8-pin SOIC, tape and reel, Green Commercial ASM3P2180AG-08TT ASM3P2180AG 8-pin TSSOP, tube, Green Commercial ASM3P2180AG-08TR ASM3P2180AG 8-pin TSSOP, tape and reel, Green Commercial Device Ordering Information ASM 3P 2180A F- 08 S R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 7 of 8 ASM3P2180A February 2008 rev 1.2 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM3P2180A Document Version: 1.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 Many PulseCore Semiconductor products are protected by issued patents or by applications for patent © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 8 of 8