WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 TI德州仪器无线链接产品数据手册 CC2540 声明:此手册由信驰达科技进行翻译整理,旨在更方便快捷的为您进行开发和交流提供帮助。译文难免会出现错误及误差,如对此有建议可通过邮件方式 联系我们,非常感谢您的反馈。凡译文手册注明“ ”的作品,均为信驰达(RF-star®)公司合法拥有版权或有权使用的作品,未经本公司授权不得转 载、摘编或利用其它方式用于商业用途。已经本公司授权使用作品的,应在授权范围内使用,并注明 “信驰达科技提供”。违反上述声明者,本公司将拥有 最终解释权。 Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 信驰达简介 信驰达科技(RF-star)是一家集合方案设计功能和核心器件供应的专业本地电子元器件分销商,专注低功 耗射频 LPRF 和低功耗 MCU 领域,公司成立于 2010年,作为中国区唯一具有美国 TI 公司授予的 LPRF Product Reseller 和 Third Party 双重资质的公司,一直引领着 LPRF 技术在国内的推广和应用,是国内唯一 一家可提供 LPRF 软硬件产品、技术支持、解决方案和核心元器件供应一条龙服务的专业化公司; 公司在美国新泽西州、中国深圳、上海、北京、天津、无锡、长沙、成都、重庆设有研发中心和办事处, 拥有资深的技术研发团队和销售团队以及 SMT 生产工厂。 无线射频器件用于低于1GHz 和2.4GHz 频段、ANT、蓝牙(Bluetooth)、低功耗蓝牙、射频识别(RFID)、 PurePath 无线音频、ZigBee、IEEE802.15.4、Zigbee RF4CE、6LoWPAN、Wi-Fi 的射频集成电路( RF IC ) 和专有协议。 产品市场应用:ZigBee 无线传感网络,各种数据采集及遥测监控 (含数据, 语音,图像等),可应用于安防、 医疗、能源、水力、电力、交通监控、防盗,无线自动抄表;仪器仪表远程数据遥测、工业无线遥控;消防安 全自动报警、煤矿安全监控及人员定位;汽车防盗、胎压检测,四轮定位;无线键盘、鼠标、打印机、游戏 杆、遥控玩具、机器人等广泛的领域。适用于合乎全世界免费频段 315MHz、433 MHz、470MHz、868 MHz、915 MHz、2.4GHz,符合 FCC、CE、SGS、RoHs 认证规范,产品和信誉受到国内外顾客的一致好 评。 RF-star 将一如既往,为客户提供更多、更好的产品,更具优势的技术服务,良好的商务服务,和更完善 的物流服务。RF-star 将跨上一个新的平台,获得更大的发展空间。 RF-star 将继续本着“务实、诚信、学习、 创新”的专业精神,团结一致、奋勇开拓、锐意进取,为成为全球 无线射频技术绝对第一之产品、服务及解决 方案提供者,把科技与客户联系在一起,为供应链注入动力,并提供卓越的投资回报而不懈努力。 如果您在产品开发过程中发现技术难题以及高频困扰,竭诚欢迎来电洽询。我们将为您提供技术支持和解 决方案,让您能更快把产品推向市场。 我们深信射频技术将会得到迅速的发展与普及,我们愿意分享多年来在射频行业积累的经验与教训,为无 线的明天做出贡献。专业源于专注,科技铸就未来。 Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 重要特性: ● 真正的低功耗蓝牙片上系统解决方案: ● 外围设备 — 含 8 个通道和可配置分辨率的 12 位数模转 CC2540 集合低功耗蓝牙协议栈,包括外设 换 接口和广泛的传感器等。 — 集成高性能比较器 ● 封装 6mm *6mm — 通用定时器 16 字节,2 个 8 字节) ● RF 部分 — 21 个多功能 I/O 口(19*4mA.2*20mA) — 蓝牙低功耗兼容技术 — 32kHz 休眠定时器 — 出色的链路预算(高达 97dB),支持无外部 — 2 个串口 前段的远程应用 — 全速 USB 接口 — 精确的数据接收信号强度检测(RSSI) — 红外发生电路 — 适用于针对世界范围内的无线电频率调节系 — 功能强大的 5 个通道直接内存访问(DMA) 统 , 规 则 : ETSI EN 300 328 ,EN 300 440 2 类 — AES 安全协处理器 ( 欧 洲 ), FCC CFR47 15 部 分 ( 美 国 ),ARIB — 电池监控和温度传感器 STD-T66(日本) — 每个 CC2540 内涵一个唯一的 48 位 IEEE 地 ● 布局 址。 — 很少外部元件 — 提供参考设计 应用: — 6mm*6mm QFN-40 封装: 2.4G 低功耗蓝牙系统 ● 低功耗 移动配件 — 接收模式低至 19.6mA 运动和健身设备 — 发送模式(-6dBm):24mA 消费电子 — 功率模式 1(3-us 唤醒):235uA 人机接口器件 — 功率模式 2(睡眠计时器开启):0.9uA USB 软件狗 — 功率模式 3:(外部中断):0.4uA 健康和医疗 — 供电范围:2V-3.6V — 在所有电源模式下都有 RAM 和寄存器存储 ●微控制处理器 — 高性能,低功耗的 2051 内核 — 系统可编程闪存 56KB — 静态随机存储器 8KB Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com 描述: WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 CC2540 是一款高性价比,低功耗的正在片上系统(Soc)解决方案,适合蓝牙低耗能应用,它使低总体 物料清单成本建立强健的网络节点成为可能。CC2540 包含一个出色的工业标准的 8051 内核的 RF 收发 器,系统编程闪存记忆,8KB RAM 和其他功能强大的配套特征以及外设。 CC2540 适用于低功耗系统, 超低的睡眠模式,以及运行模式的超低功耗的转换进一步实现了超低功耗。 CC2540 有 2 中不同的版 本 :CC2540F128/F256 , 分 别 拥 有 128 和 256KB 闪 存 记 忆 。 与 TI 的 蓝 牙 低 功 耗 协 议 栈 相 连 接 , CC2540F128/256 形成市场上最灵活,高性价比的单模式蓝牙低耗能解决方案。 Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) Supply voltage MIN MAX –0.3 3.9 V –0.3 VDD + 0.3, ≤ 3.9 V 10 dBm –40 85 °C All pads, according to human-body model, JEDEC STD 22, method A114 2 kV According to charged-device model, JEDEC STD 22, method C101 500 V All supply pins must have the same voltage Voltage on any digital pin Input RF level Storage temperature range ESD (2) (1) (2) UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS MIN Operating ambient temperature range, TA MAX UNIT –40 85 °C 2 3.6 V Operating supply voltage ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER Icore Iperi Core current consumption Peripheral current consumption (Adds to core current Icore for each peripheral unit activated) TEST CONDITIONS MIN TYP MAX UNIT Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention 235 Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention 0.9 Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention 0.4 Low MCU activity: 32-MHz XOSC running. No radio or peripherals. No flash access, no RAM access. 6.7 µA mA Timer 1. Timer running, 32-MHz XOSC used 90 mA Timer 2. Timer running, 32-MHz XOSC used 90 mA Timer 3. Timer running, 32-MHz XOSC used 60 mA Timer 4. Timer running, 32-MHz XOSC used 70 mA Sleep timer, including 32.753-kHz RCOSC 0.6 mA ADC, when converting 1.2 mA Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 GENERAL CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKE-UP AND TIMING Power mode 1 → Active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 ms Power mode 2 or 3 → Active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC 120 ms Crystal ESR = 16 Ω. Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF 410 ms Active → TX or RX With 32-MHz XOSC initially on RX/TX turnaround 160 ms 150 ms RADIO PART RF frequency range Programmable in 2-MHz steps Data rate and modulation format 1 Mbps, GFSK, 250 kHz deviation 2402 2480 MHz TYP MAX UNIT RF RECEIVE SECTION Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V, fc = 2440 MHz 1 Mbps, GFSK, 250-kHz deviation, Bluetooth low energy mode, and 0.1% BER (1) PARAMETER TEST CONDITIONS MIN (2) High-gain mode –93 dBm Receiver sensitivity (2) Standard mode –87 dBm 6 dBm Receiver sensitivity Saturation (3) Co-channel rejection (3) –5 dB Adjacent-channel rejection (3) ±1 MHz 5 dB Alternate-channel rejection (3) ±2 MHz 30 dB –30 dBm Blocking (3) Frequency error tolerance (4) Including both initial tolerance and drift Symbol rate error tolerance (5) Conducted measurement with a 50-Ω single-ended load. Spurious emission. Only largest spurious Complies with EN 300 328, EN 300 440 class 2, FCC CFR47, emission stated within each band. Part 15 and ARIB STD-T-66 Current consumption (1) (2) (3) (4) (5) –250 250 kHz –80 80 ppm –75 RX mode, standard mode, no peripherals active, low MCU activity, MCU at 250 kHz 19.6 RX mode, high-gain mode, no peripherals active, low MCU activity, MCU at 250 kHz 22.1 dBm mA 0.1% BER maps to 30.8% PER The receiver sensitivity setting is programmable using a TI BLE stack vendor-specific API command. The default value is standard mode. Results based on standard gain mode Difference between center frequency of the received RF signal and local oscillator frequency Difference between incoming symbol rate and the internally generated symbol rate Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 RF TRANSMIT SECTION Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz PARAMETER Output power Programmable output power range Spurious emissions Current consumption Optimum load impedance (1) TEST CONDITIONS Delivered to a single-ended 50-Ω load through a balun using maximum recommended output power setting Delivered to a single-ended 50-Ω load through a balun using minimum recommended output power setting Delivered to a single-ended 50 Ω load through a balun MIN TYP MAX UNIT 4 dBm –20 24 dB Conducted measurement with a 50-Ω single-ended load. Complies with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 (1) –41 dBm TX mode, –23-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 21.1 TX mode, –6-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 23.8 mA TX mode, 0-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 27 TX mode, 4-dBm output power, no peripherals active, low MCU activity, MCU at 250 kHz 31.6 Differential impedance as seen from the RF port (RF_P and RF_N) toward the antenna 70 + j30 Ω Designs with antenna connectors that require conducted ETSI compliance at 64 MHz should insert an LC resonator in front of the antenna connector. Use a 1.6-nH inductor in parallel with a 1.8-pF capacitor. Connect both from the signal trace to a good RF ground. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 32-MHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX 32 Crystal frequency accuracy requirement (1) UNIT MHz –40 40 ppm ESR Equivalent series resistance 6 60 Ω C0 Crystal shunt capacitance 1 7 pF CL Crystal load capacitance 10 Start-up time Power-down guard time (1) 16 0.25 The crystal oscillator must be in power down for a guard time before it is used again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. pF ms 3 ms Including aging and temperature dependency, as specified by [1] 32.768-kHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX 32.768 Crystal frequency accuracy requirement (1) –40 UNIT kHz 40 ppm ESR Equivalent series resistance 40 130 kΩ C0 Crystal shunt capacitance 0.9 2 pF Crystal load capacitance 12 16 pF Start-up time 0.4 CL (1) s Including aging and temperature dependency, as specified by [1] 32-kHz RC OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with Tw = 25°C and VDD = 3 V. PARAMETER Calibrated frequency (1) Temperature coefficient (2) (3) Calibration time (4) (1) (2) (3) (4) MIN TYP 32.753 Frequency accuracy after calibration Supply-voltage coefficient TEST CONDITIONS MAX UNIT kHz ±0.2% 0.4 %/°C 3 %/V 2 ms The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. Frequency drift when temperature changes after calibration Frequency drift when supply voltage changes after calibration When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is set to 0. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 16-MHz RC OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN Frequency (1) TYP MAX 16 Uncalibrated frequency accuracy ±18% Calibrated frequency accuracy ±0.6% UNIT MHz Start-up time 10 ms Initial calibration time (2) 50 ms (1) (2) The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0. RSSI CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS Useful RSSI range (1) Absolute uncalibrated RSSI accuracy (1) MIN MAX UNIT High-gain mode –99 to –44 Standard mode –90 to –35 High-gain mode ±4 dB 1 dB Step size (LSB value) (1) TYP dBm Assuming CC2540 EM reference design. Other RF designs give an offset from the reported value. FREQUENCY SYNTHESIZER CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz PARAMETER Phase noise, unmodulated carrier TEST CONDITIONS MIN TYP At ±1-MHz offset from carrier –109 At ±3-MHz offset from carrier –112 At ±5-MHz offset from carrier –119 MAX UNIT dBc/Hz ANALOG TEMPERATURE SENSOR Measured on Texas Instruments CC2540 EM reference design with TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS Output Temperature coefficient Voltage coefficient Initial accuracy without calibration Measured using integrated ADC, internal band-gap voltage reference, and maximum resolution MIN TYP MAX UNIT 1480 12-bit 4.5 mv/°C 1 / 0.1 V ±10 °C Accuracy using 1-point calibration ±5 °C Current consumption when enabled 0.5 mA Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 OP-AMP CHARACTERISTICS TA = 25°C, VDD = 3 V, . All measurement results are obtained using the CC2540 reference designs post-calibration. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x03, OPAMPC = 0x01 Output maximum voltage VDD – 0.07 Output minimum voltage 0.07 V Open-loop gain 108 dB Gain-bandwidth product Slew rate CMRR V 2 MHz 107 V/ms Input maximum voltage VDD + 0.13 Intput minimum voltage –55 mV V mV Input offset voltage 40 Common-mode rejection ratio 90 dB Supply current 0.4 mA Input noise voltage f = 0.01 Hz to 1 Hz 1.1 f = 0.1 Hz to 10 Hz 1.7 nV/√(Hz) Non-Chopping Configuration, Register APCFG = 0x07, OPAMPMC = 0x00, OPAMPC = 0x01 Output maximum voltage VDD – 0.07 Output minimum voltage 0.07 V Open-loop gain 108 dB Gain-bandwidth product Slew rate CMRR V 2 MHz 107 V/ms Input maximum voltage VDD + 0.13 Intput minimum voltage –55 mV Input offset voltage 0.8 mV Common-mode rejection ratio 90 dB Supply current 0.4 mA Input noise voltage f = 0.01 Hz to 1 Hz 60 f = 0.1 Hz to 10 Hz 65 V nV/√(Hz) COMPARATOR CHARACTERISTICS TA = 25°C, VDD = 3 V. All measurement results are obtained using the CC2540 reference designs, post-calibration. PARAMETER TEST CONDITIONS MIN TYP MAX Common-mode maximum voltage VDD Common-mode minimum voltage –0.3 Input offset voltage Offset vs temperature Offset vs operating voltage UNIT V 1 mV 16 µV/°C 4 mV/V Supply current 230 nA Hysteresis 0.15 mV Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 ADC CHARACTERISTICS TA = 25°C and VDD = 3 V PARAMETER Input voltage ENOB (1) 0 VDD V VDD V Input resistance, signal Simulated using 4-MHz clock speed 197 kΩ Full-scale signal (1) Peak-to-peak, defines 0 dBFS 2.97 V Effective number of bits Single-ended input, 7-bit setting 5.7 Single-ended input, 9-bit setting 7.5 Single-ended input, 10-bit setting 9.3 Single-ended input, 12-bit setting 10.3 Differential input, 7-bit setting 6.5 Differential input, 9-bit setting 8.3 Differential input, 10-bit setting 10 Differential input, 12-bit setting 11.5 10-bit setting, clocked by RCOSC 9.7 12-bit setting, clocked by RCOSC 10.9 bits 7-bit setting, both single and differential 0–20 Single ended input, 12-bit setting, –6 dBFS (1) –75.2 Differential input, 12-bit setting, –6 dBFS (1) –86.6 Single-ended input, 12-bit setting (1) 70.2 Differential input, 12-bit setting (1) 79.3 Single-ended input, 12-bit setting, –6 dBFS (1) 78.8 Differential input, 12-bit setting, –6 dBFS (1) 88.9 Common-mode rejection ratio Differential input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution >84 dB Crosstalk Single ended input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution >84 dB Offset Midscale –3 mV Total harmonic distortion Differential nonlinearity Signal-to-noise-and-distortion kHz dB dB 0.68% 12-bit setting, mean (1) 0.05 12-bit setting, maximum (1) 0.9 13.3 12-bit setting, mean, clocked by RCOSC 10 LSB 29 Single ended input, 7-bit setting (1) 35.4 Single ended input, 9-bit setting (1) 46.8 Single ended input, 10-bit setting (1) 57.5 Single ended input, 12-bit setting (1) 66.6 (1) 40.7 Differential input, 9-bit setting (1) 51.6 Differential input, 10-bit setting (1) 61.8 Differential input, 12-bit setting (1) 70.8 Differential input, 7-bit setting LSB 4.6 12-bit setting, maximum (1) 12-bit setting, max, clocked by RCOSC (1) V 0 Integral nonlinearity SINAD (–THD+N) UNIT VDD VDD is voltage on AVDD5 pin 12-bit setting, mean (1) INL MAX VDD is voltage on AVDD5 pin Gain error DNL TYP 0 External reference voltage Signal to nonharmonic ratio CMRR MIN External reference voltage differential Useful power bandwidth THD TEST CONDITIONS VDD is voltage on AVDD5 pin dB Measured with 300-Hz sine-wave input and VDD as reference. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 ADC CHARACTERISTICS (continued) TA = 25°C and VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP 7-bit setting Conversion time MAX UNIT 20 9-bit setting 36 10-bit setting 68 12-bit setting 132 Power consumption ms 1.2 Internal reference VDD coefficient mA 4 Internal reference temperature coefficient Internal reference voltage mV/V 0.4 mV/10°C 1.15 V CONTROL INPUT AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.6 V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 32 MHz System clock, fSYSCLK tSYSCLK = 1/ fSYSCLK The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. 16 RESET_N low duration See item 1, Figure 1. This is the shortest pulse that is recognized as a complete reset pin request. Note that shorter pulses may be recognized but do not lead to complete reset of all modules within the chip. 1 µs Interrupt pulse duration See item 2, Figure 1.This is the shortest pulse that is recognized as an interrupt request. 20 ns RESET_N 1 2 Px.n T0299-01 Figure 1. Control Input AC Characteristics Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 SPI AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER t1 TEST CONDITIONS SCK period SCK duty cycle MIN Master, RX and TX 250 Slave, RX and TX 250 Master TYP MAX UNIT ns 50% Master 63 Slave 63 t2 SSN low to SCK t3 SCK to SSN high t4 MOSI early out Master, load = 10 pF t5 MOSI late out Master, load = 10 pF t6 MISO setup Master 90 ns t7 MISO hold Master 10 ns Master 63 Slave 63 SCK duty cycle Slave t10 MOSI setup Slave 35 t11 MOSI hold Slave 10 t9 MISO late out Slave, load = 10 pF Operating frequency ns ns 7 ns 10 ns 50% ns ns ns 95 Master, TX only 8 Master, RX and TX 4 Slave, RX only 8 Slave, RX and TX 4 ns MHz SCK t2 t3 SSN t4 D0 MOSI t6 MISO X t5 X D1 t7 D0 X T0478-01 Figure 2. SPI Master AC Characteristics Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 SCK t2 t3 SSN t8 D0 MISO X t10 MOSI X t9 D1 t11 D0 X T0479-01 Figure 3. SPI Slave AC Characteristics Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 DEBUG INTERFACE AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V PARAMETER fclk_dbg TEST CONDITIONS MIN TYP MAX UNIT 12 MHz Debug clock frequency (see Figure 4) t1 Allowed high pulse on clock (see Figure 4) 35 ns t2 Allowed low pulse on clock (see Figure 4) 35 ns t3 EXT_RESET_N low to first falling edge on debug clock (see Figure 6) 167 ns t4 Falling edge on clock to EXT_RESET_N high (see Figure 6) 83 ns t5 EXT_RESET_N high to first debug command (see Figure 6) 83 ns ns t6 Debug data setup (see Figure 5) 2 t7 Debug data hold (see Figure 5) 4 t8 Clock-to-data delay (see Figure 5) ns Load = 10 pF 30 ns Time DEBUG_ CLK P2_2 t1 t2 1/fclk_dbg T0436-01 Figure 4. Debug Clock – Basic Timing Time DEBUG_ CLK P2_2 RESET_N t3 t4 t5 T0437-01 Figure 5. Debug Enable Timing Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 Time DEBUG_ CLK P2_2 DEBUG_DATA (to CC2540) P2_1 DEBUG_DATA (from CC2540) P2_1 t6 t8 t7 T0438-02 Figure 6. Data Setup and Hold Timing TIMER INPUTS AC CHARACTERISTICS TA = –40°C to 85°C, VDD = 2 V to 3.6 V PARAMETER Input capture pulse duration TEST CONDITIONS Synchronizers determine the shortest input pulse that can be recognized. The synchronizers operate at the current system clock rate (16 MHz or 32 MHz). Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 MIN 1.5 TYP MAX UNIT tSYSCLK http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 DC CHARACTERISTICS TA = 25°C, VDD = 3 V PARAMETER TEST CONDITIONS MIN TYP Logic-0 input voltage Logic-1 input voltage MAX V 50 nA 2.5 Logic-0 input current Input equals 0 V –50 Logic-1 input current Input equals VDD –50 I/O-pin pullup and pulldown resistors V 50 20 Logic-0 output voltage, 4- mA pins Output load 4 mA Logic-1 output voltage, 4-mA pins Output load 4 mA Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 nA kΩ 0.5 2.4 UNIT 0.5 V V http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 DEVICE INFORMATION PIN DESCRIPTIONS The CC2540 pinout is shown in Figure 7 and a short description of the pins follows. DVDD1 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3 / XOSC32K_Q2 P2_4 / XOSC32K_Q1 40 39 38 37 36 35 34 33 32 AVDD6 DCOUPL CC2540 RHA Package (Top View) 31 30 R_BIAS 2 29 AVDD4 3 28 AVDD1 DVDD_USB 4 27 AVDD2 P1_5 5 26 RF_N P1_4 6 25 RF_P P1_3 7 24 AVDD3 P1_2 8 23 XOSC_Q2 P1_1 9 22 XOSC_Q1 12 13 14 15 16 17 18 19 P0_3 P0_2 P0_1 P0_0 21 20 AVDD5 RESET_N 10 11 P0_4 DVDD2 AGND Ground Pad P0_5 USB_N P0_6 USB_P P1_0 1 P0_7 DGND_USB P0076-05 NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip. Figure 7. Pinout Top View Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 PIN DESCRIPTIONS PIN NAME PIN PIN TYPE DESCRIPTION AVDD1 28 Power (analog) 2-V–3.6-V analog power-supply connection AVDD2 27 Power (analog) 2-V–3.6-V analog power-supply connection AVDD3 24 Power (analog) 2-V–3.6-V analog power-supply connection AVDD4 29 Power (analog) 2-V–3.6-V analog power-supply connection AVDD5 21 Power (analog) 2-V–3.6-V analog power-supply connection AVDD6 31 Power (analog) 2-V–3.6-V analog power-supply connection DCOUPL 40 Power (digital) 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. DGND_USB 1 Ground pin Connect to GND DVDD_USB 4 Power (digital) 2-V–3.6-V digital power-supply connection DVDD1 39 Power (digital) 2-V–3.6-V digital power-supply connection DVDD2 10 Power (digital) 2-V–3.6-V digital power-supply connection GND — Ground The ground pad must be connected to a solid ground plane. P0_0 19 Digital I/O Port 0.0 P0_1 18 Digital I/O Port 0.1 P0_2 17 Digital I/O Port 0.2 P0_3 16 Digital I/O Port 0.3 P0_4 15 Digital I/O Port 0.4 P0_5 14 Digital I/O Port 0.5 P0_6 13 Digital I/O Port 0.6 P0_7 12 Digital I/O Port 0.7 P1_0 11 Digital I/O Port 1.0 – 20-mA drive capability P1_1 9 Digital I/O Port 1.1 – 20-mA drive capability P1_2 8 Digital I/O Port 1.2 P1_3 7 Digital I/O Port 1.3 P1_4 6 Digital I/O Port 1.4 P1_5 5 Digital I/O Port 1.5 P1_6 38 Digital I/O Port 1.6 P1_7 37 Digital I/O Port 1.7 P2_0 36 Digital I/O Port 2.0 P2_1 35 Digital I/O Port 2.1 P2_2 34 Digital I/O Port 2.2 P2_3/ XOSC32K_Q2 33 Digital I/O, Analog I/O Port 2.3/32.768 kHz XOSC P2_4/ XOSC32K_Q1 32 Digital I/O, Analog I/O Port 2.4/32.768 kHz XOSC RBIAS 30 Analog I/O External precision bias resistor for reference current RESET_N 20 Digital input Reset, active-low RF_N 26 RF I/O Negative RF input signal to LNA during RX Negative RF output signal from PA during TX RF_P 25 RF I/O Positive RF input signal to LNA during RX Positive RF output signal from PA during TX USB_N 3 Digital I/O USB N USB_P 2 Digital I/O USB P XOSC_Q1 22 Analog I/O 32-MHz crystal oscillator pin 1 or external-clock input XOSC_Q2 23 Analog I/O 32-MHz crystal oscillator pin 2 Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 BLOCK DIAGRAM A block diagram of the CC2540 is shown in Figure 8. The modules can be roughly divided into one of three categories: CPU-related modules; modules related to power, test, and clock distribution; and radio-related modules. In the following subsections, a short description of each module is given. XOSC_Q2 32-MHz CRYSTAL OSC XOSC_Q1 P2_4 32.768-kHz CRYSTAL OSC P2_3 P2_2 HIGHSPEED RC-OSC DEBUG INTERFACE P2_1 DCOUPL POWER-ON RESET BROWN OUT CLOCK MUX and CALIBRATION SFR Bus RESET VDD (2 V–3.6 V) ON-CHIP VOLTAGE REGULATOR WATCHDOG TIMER RESET_N SLEEP TIMER 32-kHz RC-OSC POWER MANAGEMENT CONTROLLER P2_0 PDATA P1_7 P1_6 XRAM 8051 CPU CORE P1_5 IRAM P1_4 SFR RAM SRAM FLASH FLASH MEMORY ARBITRATOR P1_3 P1_2 DMA P1_1 UNIFIED P1_0 IRQ CTRL FLASH CTRL P0_7 P0_6 1 KB SRAM FIFOCTRL ANALOG COMPARATOR P0_5 Radio Arbiter P0_4 OP-AMP P0_2 AES ENCRYPTION AND DECRYPTION DS ADC AUDIO/DC RADIO REGISTERS Link Layer Engine SFR Bus P0_0 I/O CONTROLLER P0_1 SRAM DEMODULATOR SYNTH P0_3 MODULATOR USB_N USB_P USB RECEIVE USART 1 FREQUENCY SYNTHESIZER USART 0 TRANSMIT TIMER 1 (16-Bit) TIMER 2 (BLE LL TIMER) RF_P RF_N TIMER 3 (8-Bit) DIGITAL ANALOG TIMER 4 (8-Bit) MIXED B0301-05 Figure 8. CC2540 Block Diagram Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 BLOCK DESCRIPTIONS CPU and Memory The 8051 CPU core is a single-cycle 8051-compatible core. It has three different memory access busses (SFR, DATA, and CODE/XDATA), a debug interface, and an 18-input extended interrupt unit. The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory-access points, access of which can map to one of three physical memories: an SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The SFR bus is drawn conceptually in Figure 8 as a common bus that connects all hardware peripherals to the memory arbiter. The SFR bus in the block diagram also provides access to the radio registers in the radio register bank, even though these are indeed mapped into XDATA memory space. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes 2 and 3). The 128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. Peripherals Writing to the flash block is performed through a flash controller that allows page-wise erasure and 4-bytewise programming. See User Guide for details on the flash controller. A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors that can be located anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface, etc.) can be used with the DMA controller for efficient operation by performing data transfers between a single SFR or XREG address and flash/SRAM. Each CC2540 contains a unique 48-bit IEEE address that can be used as the public device address for a Bluetooth device. Designers are free to use this address, or provide their own, as described in the Bluetooth specfication. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. I/O and sleep timer interrupt requests are serviced even if the device is in a sleep mode (power modes 1 and 2) by bringing the CC2540 back to the active mode. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to erase or program the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in-circuit debugging and external flash programming elegantly. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications. The sleep timer is an ultralow-power timer that can either use an external 32.768-kHz crystal oscillator or an internal 32.753-kHz RC oscillator. The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-time counter or as a wake-up timer to get out of power modes 1 or 2. A built-in watchdog timer allows the CC2540 to reset itself if the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR generation mode, where it counts timer 3 periods and the output is ANDed with the output of timer 3 to generate modulated consumer IR signals with minimal CPU interaction. Timer 2 is a 40-bit timer used by the Bluetooth low energy stack. It has a 16-bit counter with a configurable timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends. There are two 16-bit timer-compare registers and two 24-bit overflow-compare registers that can be used to give exact timing for start of RX or TX to the radio or general interrupts. Timer 3 and timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as PWM output. USART 0 and USART 1 are each configurable as either an SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each USART has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. When configured as SPI slaves, the USARTs sample the input signal using SCK directly instead of using some oversampling scheme, and are thus well-suited for high data rates. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The AES core also supports ECB, CBC, CFB, OFB, CTR, and CBC-MAC, as well as hardware support for CCM. The ADC supports 7 to 12 bits of resolution with a corresponding range of bandwidths from 30-kHz to 4-kHz, respectively. DC and audio conversions with up to eight input channels (I/O controller pins) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversion over a sequence of channels. The operational amplifier is intended to provide front-end buffering and gain for the ADC. Both inputs as well as the output are available on pins, so the feedback network is fully customizable. A chopper-stabilized mode is available for applications that need good accuracy with high gain. The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator output is connected to the I/O controller interrupt detector and can be treated by the MCU as a regular I/O pin interrupt. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 TYPICAL CHARACTERISTICS RX CURRENT IN WAIT FOR SYNC vs TEMPERATURE TX CURRENT vs TEMPERATURE 32.5 20.5 32 Current (mA) 20 Current (mA) TX Power Setting = 4 dBm VCC = 3 V Gain = Standard Setting Input = -70 dBm VCC = 3 V 19.5 31.5 31 19 18.5 -40 -20 0 20 40 Temperature (°C) 60 30.5 -40 80 -20 0 G001 20 40 Temperature (°C) Figure 9. Figure 10. RX SENSITIVITY vs TEMPERATURE TX POWER vs TEMPERATURE 60 80 G002 7 -83 Gain = Standard Setting VCC = 3 V -84 TX Power Setting = 4 dBm VCC = 3 V 6 -85 5 Level (dBm) Level (dBm) -86 -87 -88 -89 4 3 2 -90 1 -91 -92 -40 -20 0 20 40 Temperature (°C) 60 0 -40 80 0 20 40 Temperature (°C) Figure 11. Figure 12. RX CURRENT IN WAIT FOR SYNC vs SUPPLY VOLTAGE TX CURRENT vs SUPPLY VOLTAGE 19.7 60 80 G004 32 Gain = Standard Setting Input = -70 dBm T A = 25°C 19.68 19.66 T A = 25°C TX Power Setting = 4 dBm 31.9 31.8 19.64 31.7 Current (mA) Current (mA) -20 G003 19.62 19.6 19.58 31.6 31.5 31.4 19.56 31.3 19.54 31.2 19.52 31.1 19.5 31 2 2.2 2.4 2.6 2.8 3 Supply Voltage (V) Figure 13. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 3.2 3.4 3.6 G005 2 2.2 2.4 2.6 2.8 3 Supply Voltage (V) 3.2 3.4 3.6 G006 Figure 14. http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 TYPICAL CHARACTERISTICS (continued) RX SENSITIVITY vs SUPPLY VOLTAGE TX POWER vs SUPPLY VOLTAGE 5 -87 Gain = Standard Setting T A = 25°C -87.4 4.6 -87.6 4.4 -87.8 -88 -88.2 4.2 4 3.8 -88.4 3.6 -88.6 3.4 -88.8 3.2 3 -89 2 2.2 2.4 2.6 2.8 3 Supply Voltage (V) 3.2 3.4 2 3.6 -87.4 2.4 2.6 2.8 3 Supply Voltage (V) 3.2 3.4 3.6 Figure 15. Figure 16. RX SENSITIVITY vs FREQUENCY RX INTERFERER REJECTION (SELECTIVITY) vs INTERFERER FREQUENCY G008 60 Gain = Standard Setting T A = 25°C VCC = 3 V 50 40 Rejection (dB) -87.6 Level (dBm) 2.2 G007 -87 -87.2 T A = 25°C TX Power Setting = 4 dBm 4.8 Level (dBm) Level (dBm) -87.2 -87.8 -88 -88.2 30 20 -88.4 Gain = Standard Setting T A = 25°C VCC = 3 V Wanted Signal at 2426 MHz with -67 dBm Level 10 -88.6 0 -88.8 -89 2400 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz) -10 2400 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz) G009 Figure 17. G010 Figure 18. TX POWER vs FREQUENCY 5 4.8 4.6 T A = 25°C TX Power Setting = 4 dBm VCC = 3 V Level (dBm) 4.4 4.2 4 3.8 3.6 3.4 3.2 3 2400 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz) G011 Figure 19. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 TYPICAL CHARACTERISTICS (continued) Table 1. Output Power and Current Consumption (1) (2) (1) (2) Typical Output Power (dBm) Typical Current Consumption (mA) 4 32 0 27 –6 24 –23 21 Measured on Texas Instruments CC2540 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz. The transmitter output power setting is programmable using a TI BLE stack vendor-specific API command. The default value is 0 dBm. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 APPLICATION INFORMATION Few external components are required for the operation of the CC2540. A typical application circuit is shown in Figure 20. Optional 32-kHz Crystal (1) C331 2-V to 3.6-V Power Supply XTAL2 C401 2 USB_P 3 USB_N 4 DVDD_USB 5 P1_5 6 P1_4 8 P1_2 9 P2_2 34 P2_1 35 P2_0 36 P1_7 37 P1_6 38 AVDD6 31 R301 RBIAS 30 L251 AVDD4 29 AVDD1 28 C251 Antenna (50 W) C252 AVDD2 27 L252 RF_N 26 L253 CC2540 RF_P 25 DIE ATTACH PAD C261 L261 AVDD3 24 XOSC_Q2 23 C262 C253 XOSC_Q1 22 P1_1 19 P0_0 17 P0_2 18 P0_1 16 P0_3 15 P0_4 14 P0_5 13 P0_6 12 P0_7 11 P1_0 10 DVDD2 20 RESET_N 7 P1_3 P2_4/XOSC32K_Q1 32 DGND_USB P2_3/XOSC32K_Q2 33 1 DVDD1 39 DCOUPL 40 C321 AVDD5 21 XTAL1 Power Supply Decoupling Capacitors are Not Shown Digital I/O Not Connected C221 C231 S0383-03 (1) 32-kHz crystal is mandatory when running the chip in low-power modes, except if the link layer is in the standby state (Vol. 6 Part B Section 1.1 in [1]). NOTE: Different antenna alternatives will be provided as reference designs. Figure 20. CC2540 Application Circuit Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) Component Description Value C221 32-MHz xtal loading capacitor 12 pF C231 32-MHz xtal loading capacitor 12 pF C251 Part of the RF matching network 18 pF C252 Part of the RF matching network 1 pF C253 Part of the RF matching network 1 pF C261 Part of the RF matching network 18 pF C262 Part of the RF matching network 1 pF C321 32-kHz xtal loading capacitor 15 pF C331 32-kHz xtal loading capacitor 15 pF C401 Decoupling capacitor for the internal digital regulator 1 µF Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued) Component Description Value L251 Part of the RF matching network 2 nH L252 Part of the RF matching network 1 nH L253 Part of the RF matching network 3 nH L261 Part of the RF matching network 2 nH R301 Resistor used for internal biasing 56 kΩ Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252. Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See 32-MHz CRYSTAL OSCILLATOR for details. The load capacitance seen by the 32-MHz crystal is given by: 1 CL = + Cparasitic 1 1 + C221 C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by: 1 CL = + Cparasitic 1 1 + C321 C331 (2) A series resistor may be used to comply with the ESR requirement. On-Chip 1.8-V Voltage Regulator Decoupling The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation. Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely. References 1. Bluetooth® Core Technical Specification document, version 4.0 http://www.bluetooth.com/SiteCollectionDocuments/Core_V40.zip 2. CC253x System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee® Applications/CC2540 System-on-Chip Solution for 2.4-GHz Bluetooth low energy Applications (SWRU191) Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands. Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy! The following subsections point to where to find more information. Texas Instruments Low-Power RF Web Site • • • Forums, videos, and blogs RF design help E2E interaction Join us today at www.ti.com/lprf-forum. Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: • RF circuit, low-power RF, and ZigBee® design services • Low-power RF and ZigBee module solutions and development tools • RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools? Search the Low-Power RF Developer Network tool to find a suitable partner. www.ti.com/lprfnetwork Low-Power RF eNewsletter The Low-Power RF eNewsletter keeps you up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up today on www.ti.com/lprfnewsletter Shenzhen RF-star Technology Co.,Ltd. TEL: 0755-86329829 FAX:0755-86329413 http://www.szrfstar.com PACKAGE OPTION ADDENDUM www.ti.com 11-Oct-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CC2540F128RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples CC2540F128RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples CC2540F256RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Request Free Samples CC2540F256RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC2540F128RHAR VQFN RHA 40 CC2540F128RHAT VQFN RHA CC2540F256RHAR VQFN RHA SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2540F128RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC2540F128RHAT VQFN RHA 40 250 333.2 345.9 28.6 CC2540F256RHAR VQFN RHA 40 2500 333.2 345.9 28.6 Pack Materials-Page 2 WISDOM FUTURE WIRELESS WORLD 智慧未来 无线世界 重要声明 德州仪器(TI) 及其下属子公司有权在不事先通知的情况下, 随时对所提供的产品和服务进行更正、修改、增强、改进或其它更改, 并有权随时中止提供任何产品和服务。客户在下订单前应获取最新的相关信息 , 并验证这些信息是否完整且是最新的。所有产品的 销售都遵循在订单确认时所提供的TI 销售条款与条件。 TI 保证其所销售的硬件产品的性能符合TI 标准保修的适用规范。仅在TI 保证的范围内 , 且TI 认为有必要时才会使用测试或其它质 量控制技术。除非政府做出了硬性规定 , 否则没有必要对每种产品的所有参数进行测试。 TI 对应用帮助或客户产品设计不承担任何义务。客户应对其使用TI 组件的产品和应用自行负责。为尽量减小与客户产品和应用相关 的风险,客户应提供充分的设计与操作安全措施。 TI 不对任何TI 专利权、版权、屏蔽作品权或其它与使用了TI 产品或服务的组合设备、机器、流程相关的TI 知识产权中授予的直接 或隐含权限作出任何保证或解释。TI 所发布的与第三方产品或服务有关的信息,不能构成从TI 获得使用这些产品或服务的许可、授 权、或认可。使用此类信息可能需要获得第三方的专利权或其它知识产权方面的许可,或是TI 的专利权或其它知识产权方面的许可。 对于TI 的产品手册或数据表,仅在没有对内容进行任何篡改且带有相关授权、条件、限制和声明的情况下才允许进行复制。在复制 信息的过程中对内容的篡改属于非法的、欺诈性商业行为。TI 对此类篡改过的文件不承担任何责任。 在转售TI 产品或服务时,如果存在对产品或服务参数的虚假陈述,则会失去相关TI 产品或服务的明示或暗示授权,且这是非法的、 欺诈性商业行为。TI 对此类虚假陈述不承担任何责任。 TI 产品未获得用于关键的安全应用中的授权,例如生命支持应用(在该类应用中一旦TI 产品故障将预计造成重大的人员伤亡),除 非各方官员已经达成了专门管控此类使用的协议。购买者的购买行为即表示,他们具备有关其应用安全以及规章衍生所需的所有专业 技术和知识,并且认可和同意,尽管任何应用相关信息或支持仍可能由TI 提供,但他们将独力负责满足在关键安全应用中使用其产 品及TI 产品所需的所有法律、法规和安全相关要求。此外,购买者必须全额赔偿因在此类关键安全应用中使用TI 产品而对TI 及其 代表造成的损失。 TI 产品并非设计或专门用于军事/航空应用,以及环境方面的产品,除非TI 特别注明该产品属于“军用”或“增强型塑料”产品。只 有TI 指定的军用产品才满足军用规格。购买者认可并同意,对TI 未指定军用的产品进行军事方面的应用,风险由购买者单独承担, 并且独力负责在此类相关使用中满足所有法律和法规要求。 TI 产品并非设计或专门用于汽车应用以及环境方面的产品,除非TI 特别注明该产品符合ISO/TS 16949 要求。购买者认可并同意, 如果他们在汽车应用中使用任何未被指定的产品,TI 对未能满足应用所需要求不承担任何责任。 可访问以下URL 地址以获取有关其它TI 产品和应用解决方案的信息: 产品 应用 数字音频 www.ti.com.cn/audio 通信与电信 www.ti.com.cn/telecom 放大器和线性器件 www.ti.com.cn/amplifiers 计算机及周边 www.ti.com.cn/computer 数据转换器 www.ti.com.cn/dataconverters 消费电子 www.ti.com/consumer-apps DLP® 产品 www.dlp.com 能源 www.ti.com/energy DSP - 数字信号处理器 www.ti.com.cn/dsp 工业应用 www.ti.com.cn/industrial 时钟和计时器 www.ti.com.cn/clockandtimers 医疗电子 www.ti.com.cn/medical 接口 www.ti.com.cn/interface 安防应用 www.ti.com.cn/security 逻辑 www.ti.com.cn/logic 汽车电子 www.ti.com.cn/automotive 电源管理 www.ti.com.cn/power 视频和影像 www.ti.com.cn/video 微控制器 (MCU) www.ti.com.cn/microcontrollers RFID 系统 www.ti.com.cn/rfidsys www.deyisupport.com IMPORTANT NOTICE OMAP 机动性处理器 www.ti.com/omap 无线连通性 www.ti.com.cn/wirelessconnectivity 德州仪器在线技术支持社区 邮寄地址: 上海市浦东新区世纪大道 1568 号,中建大厦 32 楼 邮政编码: 200122 Copyright © 2012 德州仪器 半导体技术(上海)有限公司 Shenzhen RF-star Technology Co.,Ltd. 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