TOREX XC3202A183ZR-G

XC3202 Series
ETR0412-005
Low Power Consumption Hall IC (Magnetic Sensor)
■GENERAL DESCRIPTION
The XC3202 series is a Hall effect magnetic sensor IC with a built-in CMOS output driver.
The device features low power
consumption and small packaging which is ideally suited for battery powered portable applications such as mobile phones,
electronic dictionaries and handheld game consoles. When the magnetic flux density (Omnipolar) is larger than the operating
magnetic flux density (Bop), the CMOS output driver will be turned on (Detect Low). The output driver will be turned off
(Release High) when the output is lower than the release magnetic flux density (Brp).
■FEATURES
■APPLICATIONS
Release Magnetic Flux Density
: 2.4~5.5V
: 8μA
: South Pole
North Pole
: South Pole
3mT(TYP.)
-3mT(TYP.)
2mT(TYP.)
North Pole
-2mT(TYP.)
Hysteresis Width
: South Pole
1mT(TYP.)
North Pole
1mT(TYP.)
Packages
: SOT-23D
QFN-0601 (under development)
: EU RoHS Compliant, Pb Free
Supply Voltage Range
Average Supply Current
Operating Magnetic Flux Density
●Cover detector, Home security systems
●Mobile phones
●Electronic dictionaries
●Portable game consoles
●Home electronics (refrigerators, washing machines etc)
Environmentally Friendly
■TYPICAL APPLICATION CIRCUIT
■ TYPICAL PERFORMANCE
CHARACTERISTICS
●Supply Current (avg) vs. Ambient Temperature
XC 3 2 0 2 A1 8 3
C
XC3202
V OUT
OUTPUT
VSS
Average Supply Current : Idd (μA)
VDD
40
VINr=.5.5V
3.0V
2.4V
30
20
10
0
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta (℃)
*C is a capacitor for noise reduction and input voltage stability.
The recommended value is 10nF~100nF
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XC3202 Series
■PIN CONFIGURATION
* QFN-0601 is under development.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTION
1
VDD
Power Input
2
3
VOUT
Output Pin
3
5
VSS
Ground
-
2,4,6
NC
No Connection
SOT-23D
QFN-0601
1
* QFN-0601 is under development.
■PRODUCT CLASSIFICATION
●Ordering Information
XC3202①②③④⑤⑥-⑦(*1)
DESCRIPTION
DESIGNATOR
DESCRIPTION
SYMBOL
①
Product Type
A
②③④
Product No.
183
⑤⑥-⑦
Packages
Taping Type (*2)
MR-G
SOT-23D (Halogen & Antimony free)
ZR-G
QFN-0601 (Halogen & Antimony free) (under development)
CMOS Output
Based on the internal standard
* QFN-0601 is under development.
(*1)
(*2)
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The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or
representative. (Standard orientation: ⑤R-⑦, Reverse orientation: ⑤L-⑦)
XC3202
Series
■BLOCK DIAGRAMS
VDD
Power
switch
Hall Plate
Amp
Latch
VOUT
Logical
Hall Plate
Amp
Latch
VSS
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Supply Voltage
VDD
7
V
Magnetic Flux Density
B
Unlimited
-
Operating Temperature Range
Topr
-40~+85
℃
Storage Temperature Range
Tstg
-55~+150
℃
Pd
150
under development
mW
Maximum Junction Temperature
Tjc
125
℃
Maximum Output Current
IOUT
40
mA
SOT-23D
QFN-0601
Power Dissipation
* This IC should be used within the stated absolute maximum ratings in order to prevent damage.
■OPERATING CONDITION
PARAMETER
SYMBOL
CONDITONS
RATINGS
UNITS
CIRCUIT
Supply Voltage
VDD
Operating
2.4~5.5
V
-
■ELECTRICAL CHARACTERISTICS
Ta=25℃, VDD=3V
PARAMETER
SYMBOL
CONDITONS
MIN.
TYP.
MAX.
UNITS
CIRCUIT
On-state Output
Voltage
VOUT
IOUT=1mA
-
0.1
0.3
V
③
IDD (en)
-
3
6
mA
②
Supply Current
IDD (dis)
-
5
10
μA
①
IDD (avg)
-
8
16
μA
②
Detection Time
tawake
-
75
150
μs
Detection Period
tperiod
-
75
150
ms
Duty Cycle
DTY
-
0.1
-
%
②
②
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XC3202 Series
■MAGNETIC CHARACTERISTCS
PARAMETER
SYMBOL
O
Ta=25 C, VDD=3V, 1mT=10Gauss
MIN.
TYP.
MAX.
UNITS
CIRCUIT
Operating Magnetic Flux Density: South Pole
Bops
2
3
4
mT
③
Operating Magnetic Flux Density: North Pole
Bopn
-4
-3
-2
mT
③
Release Magnetic Flux Density: South Pole
Brps
1
2
-
mT
③
Release Magnetic Flux Density: North Pole
Hysteresis Width
Brpn
-
-2
-1
mT
Bhy(Bop-Brp)
0.5
1
-
mT
③
③
■OPERATIONAL
●Operating by flux density
Output Voltage
Off-state
Output Voltage
Off-state
On-state
On-state
Magnetic flux density (North Pole)
Magnetic flux density (South Pole)
●Timing chart
tperiod Time
IDD
tperiod Time
IDD
tawake Time
tawake Time
Time
Time
B
B
Bop
Brp
VOUT
VOUT
Hig
h
* 1
Low
Hig
h
* 2
Low
*1: When the magnetic flux density to the IC becomes larger than Bop, the IC goes into an on-state and outputs a low signal (VOUT=Low) at the
leading edge of the next “tawake” pulse.
*2: When the magnetic flux density to the IC becomes lower than Brp, the IC goes into an off-state and outputs a high signal (VOUT=High) at the
leading edge of the next “tawake” pulse.
During the other periods, the previous state is maintained.
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XC3202
Series
■TEST CIRCUITS
Circuit ①
測定回路 1
1.VDD
3.VOUT
V
2.VSS
A
Circuit ②測定回路
2
1.VDD
3.VOUT
2.VSS
OSC
OSC:Oscilloscope
Circuit ③測定回路
3
Bcoil
Vcoil
1.VDD
3.VOUT
2.VSS
OSC
OSC:Oscilloscope
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XC3202 Series
■PACKAGING INFORMATION
●SOT-23D
●Position of sensor
3.0±0.1
0.4 +0.1
-0.05
3
0.8
0~0.1
2
1
(1.9)
2
1
0.45±0.1
2.85±0.15
1.6±0.1
3
1.5
0.65
1.15±0.15
0.15±0.05
(0.95)
●Position of sensor
1.0mm
●QFN-0601 (under development)
0.65mm
6/8
0.43mm
XC3202
Series
SOT-23D
3
■ MARKING RULE
①
SOT-23D / QFN-0601
① represents production number: standard / custom production
②
③
④
1
MARK
PRODUCT SERIES
2
XC3202******
⑤
2
QFN0601
② denotes production registered number: standard / custom production
1, …, 9, A, …, Z in order (G, I, J, O, Q, W are excluded)
①
②
④
③
⑤
1pin→
③ represents the last 1 digit of the manufacturing year: standard / custom production
(e.g)
MARK
YEAR
9
2009
0
2010
*QFN-0601 is under development
④ represents manufacturing month: standard / custom production
MARK
MANUFACTURING
MONTH
MARK
MANUFACTURING
MONTH
MARK
MANUFACTURING
MONTH
A
January
E
May
J
September
B
February
F
June
K
October
C
March
G
July
L
November
D
April
H
August
M
December
⑤ denotes production lot number
A, …, Z, in order
(G, I, J, O, Q, W are excluded)
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XC3202 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
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