19-2954; Rev 1; 1/04 KIT ATION EVALU E L B AVAILA 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN The MAX8560/MAX8561/MAX8562 step-down DC-DC converters are optimized for applications that prioritize small size and high efficiency. They utilize a proprietary hysteretic-PWM control scheme that switches with fixed frequency and is adjustable up to 4MHz, allowing customers to trade efficiency for smaller external components. Output current is guaranteed up to 500mA, while quiescent current is only 40µA (typ). Internal synchronous rectification greatly improves efficiency and eliminates the external Schottky diode required in conventional step-down converters. Built-in soft-start eliminates inrush current to reduce input capacitor requirements. The MAX8561 features logiccontrolled output voltage, while the MAX8562 drives an external bypass FET. The MAX8560 is available in a 5-pin Thin SOT23 package. The MAX8561/MAX8562 are available in spacesaving 8-pin 3mm x 3mm Thin DFN packages. Features ♦ Up to 4MHz PWM Switching Frequency ♦ 500mA Guaranteed Output Current ♦ 40µA (typ) Quiescent Current ♦ Adjustable Output Voltage from 0.6V to 2.5V ♦ Logic-Controlled Output Voltage (MAX8561) ♦ Drives External Bypass FET (MAX8562) ♦ ±1.5% Initial Accuracy ♦ Soft-Start Eliminates Inrush Current ♦ Fast Voltage-Positioning Transient Response ♦ Internal Synchronous Rectifier ♦ 2.7V to 5.5V Input ♦ 0.1µA Logic-Controlled Shutdown ♦ Thermal Shutdown ♦ Thin SOT23 or Space-Saving 3mm x 3mm x 0.8mm TDFN Packages Applications PART MAX8560EZK-T -40°C to +85°C 5 Thin SOT23-5 ADRX MAX8561ETA -40°C to +85°C 8 TDFN AHD MAX8562ETA -40°C to +85°C 8 TDFN AHE Typical Operating Circuit LX IN GND MAX8560 R1 FB ON/OFF SHDN 1 COUT 2.2µF CFF GND 2 ODO 8 7 6 5 5 LX MAX8560 SHDN 3 MAX8561/ MAX8562 4 FB R2 Thin SOT23-5 1 2 3 4 ODI CIN 2.2µF IN LX INPUT 2.7V TO 5.5V OUTPUT 0.6V TO 2.5V UP TO 500mA FB Pin Configurations TOP VIEW L 1µH TOP MARK GND PDAs, DSC, and MP3 Players PIN-PACKAGE PGND CDMA/RF Power-Amplifier Supplies TEMP RANGE SHDN Cellular and Smart Phones IN Microprocessor/DSP Core Supplies Ordering Information TDFN 3mm × 3mm × 0.8mm ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX8560/MAX8561/MAX8562 General Description MAX8560/MAX8561/MAX8562 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN ABSOLUTE MAXIMUM RATINGS IN, FB, SHDN, ODI, ODO to GND ............................-0.3V to +6V LX to GND (Note 1)......................................-0.3V to (VIN + 0.3V) PGND to GND .......................................................-0.3V to +0.3V LX Current ...........................................................................1.27A Output Short Circuit to GND (typical operating circuit)....................................................10s Continuous Power Dissipation (TA = +70°C) 5-Pin Thin SOT23 (derate 9.1mW/°C above +70°C) ....727mW 8-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Note 1: LX has internal clamp diodes to PGND (GND for MAX8560) and IN. Applications that forward bias these diodes should take care not to exceed the IC’s package power-dissipation limits. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VIN = 3.6V, SHDN = IN, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 1) PARAMETER Supply Voltage Range UVLO Threshold SYMBOL CONDITIONS VIN UVLO MIN 2.7 IIN Output Voltage Range VOUT FB Threshold Voltage VFB SHDN = GND MAX UNITS 5.5 V 2.5 2.6 V 40 80 TA = +25°C 0.01 0.1 µA TA = +85°C 0.1 2.5 V VIN rising, 60mV hysteresis 2.4 ILOAD = 0mA, no switching Supply Current TYP 0.6 VFB falling 0.6 V FB Threshold Line Regulation VIN = 2.7V to 5.5V 0.3 %/V FB Threshold Load Regulation IOUT = 0 to 500mA -0.001 %/mA FB Threshold Voltage Accuracy (Falling) (% of VFB) ILOAD = 0mA FB Threshold Voltage Hysteresis (% of VFB) FB Bias Current TA = +25°C -1.5 +1.5 TA = -40°C to +85°C -2.5 +2.5 VHYS IFB 1.0 SHDN = GND, TA = +25°C, VIN = 5.5V 0.01 SHDN = GND, TA = +85°C, VIN = 5.5V 0.1 VFB = 0.5V, TA = +25°C, VIN = 5.5V 0.01 VFB = 0.5V, TA = +85°C, VIN = 5.5V 0.1 Logic Input High Voltage (SHDN, ODI) VIH VIN = 2.7V to 5.5V Logic Input Low Voltage (SHDN, ODI) VIL VIN = 2.7V to 5.5V % % 0.1 0.1 µA 1.41 V Logic Input Bias Current ODO Output Low Voltage (MAX8562 Only) 2 IIH, IIL VOL 0.4 VIN = 5.5V, SHDN = ODI = GND or IN, TA = +25°C 0.001 VIN = 5.5V, SHDN = ODI = GND or IN, TA = +85°C 0.01 1mA sink current, VIN = 2.7V 0.02 0.1 µA _______________________________________________________________________________________ 0.1 V 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN (VIN = 3.6V, SHDN = IN, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 5 10 20 kΩ VIN = 5.5V, ODO = IN, TA = +25°C 0.01 0.1 VIN = 5.5V, ODO = IN, TA = +85°C 0.1 ODO Pullup to IN (MAX8562 Only) Open-Drain Output Leakage IOHLEAK Current Limit On-Resistance Rectifier-Off Current Threshold ILIMP PFET switch 600 990 1500 ILIMN NFET rectifier 490 680 900 RONP PFET switch, ILX = -40mA 0.8 1.5 RONN NFET rectifier, ILX = +40mA 0.4 0.82 30 60 VIN = 5.5V, LX = GND to IN, ODO = IN, TA = +25°C, SHDN = GND 0.1 1 VIN = 5.5V, LX = GND to IN, ODO = IN, TA = +85°C, SHDN = GND 1 ILXOFF LX Leakage Current 0 ILXLKG Minimum On- and Off-Times µA mA Ω mA µA tON(MIN) 107 tOFF(MIN) 95 Thermal Shutdown ns +160 °C 20 °C Thermal-Shutdown Hysteresis Typical Operating Characteristics (VIN = 3.6V, VOUT = 1.2V, L = 1µH (LQH32CN1R0M53), COUT = 2.2µF, TA = +25°C, unless otherwise noted.) 4.7µH 90 90 EFFICIENCY vs. LOAD CURRENT (VOUT = 1.5V) 100 MAX8560 toc02 100 MAX8560 toc01 100 EFFICIENCY vs. LOAD CURRENT (VOUT = 1.8V) 4.7µH 90 MAX8560 toc03 EFFICIENCY vs. LOAD CURRENT (VOUT = 2.5V) 4.7µH 1µH 70 60 50 80 2.2µH EFFICIENCY (%) 80 EFFICIENCY (%) EFFICIENCY (%) 2.2µH 1µH 70 60 50 40 1 10 100 LOAD CURRENT (mA) 1000 2.2µH 1µH 10 100 70 60 50 40 0.1 80 40 0.1 1 10 100 LOAD CURRENT (mA) 1000 0.1 1 1000 LOAD CURRENT (mA) _______________________________________________________________________________________ 3 MAX8560/MAX8561/MAX8562 ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (continued) (VIN = 3.6V, VOUT = 1.2V, L = 1µH (LQH32CN1R0M53), COUT = 2.2µF, TA = +25°C, unless otherwise noted.) EFFICIENCY vs. LOAD CURRENT (VOUT = 0.9V) 90 90 4.7µH 1µH 70 80 60 2.2µH 70 EFFICIENCY (%) 2.2µH 1µH 60 50 50 40 1 10 1000 100 80 2.2µH 1µH 70 60 50 40 0.1 4.7µH 90 4.7µH 80 EFFICIENCY (%) 40 0.1 1 10 100 1000 0.5 1.0 1.5 2.0 LOAD CURRENT (mA) OUTPUT VOLTAGE (V) NO-LOAD SUPPLY CURRENT vs. SUPPLY VOLTAGE SWITCHING FREQUENCY vs. LOAD CURRENT OUTPUT VOLTAGE vs. LOAD CURRENT (VOLTAGE POSITIONING) 46 1µH 43 42 1.23 OUTPUT VOLTAGE (V) FREQUENCY (MHz) 45 44 1.24 2.2µH 1 4.7µH MAX8560 toc09 10 MAX8560 toc07 47 1.22 1.21 1.20 1.19 1.18 41 1.17 40 R1 = R2 = 100kΩ R1 = R2 = 100kΩ 39 1.16 0.1 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 SUPPLY VOLTAGE (V) 100 200 300 400 500 0 200 300 HEAVY-LOAD SWITCHING WAVEFORMS MAX8560 toc10 MAX8560 toc11 50mA LOAD 200ns/div 100 LOAD CURRENT (mA) LOAD CURRENT (mA) LIGHT-LOAD SWITCHING WAVEFORMS 4 2.5 LOAD CURRENT (mA) MAX8560 toc08 EFFICIENCY (%) 100 MAX8560 toc05 100 MAX8560 toc04 100 EFFICIENCY vs. LOAD CURRENT (LOAD = 7.5Ω) MAX8560 toc06 EFFICIENCY vs. LOAD CURRENT (VOUT = 1.2V) SUPPLY CURRENT (µA) MAX8560/MAX8561/MAX8562 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN 200mA LOAD VOUT 20mV/div VOUT 20mV/div IL 200mA/div 0 IL 200mA/div 0 VLX 2V/div VLX 2V/div 200ns/div _______________________________________________________________________________________ 400 500 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN LIGHT-LOAD SOFT-START WAVEFORMS HEAVY-LOAD SOFT-START WAVEFORMS MAX8560 toc12 LINE-TRANSIENT RESPONSE MAX8560 toc13 100Ω LOAD 3Ω LOAD MAX8560 toc14 VOUT 1V/div IIN 200mA/div VOUT 1V/div IIN 200mA/div 5Ω LOAD VOUT 20mV/div IL 200mA/div IL 200mA/div IL 200mA/div 0 0 VSHDN 2V/div VSHDN 2V/div 0 VIN = 4.0V VIN 500mV/div VIN = 3.5V 20µs/div 20µs/div 2µs/div LOAD-TRANSIENT RESPONSE OUTPUT-VOLTAGE TRANSIENT RESPONSE (MAX8561) BYPASS-FET TRANSIENT RESPONSE (MAX8562) MAX8560 toc15 MAX8560 toc17 MAX8560 toc16 VOUT = 1.5V VOUT 50mV/div VOUT = VIN VOUT 2V/div VOUT 500mV/div VOUT = 1.2V VOUT = 1.0V 0 IL 500mA/div IL 200mA/div IL 500mA/div 0 0 0 ILOAD 500mA/div VODI 2V/div VODI 2V/div 500mA LOAD 20mA LOAD 20mA LOAD 2µs/div 7.5Ω LOAD, L = 2.2µH 40µs/div 7.5Ω LOAD 20µs/div _______________________________________________________________________________________ 5 MAX8560/MAX8561/MAX8562 Typical Operating Characteristics (continued) (VIN = 3.6V, VOUT = 1.2V, L = 1µH (LQH32CN1R0M53), COUT = 2.2µF, TA = +25°C, unless otherwise noted.) MAX8560/MAX8561/MAX8562 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN Pin Description PIN MAX8560 MAX8561 MAX8562 NAME FUNCTION 1 1 IN 2 7 GND Ground 3 8 SHDN Active-Low Shutdown Input. Connect to IN or logic high for normal operation. Connect to GND or logic low for shutdown mode. 4 6 FB — 2 PGND 5 3 LX — 5 ODO Auxiliary Open-Drain Output — 4 ODI Digital Input for Open-Drain MOSFET. Connect to IN or logic high to internally pull ODO low (and force the MAX8562 into 100% duty cycle). Connect to GND or logic low to force ODO to high impedance (MAX8561) or 10kΩ pullup from ODO to IN (MAX8562). — EP EP Exposed Pad. Connect to GND. Supply Voltage Input. 2.7V to 5.5V. Bypass with a 2.2µF ceramic capacitor as close as possible to the IN and GND pins. Voltage Feedback Input. FB regulates to 0.6V nominal. Connect FB to the center of an external resistive divider (see the Setting the Output Voltage section). Power Ground. Must connect to GND. Inductor connection to the drains of the internal P-channel and N-channel MOSFETs. Detailed Description The MAX8560/MAX8561/MAX8562 step-down converters deliver a guaranteed 500mA at output levels from 0.6V to 2.5V. They use a proprietary hysteretic-PWM control scheme that switches up to 4MHz, allowing a trade-off between efficiency and tiny external components. At light loads below 100mA, the MAX8560/MAX8561/MAX8562 automatically switch to pulse-skipping mode to keep quiescent supply current as low as 40µA (typ). Control Scheme A proprietary hysteretic-PWM control scheme ensures high efficiency, fast switching, fast transient response, low output ripple, and physically tiny external components. This control scheme is simple: when the output voltage falls below the regulation threshold, the error comparator begins a switching cycle by turning on the high-side switch. This switch remains on until the minimum on-time expires and the output voltage is in regulation or the current-limit threshold is exceeded. Once off, the high-side switch remains off until the minimum off-time expires and the output voltage falls again, 6 below the regulation threshold. During this period, the low-side synchronous rectifier turns on and remains on until either the high-side switch turns on again or the inductor current approaches zero. The internal synchronous rectifier eliminates the need for an external Schottky diode. Voltage-Positioning Load Regulation As seen in the Typical Operating Circuit, the MAX8560/MAX8561/MAX8562 use a unique feedback network. By taking feedback from the LX node through R1, the usual phase lag due to the output capacitor is removed, making the loop exceedingly stable and allowing the use of a very small ceramic output capacitor. This configuration causes the output voltage to shift by the inductor series resistance multiplied by the load current. This voltage-positioning load regulation greatly reduces overshoot during load transients, which effectively halves the peak-to-peak output-voltage excursions compared to traditional step-down converters. See the Load Transient Response graph in the Typical Operating Characteristics section. _______________________________________________________________________________________ 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN MAX8560/MAX8561/MAX8562 Shutdown Mode Connecting SHDN to GND or logic low places the MAX8560/MAX8561/MAX8562 in shutdown mode and reduces supply current to 0.1µA. In shutdown, the control circuitry, internal-switching P-channel MOSFET, and synchronous rectifier (N-channel MOSFET) turn off and LX becomes high impedance. Connect SHDN to IN or logic high for normal operation. IN PFET SHDN PWM LOGIC NFET LX 0.6V PGND (GND)** Soft-Start The MAX8560/MAX8561/MAX8562 have internal softstart circuitry that eliminates inrush current at startup, reducing transients on the input source. Soft-start is particularly useful for higher impedance input sources, such as Li+ and alkaline cells. See the Soft-Start and Shutdown Response graphs in the Typical Operating Characteristics section. MAX8560 MAX8561* MAX8562* FB 10kΩ ODO Open-Drain Output The 8-pin TDFN versions, the MAX8561 and MAX8562, include an extra, internal, open-drain N-channel MOSFET switch that can save an additional package in space-constrained applications. The open drain is connected to ODO, while the gate is controlled by a digital input at ODI. For the MAX8561, this circuit can be used to toggle between two regulated output voltages, as in Figure 2. For the MAX8562, a 10kΩ resistor pulls ODO up to IN when ODI is low, and the buck converter is forced into 100% duty cycle when ODI is high. This makes the MAX8562 ideal for driving an external bypass PFET for high-power mode in CDMA cell phones, as in Figure 3. Applications Information The MAX8560/MAX8561/MAX8562 are optimized for use with tiny inductors and small ceramic capacitors. The correct selection of external components, especially CFF, ensures high efficiency, low output ripple, and fast transient response. Setting the Output Voltage Select an output voltage between 0.6V and 2.5V by connecting FB to a resistive voltage-divider between LX and GND (see the Typical Operating Circuit). Choose R2 for a reasonable bias current in the resistive divider. A wide range of resistor values is acceptable, but a good starting point is to choose R2 as 100kΩ. Then, R1 is given by: V R1 = R2 OUT − 1 V FB where VFB = 0.6V. ODI GND *NOTE: ODI/ODO AVAILABLE IN THE MAX8561/MAX8562 ONLY. THE MAX8561 ODO IS AN OPEN-DRAIN OUTPUT. THE MAX8562 HAS AN INTERNAL 10kΩ PULLUP TO IN. **GND FOR MAX8560. Figure 1. Simplified Functional Diagram Inductor Selection The MAX8560/MAX8561/MAX8562 operate with inductors of 1µH to 4.7µH. Low inductance values are smaller but require faster switching, which results in some efficiency loss. See the Typical Operating Characteristics section for efficiency and switching frequency vs. inductor value. The inductor’s DC current rating only needs to match the maximum load current of the application + 50mA because the MAX8560/MAX8561/ MAX8562 feature zero current overshoot during startup and load transients. For output voltages above 2.0V, when light-load efficiency is important, the minimum recommended inductor is 2.2µH. For optimum voltage-positioning load transients, choose an inductor with DC series resistance in the 50mΩ to 150mΩ range. For higher efficiency at heavy loads (above 200mA) or minimal load regulation (but some transient overshoot), the resistance should be kept below 100mΩ. For light-load applications up to 200mA, much higher resistance is acceptable with very little impact on performance. _______________________________________________________________________________________ 7 MAX8560/MAX8561/MAX8562 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN INPUT Li+ BATTERY INPUT Li+ BATTERY 2.2µH GND PFET LX IN 2.2µF OUTPUT 1.5V OR 1.0V AT 500mA 2.2µF MAX8561 IN 100kΩ 2.2µF GND FB 120kΩ ON/OFF 1.5/1.0 SHDN ODO 2.2µF MAX8562 100kΩ 220pF ODO ODI OUTPUT 1.2V OR VBATT 1.5µH LX FB 150kΩ PGND ON/OFF HP/LP SHDN 150pF 100kΩ ODI HP = HIGH-POWER MODE LP = LOW-POWER MODE PGND Figure 2. Using ODI/ODO to Obtain Two Output Voltages from the MAX8561 Capacitor Selection Output Capacitor The output capacitor, C OUT, is required to keep the output voltage ripple small and to ensure regulation loop stability. COUT must have low impedance at the switching frequency. Ceramic capacitors with X5R or X7R dielectrics are highly recommended due to their small size, low ESR, and small temperature coefficients. Due to the unique feedback network, the output capacitance can be very low. For most applications, a 2.2µF capacitor is sufficient. For optimum load-transient performance and very low output ripple, the output capacitor value in µFs should be equal to or larger than the inductor value in µHs. Input Capacitor The input capacitor, CIN, reduces the current peaks drawn from the battery or input power source and reduces switching noise in the IC. The impedance of CIN at the switching frequency should be kept very low. Ceramic capacitors with X5R or X7R dielectrics are highly recommended due to their small size, low ESR, and small temperature coefficients. Due to the MAX8560/MAX8561/MAX8562s’ soft-start, the input capacitance can be very low. For most applications, a 2.2µF capacitor is sufficient. 8 Figure 3. Using the MAX8562 to Control an External Bypass PFET for a Two-Step VCC in CDMA-PA Applications Feed-Forward Capacitor The feed-forward capacitor, CFF, sets the feedback loop response, controls the switching frequency, and is critical in obtaining the best efficiency possible. Choose a small ceramic X7R capacitor with a value given by: CFF = L × 10 Siemens R1 Select the closest standard value to CFF as possible. PC Board Layout and Routing High switching frequencies and relatively large peak currents make the PC board layout a very important part of design. Good design minimizes excessive EMI on the feedback paths and voltage gradients in the ground plane, both of which can result in instability or regulation errors. Connect CIN close to IN and GND. Connect the inductor and output capacitor as close to the IC as possible and keep their traces short, direct, and wide. Connect GND and PGND separately to the ground plane. The external feedback network should be very close to the FB pin, within 0.2in (5mm). Keep noisy traces, such as the LX node, as short as possible. For the 8-pin TDFN package, connect GND to the exposed paddle directly under the IC. Figure 4 illustrates an example PC board layout and routing scheme. _______________________________________________________________________________________ 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN MANUFACTURER SERIES INDUCTANCE (µH) ESR (Ω) CURRENT RATING (mA) DIMENSIONS LB2012 1.0 2.2 0.15 0.23 300 240 2.0 x 1.25 x 1.45 = 3.6mm3 LB2016 1.0 1.5 2.2 3.3 0.09 0.11 0.13 0.20 455 350 315 280 2.0 x 1.6 x 1.8 = 5.8mm3 LB2518 1.0 1.5 2.2 3.3 0.06 0.07 0.09 0.11 500 400 340 270 2.5 x 1.8 x 2.0 = 9mm3 LBC2518 1.0 1.5 2.2 3.3 4.7 0.08 0.11 0.13 0.16 0.20 775 660 600 500 430 2.5 x 1.8 x 2.0 = 9mm3 LQH31C_03 1.0 0.28 510 3.2 x 1.6 x 2.0 = 10mm3 LQH32C_53 1.0 2.2 4.7 0.06 0.10 0.15 1000 790 650 3.2 x 2.5 x 1.7 = 14mm3 LQM43FN 2.2 4.7 0.10 0.17 400 300 4.5 x 3.2 x 0.9 = 13mm3 D310F 1.5 2.2 3.3 0.13 0.17 0.19 1230 1080 1010 3.6 x 3.6 x 1.0 = 13mm3 D312C 1.5 2.2 2.7 3.3 0.10 0.12 0.15 0.17 1290 1140 980 900 3.6 x 3.6 x 1.2 = 16mm3 CDRH2D11 1.5 2.2 3.3 4.7 0.05 0.08 0.10 0.14 900 780 600 500 3.2 x 3.2 x 1.2 = 12mm3 Taiyo Yuden Murata TOKO Sumida _______________________________________________________________________________________ 9 MAX8560/MAX8561/MAX8562 Table 1. Suggested Inductors 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN MAX8560/MAX8561/MAX8562 Chip Information TRANSISTOR COUNT: 1271 PROCESS: BiCMOS (a) MAX8560 (b) MAX8561 (c) MAX8562 Figure 4. Recommended PC Board Layout 10 ______________________________________________________________________________________ 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN THIN SOT23.EPS ______________________________________________________________________________________ 11 MAX8560/MAX8561/MAX8562 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 6, 8, &10L, DFN THIN.EPS MAX8560/MAX8561/MAX8562 4MHz, 500mA Synchronous Step-Down DC-DC Converters in Thin SOT and TDFN L A D D2 A2 PIN 1 ID 1 N 1 C0.35 b E PIN 1 INDEX AREA [(N/2)-1] x e REF. E2 DETAIL A e k A1 CL CL L L e e A DALLAS SEMICONDUCTOR PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 6, 8 & 10L, TDFN, EXPOSED PAD, 3x3x0.80 mm NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY APPROVAL DOCUMENT CONTROL NO. 21-0137 REV. D 1 2 COMMON DIMENSIONS SYMBOL A MIN. 0.70 0.80 D 2.90 MAX. 3.10 E 2.90 3.10 A1 0.00 0.05 L k 0.20 0.40 0.25 MIN. A2 0.20 REF. PACKAGE VARIATIONS PKG. CODE N D2 E2 e JEDEC SPEC b T633-1 6 1.50±0.10 2.30±0.10 0.95 BSC MO229 / WEEA 0.40±0.05 1.90 REF T833-1 8 1.50±0.10 2.30±0.10 0.65 BSC MO229 / WEEC 0.30±0.05 1.95 REF T1033-1 10 1.50±0.10 2.30±0.10 0.50 BSC MO229 / WEED-3 0.25±0.05 2.00 REF [(N/2)-1] x e DALLAS SEMICONDUCTOR PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 6, 8 & 10L, TDFN, EXPOSED PAD, 3x3x0.80 mm APPROVAL DOCUMENT CONTROL NO. 21-0137 REV. D 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.