CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications FEATURES 1 • RF/Layout – 2.4-GHz IEEE 802.15.4 Compliant RF Transceiver – Excellent Receiver Sensitivity and Robustness to Interference – Programmable Output Power Up to 4.5 dBm – Very Few External Components – Only a Single Crystal Needed for Mesh Network Systems – 6-mm × 6-mm QFN40 Package – Suitable for Systems Targeting Compliance With Worldwide Radio-Frequency Regulations: ETSI EN 300 328 and EN 300 440 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T-66 (Japan) • Low Power – Active-Mode RX (CPU Idle): 24 mA – Active Mode TX at 1 dBm (CPU Idle): 29 mA – Power Mode 1 (4 µs Wake-Up): 0.2 mA – Power Mode 2 (Sleep Timer Running): 1 µA – Power Mode 3 (External Interrupts): 0.4 µA – Wide Supply-Voltage Range (2 V–3.6 V) • Microcontroller – High-Performance and Low-Power 8051 Microcontroller Core With Code Prefetch – 32-, 64-, 128-, or 256-KB In-System-Programmable Flash – 8-KB RAM With Retention in All Power Modes – Hardware Debug Support 2345 • • – Accurate Digital RSSI/LQI Support – Battery Monitor and Temperature Sensor – 12-Bit ADC With Eight Channels and Configurable Resolution – AES Security Coprocessor – Two Powerful USARTs With Support for Several Serial Protocols – 21 General-Purpose I/O Pins (19× 4 mA, 2× 20 mA) – Watchdog Timer Development Tools – CC2530 Development Kit – CC2530 ZigBee® Development Kit – CC2530 RemoTI™ Development Kit for RF4CE – SmartRF™ Software – Packet Sniffer – IAR Embedded Workbench™ Available APPLICATIONS • • • • • • • • • 2.4-GHz IEEE 802.15.4 Systems RF4CE Remote Control Systems (64-KB Flash and Higher) ZigBee Systems (256-KB Flash) Home/Building Automation Lighting Systems Industrial Control and Monitoring Low-Power Wireless Sensor Networks Consumer Electronics Health Care Peripherals – Powerful Five-Channel DMA – IEEE 802.15.4 MAC Timer, General-Purpose Timers (One 16-Bit, Two 8-Bit) – IR Generation Circuitry – 32-kHz Sleep Timer With Capture – CSMA/CA Hardware Support 1 2 3 4 5 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. RemoTI, SmartRF, Z-Stack are trademarks of Texas Instruments. IAR Embedded Workbench is a trademark of IAR Systems AB. ZigBee is a registered trademark of the ZigBee Alliance. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com DESCRIPTION The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has various operating modes, making it highly suited for systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. Combined with the industry-leading and golden-unit-status ZigBee protocol stack (Z-Stack™) from Texas Instruments, the CC2530F256 provides a robust and complete ZigBee solution. Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide a robust and complete ZigBee RF4CE remote-control solution. DIGITAL VDD (2 V–3.6 V) RESET WATCHDOG TIMER ON-CHIP VOLTAGE REGULATOR 32-MHz CRYSTAL OSC HIGH-SPEED RC-OSC POWER ON RESET BROWN OUT 32.768-kHz CRYSTAL OSC 32-kHz RC-OSC SLEEP TIMER DEBUG INTERFACE CLOCK MUX and CALIBRATION SLEEP MODE CONTROLLER DCOUPL ANALOG MIXED RESET_N XOSC_Q2 XOSC_Q1 P2_4 32/64/128/256-KB FLASH P2_3 P2_2 8051 CPU CORE DMA P2_1 MEMORY ARBITRATOR P2_0 8-KB SRAM P1_5 P1_4 P1_3 P1_2 IRQ CTRL ADC AUDIO/DC 8 CHANNELS AES ENCRYPTION AND DECRYPTION P1_1 FLASH WRITE RADIO REGISTERS CSMA/CA STROBE PROCESSOR P1_0 P0_7 USART 1 RADIO DATA INTERFACE P0_6 P0_5 USART 2 P0_4 DEMODULATOR AGC MODULATOR P0_3 TIMER 1 (16-Bit) P0_2 P0_1 TIMER 3 (8-Bit) TIMER 4 (8-Bit) RECEIVE CHAIN FREQUENCY SYNTHESIZER TIMER 2 (IEEE 802.15.4 MAC TIMER) P0_0 RF_P FIFO and FRAME CONTROL P1_6 I/O CONTROLLER P1_7 TRANSMIT CHAIN RF_N B0300-02 2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) MIN Supply voltage All supply pins must have the same voltage MAX –0.3 3.9 V –0.3 VDD + 0.3, ≤ 3.9 V 10 dBm –40 125 °C All pads, according to human-body model, JEDEC STD 22, method A114 2 kV According to charged-device model, JEDEC STD 22, method C101 500 V Voltage on any digital pin Input RF level Storage temperature range ESD (2) (1) (2) UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT –40 125 °C 2 3.6 V Operating ambient temperature range, TA Operating supply voltage ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER Icore TEST CONDITIONS Core current consumption MIN Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. Medium CPU activity: normal flash access (1), no RAM access 3.4 32-MHz XOSC running. No radio or peripherals active. Medium CPU activity: normal flash access (1), no RAM access 6.5 mA 8.9 mA 32-MHz XOSC running, radio in RX mode, –50-dBm input power, no peripherals active, CPU idle 20.5 32-MHz XOSC running, radio in RX mode at -100-dBm input power (waiting for signal), no peripherals active, CPU idle 24.3 32-MHz XOSC running, radio in TX mode, 1-dBm output power, no peripherals active, CPU idle 28.7 32-MHz XOSC running, radio in TX mode, 4.5-dBm output power, no peripherals active, CPU idle 33.5 39.6 mA 0.2 0.3 mA Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention 1 2 µA Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention 0.4 1 µA Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention (1) TYP MAX UNIT mA 29.6 mA mA Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 3 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (continued) Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) Iperi Timer 1 Timer running, 32-MHz XOSC used 90 µA Timer 2 Timer running, 32-MHz XOSC used 90 µA Timer 3 Timer running, 32-MHz XOSC used 60 µA Timer 4 Timer running, 32-MHz XOSC used 70 µA Sleep timer Including 32.753-kHz RCOSC 0.6 µA ADC When converting 1.2 mA Erase 1 mA Burst write peak current 6 mA Flash 4 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 GENERAL CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKE-UP AND TIMING Power mode 1 → active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 µs Power mode 2 or 3 → active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC 0.1 ms Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF 0.5 ms Active → TX or RX With 32-MHz XOSC initially on RX/TX and TX/RX turnaround 192 µs 192 µs 2507 MHz RADIO PART RF frequency range Programmable in 1-MHz steps, 5 MHz between channels for compliance with [1] Radio baud rate As defined by [1] 250 Radio chip rate As defined by [1] 2 2394 kbps MChip/s RF RECEIVE SECTION Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity PER = 1%, as specified by [1] [1] requires –85 dBm Saturation (maximum input level) PER = 1%, as specified by [1] [1] requires –20 dBm 10 dBm Adjacent-channel rejection, 5-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at 5 MHz, PER = 1 %, as specified by [1]. [1] requires 0 dB 49 dB Adjacent-channel rejection, –5-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –5 MHz, PER = 1 %, as specified by [1]. [1] requires 0 dB 49 dB Alternate-channel rejection, 10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at 10 MHz, PER = 1%, as specified by [1] [1] requires 30 dB 57 dB Alternate-channel rejection, –10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –10 MHz, PER = 1 %, as specified by [1] [1] requires 30 dB 57 dB Channel rejection ≥ 20 MHz ≤ –20 MHz Wanted signal at –82 dBm. Undesired signal is an IEEE 802.15.4 modulated channel, stepped through all channels from 2405 to 2480 MHz. Signal level for PER = 1%. 57 57 dB Co-channel rejection Wanted signal at –82 dBm. Undesired signal is 802.15.4 modulated at the same frequency as the desired signal. Signal level for PER = 1%. –3 dB –97 –92 –88 dBm Blocking/desensitization 5 MHz from band edge 10 MHz from band edge 20 MHz from band edge 50 MHz from band edge –5 MHz from band edge –10 MHz from band edge –20 MHz from band edge –50 MHz from band edge Wanted signal 3 dB above the sensitivity level, CW jammer, PER = 1%. Measured according to EN 300 440 class 2. Copyright © 2009, Texas Instruments Incorporated –33 –33 –32 –31 –35 –35 –34 –34 Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 dBm 5 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com RF RECEIVE SECTION (continued) Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS MIN Spurious emission. Only largest spurious emission stated within each band. Conducted measurement with a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, 30 MHz–1000 MHz EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66. 1 GHz–12.75 GHz TYP MAX UNIT < –80 –57 dBm Frequency error tolerance (1) [1] requires minimum 80 ppm ±150 ppm Symbol rate error tolerance (2) [1] requires minimum 80 ppm ±1000 ppm (1) (2) Difference between center frequency of the received RF signal and local oscillator frequency. Difference between incoming symbol rate and the internally generated symbol rate RF TRANSMIT SECTION Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V and fc = 2394 MHz to 2507 MHz. PARAMETER Nominal output power TEST CONDITIONS Delivered to a single-ended 50-Ω load through a balun using maximum-recommended output-power setting [1] requires minimum –3 dBm MIN TYP MAX UNIT 0 –8 4.5 8 10 dBm Programmable output power range 32 Spurious emissions Max recommended output power setting (1) Measured conducted according to stated regulations. Only largest spurious emission stated within each band. 25 MHz–1000 MHz (outside restricted bands) 25 MHz–2400 MHz (within FCC restricted bands) 25 MHz–1000 MHz (within ETSI restricted bands) 1800–1900 MHz (ETSI restricted band) 5150–5300 MHz (ETSI restricted band) At 2 × fc and 3 × fc (FCC restricted band) At 2 × fc and 3 × fc (ETSI EN 300-440 and EN 300-328) (2) 1 GHz–12.75 GHz (outside restricted bands) At 2483.5 MHz and above (FCC restricted band) fc= 2480 MHz (3) –60 –60 –60 –57 –55 –42 –31 –53 Measured as defined by [1] using maximum-recommended output-power setting [1] requires maximum 35%. Optimum load impedance Differential impedance as seen from the RF port (RF_P and RF_N) towards the antenna (2) (3) 6 dBm –42 Error vector magnitude (EVM) (1) dB 2% 69 + j29 Ω Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66. Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground. Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower output-power setting or having less than 100% duty cycle. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 32-MHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX 32 Crystal frequency accuracy requirement (1) UNIT MHz –40 40 ppm ESR Equivalent series resistance 6 60 Ω C0 Crystal shunt capacitance 1 7 pF CL Crystal load capacitance 10 Start-up time Power-down guard time (1) 16 0.3 The crystal oscillator must be in power down for a guard time before it is used again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. pF ms 3 ms Including aging and temperature dependency, as specified by [1] 32.768-kHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX 32.768 Crystal frequency accuracy requirement (1) –40 UNIT kHz 40 ppm 130 Ω ESR Equivalent series resistance 40 C0 Crystal shunt capacitance 0.9 2 pF CL Crystal load capacitance 12 16 pF Start-up time 0.4 (1) s Including aging and temperature dependency, as specified by [1] 32-kHz RC OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Calibrated frequency (1) 32.753 Frequency accuracy after calibration ±0.2% Temperature coefficient (2) Supply-voltage coefficient (3) Calibration time (4) (1) (2) (3) (4) MAX UNIT kHz 0.4 %/°C 3 %/V 2 ms The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. Frequency drift when temperature changes after calibration Frequency drift when supply voltage changes after calibration When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is 0. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 7 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com 16-MHz RC OSCILLATOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Frequency (1) MAX Uncalibrated frequency accuracy ±18% Calibrated frequency accuracy ±0.6% MHz ±1% Start-up time µs 10 Initial calibration time (2) (1) (2) UNIT 16 µs 50 The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0. RSSI/CCA CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN RSSI range TYP MAX UNIT 100 dB Absolute uncalibrated RSSI/CCA accuracy ±4 dB RSSI/CCA offset (1) 73 dB 1 dB Step size (LSB value) (1) Real RSSI = Register value – offset FREQEST CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN FREQEST range TYP MAX UNIT ±250 kHz FREQEST accuracy ±40 kHz FREQEST offset (1) 20 kHz Step size (LSB value) 7.8 kHz (1) Real FREQEST = Register value – offset FREQUENCY SYNTHESIZER CHARACTERISTICS Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS Phase noise, unmodulated carrier MIN TYP At ±1-MHz offset from carrier –110 At ±2-MHz offset from carrier –117 At ±5-MHz offset from carrier –122 MAX UNIT dBc/Hz ANALOG TEMPERATURE SENSOR Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Output at 25°C 1480 Temperature coefficient Voltage coefficient Initial accuracy without calibration Accuracy using 1-point calibration (entire temperature range) Measured using integrated ADC using internal bandgap voltage reference and maximum resolution Current consumption when enabled (ADC current not included) 8 TYP Submit Documentation Feedback MAX UNIT 12-bit ADC 4.5 /10°C 1 /0.1 V ±10 °C ±5 °C 0.5 mA Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 ADC CHARACTERISTICS TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER ENOB (1) MIN TYP MAX Input voltage VDD is voltage on AVDD5 pin 0 VDD V External reference voltage VDD is voltage on AVDD5 pin 0 VDD V External reference voltage differential VDD is voltage on AVDD5 pin 0 Input resistance, signal Using 4-MHz clock speed 197 kΩ Full-scale signal (1) Peak-to-peak, defines 0 dBFS 2.97 V Effective number of bits Single-ended input, 7-bit setting 5.7 Single-ended input, 9-bit setting 7.5 Single-ended input, 10-bit setting 9.3 Single-ended input, 12-bit setting 10.8 Differential input, 7-bit setting 6.5 Differential input, 9-bit setting 8.3 Differential input, 10-bit setting 10.0 11.5 Single-ended input, 12-bit setting, –6 dBFS –75. 2 Differential input, 12-bit setting, –6 dBFS –86. 6 Single-ended input, 12-bit setting 70.2 Differential input, 12-bit setting 79.3 Single-ended input, 12-bit setting, –6 dBFS 78.8 Differential input, 12-bit setting, –6 dBFS 88.9 Common-mode rejection ratio Differential input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution >84 dB Crosstalk Single-ended input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution >84 dB Offset Midscale –3 mV 0.68 % Gain error DNL (1) Differential nonlinearity INL (1) Integral nonlinearity (1) Signal-to-noise-and-distortion Conversion time 12-bit setting, mean 0.05 12-bit setting, maximum 0.9 12-bit setting, mean 4.6 12-bit setting, maximum 13.3 Single-ended input, 7-bit setting 35.4 Single-ended input, 9-bit setting 46.8 Single-ended input, 10-bit setting 57.5 Single-ended input, 12-bit setting 66.6 Differential input, 7-bit setting 40.7 Differential input, 9-bit setting 51.6 Differential input, 10-bit setting 61.8 Differential input, 12-bit setting 70.8 7-bit setting 20 9-bit setting 36 10-bit setting 68 12-bit setting 132 Power consumption Internal reference voltage (1) bits 0–20 Signal to nonharmonic ratio (1) SINAD (–THD+N) V 7-bit setting, both single and differential Total harmonic distortion CMRR VDD UNIT Differential input, 12-bit setting Useful power bandwidth THD (1) TEST CONDITIONS kHz dB dB LSB LSB dB µs 1.2 mA 1.15 V Measured with 300-Hz sine-wave input and VDD as reference. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 9 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com ADC CHARACTERISTICS (continued) TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX Internal reference VDD coefficient 4 Internal reference temperature coefficient UNIT mV/V 0.4 mV/10°C CONTROL INPUT AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 32 MHz System clock, fSYSCLK tSYSCLK = 1/fSYSCLK The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. 16 RESET_N low duration See item 1, Figure 1. This is the shortest pulse that is recognized as a complete reset pin request. Note that shorter pulses may be recognized but might not lead to complete reset of all modules within the chip. 1 µs Interrupt pulse duration See item 2, Figure 1.This is the shortest pulse that is recognized as an interrupt request. 20 ns RESET_N 1 2 Px.n T0299-01 Figure 1. Control Input AC Characteristics 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 SPI AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER t1 TEST CONDITIONS MIN TYP MAX UNIT SCK period Master, Rx and Tx SCK duty cycle Master t2 SSN low to SCK Master 63 t3 SCK to SSN high Master 63 t4 MO early out Master, load = 10 pF t7 MO late out Master, load 10 = pF t6 MI setup Master 90 ns t5 MI hold Master 10 ns t1 SCK period Slave, Rx and Tx SCK duty cycle Slave t2 SSN low to SCK Slave 63 ns t3 SCK to SSN high Slave 63 ns t6 MO setup Slave 35 ns t5 MO hold Slave 10 t5 MI late out Slave, load = 10 pF Operating frequency 250 ns 50% ns ns 7 ns 10 ns 250 ns 50% ns 95 Master, Tx only 8 Master, Rx and Tx 4 Slave, Rx only 8 Slave, Rx and Tx 4 ns MHz t1 SCK t3 t2 SSN MO (Master Out, Slave In) t7 t4 MI (Master In, Slave Out) t5 t6 T0439-01 Figure 2. SPI AC Characteristics Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 11 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com DEBUG INTERFACE AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 12 MHz fclk_dbg Debug clock frequency (see Figure 3) t1 Allowed high pulse on clock (see Figure 3) 35 ns t2 Allowed low pulse on clock (see Figure 3) 35 ns t3 EXT_RESET_N low to first falling edge on debug clock (see Figure 4) 167 ns t4 Falling edge on clock to EXT_RESET_N high (see Figure 4) 83 ns t5 EXT_RESET_N high to first debug command (see Figure 4) 83 ns t6 Debug data setup (see Figure 5) 2 ns t7 Debug data hold (see Figure 5) 4 t8 Clock-to-data delay (see Figure 5) Load = 10 pF ns 30 ns Time DEBUG_ CLK P2_2 t1 t2 1/fclk_dbg T0436-01 Figure 3. Debug Clock – Basic Timing Time DEBUG_ CLK P2_2 RESET_N t3 t4 t5 T0437-01 Figure 4. Data Setup and Hold Timing 12 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 Time DEBUG_ CLK P2_2 DEBUG_DATA (to CC2530) P2_1 DEBUG_DATA (from CC2530) P2_1 t6 t8 t7 T0438-01 Figure 5. Debug Enable Timing TIMER INPUTS AC CHARACTERISTICS TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER Input capture pulse duration TEST CONDITIONS Synchronizers determine the shortest input pulse that can be recognized. The synchronizers operate at the current system clock rate (16 or 32 MHz). Copyright © 2009, Texas Instruments Incorporated MIN TYP MAX UNIT tSYSCLK 1.5 Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 13 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com DC CHARACTERISTICS TA = 25°C, VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX Logic-0 input voltage 0.5 Logic-1 input voltage 2.5 Input equals 0 V –50 50 Logic-1 input current Input equals VDD –50 50 20 Logic-0 output voltage, 4-mA pins Output load 4 mA Logic-1 output voltage, 4-mA pins Output load 4 mA Logic-0 output voltage, 20-mA pins Output load 20 mA Logic-1 output voltage, 20-mA pins Output load 20 mA V V Logic-0 input current I/O-pin pullup and pulldown resistors UNIT nA kΩ 0.5 2.4 V V 0.5 2.4 nA V V DEVICE INFORMATION PIN DESCRIPTIONS The CC2530 pinout is shown in Figure 6 and a short description of the pins follows. P1_7 P2_0 P2_1 P2_2 P2_3/XOSC32K_Q2 P2_4/XOSC32K_Q1 40 39 38 37 36 35 34 33 32 AVDD6 P1_6 1 DVDD1 GND DCOUPL CC2530 RHA Package (Top View) 31 30 RBIAS GND 2 29 AVDD4 GND 3 28 AVDD1 GND 4 27 AVDD2 P1_5 5 26 RF_N P1_4 6 GND Ground Pad RF_P 7 24 AVDD3 8 23 XOSC_Q2 22 XOSC_Q1 12 13 14 15 16 17 18 19 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 21 20 AVDD5 RESET_N 10 11 P0_6 DVDD2 P0_7 P1_1 P1_0 P1_2 9 25 P1_3 P0076-02 NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip. Figure 6. Pinout Top View 14 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 Pin Descriptions PIN NAME PIN PIN TYPE DESCRIPTION AVDD1 28 Power (analog) 2-V–3.6-V analog power-supply connection AVDD2 27 Power (analog) 2-V–3.6-V analog power-supply connection AVDD3 24 Power (analog) 2-V–3.6-V analog power-supply connection AVDD4 29 Power (analog) 2-V–3.6-V analog power-supply connection AVDD5 21 Power (analog) 2-V–3.6-V analog power-supply connection AVDD6 31 Power (analog) 2-V–3.6-V analog power-supply connection DCOUPL 40 Power (digital) 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. DVDD1 39 Power (digital) 2-V–3.6-V digital power-supply connection DVDD2 10 Power (digital) 2-V–3.6-V digital power-supply connection GND — Ground The ground pad must be connected to a solid ground plane. GND 1, 2, 3, 4 Unused pins Connect to GND P0_0 19 Digital I/O Port 0.0 P0_1 18 Digital I/O Port 0.1 P0_2 17 Digital I/O Port 0.2 P0_3 16 Digital I/O Port 0.3 P0_4 15 Digital I/O Port 0.4 P0_5 14 Digital I/O Port 0.5 P0_6 13 Digital I/O Port 0.6 P0_7 12 Digital I/O Port 0.7 P1_0 11 Digital I/O Port 1.0 – 20-mA drive capability P1_1 9 Digital I/O Port 1.1 – 20-mA drive capability P1_2 8 Digital I/O Port 1.2 P1_3 7 Digital I/O Port 1.3 P1_4 6 Digital I/O Port 1.4 P1_5 5 Digital I/O Port 1.5 P1_6 38 Digital I/O Port 1.6 P1_7 37 Digital I/O Port 1.7 P2_0 36 Digital I/O Port 2.0 P2_1 35 Digital I/O Port 2.1 P2_2 34 Digital I/O Port 2.2 P2_3/ XOSC32K_Q2 33 Digital I/O, Analog I/O Port 2.3/32.768 kHz XOSC P2_4/ XOSC32K_Q1 32 Digital I/O, Analog I/O Port 2.4/32.768 kHz XOSC RBIAS 30 Analog I/O External precision bias resistor for reference current RESET_N 20 Digital input Reset, active-low RF_N 26 RF I/O Negative RF input signal to LNA during RX Negative RF output signal from PA during TX RF I/O Positive RF input signal to LNA during RX Positive RF output signal from PA during TX RF_P 25 XOSC_Q1 22 Analog I/O 32-MHz crystal oscillator pin 1 or external-clock input XOSC_Q2 23 Analog I/O 32-MHz crystal oscillator pin 2 Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 15 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com CIRCUIT DESCRIPTION DIGITAL ANALOG MIXED XOSC_Q2 32-MHz CRYSTAL OSC XOSC_Q1 P2_4 32.768-kHz CRYSTAL OSC P2_3 P2_2 DEBUG INTERFACE P2_1 HIGHSPEED RC-OSC DCOUPL POWER ON RESET BROWN OUT CLOCK MUX and CALIBRATION SFR Bus RESET VDD (2 V–3.6 V) ON-CHIP VOLTAGE REGULATOR WATCHDOG TIMER RESET_N 32-kHz RC-OSC SLEEP TIMER POWER MANAGEMENT CONTROLLER P2_0 P1_7 PDATA P1_6 8051 CPU CORE P1_5 P1_4 P1_3 XRAM IRAM SFR RAM 8-KB SRAM FLASH 32/64/128/256-KB FLASH MEMORY ARBITRATOR P1_2 P1_1 DMA P1_0 P0_7 UNIFIED IRQ CTRL FLASH CTRL P0_6 P0_3 P0_2 P0_1 P0_0 ADC AUDIO/DC RADIO REGISTERS AES ENCRYPTION AND DECRYPTION CSMA/CA STROBE PROCESSOR AGC SYNTH USART 0 SFR Bus RADIO DATA INTERFACE DEMODULATOR MODULATOR TIMER 1 (16-Bit) RECEIVE CHAIN TIMER 2 (IEEE 802.15.4 MAC TIMER) FREQUENCY SYNTHESIZER USART 1 FIFO and FRAME CONTROL P0_4 I/O CONTROLLER P0_5 TRANSMIT CHAIN TIMER 3 (8-Bit) TIMER 4 (8-Bit) RF_P RF_N B0301-02 Figure 7. CC2530 Block Diagram 16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 A block diagram of the CC2530 is shown in Figure 7. The modules can be roughly divided into one of three categories: CPU- and memory-related modules; modules related to peripherals, clocks, and power management; and radio-related modules. In the following subsections, a short description of each module that appears in Figure 7 is given. For more details about the modules and their usage, see the corresponding chapters in the CC253x User's Guide (SWRU191). CPU and Memory The 8051 CPU core used in the CC253x device family is a single-cycle 8051-compatible core. It has three different memory-access buses (SFR, DATA and CODE/XDATA) with single-cycle access to SFR, DATA, and the main SRAM. It also includes a debug interface and an 18-input extended interrupt unit. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. Any interrupt service request is serviced also when the device is in idle mode by going back to active mode. Some interrupts can also wake up the device from sleep mode (power modes 1–3). The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory access points, access of which can map to one of three physical memories: an 8-KB SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The 8-KB SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes 2 and 3). This is an important feature for low-power applications. The 32/64/128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. In addition to holding program code and constants, the non-volatile memory allows the application to save data that must be preserved such that it is available after restarting the device. Using this feature one can, e.g., use saved network-specific data to avoid the need for a full start-up and network find-and-join process . Clocks and Power Management The digital core and peripherals are powered by a 1.8-V low-dropout voltage regulator. It provides power management functionality that enables low power operation for long battery life using different power modes. Five different reset sources exist to reset the device. Peripherals The CC2530 includes many different peripherals that allow the application designer to develop advanced applications. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to perform an erasure of the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute supplied instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in-circuit debugging and external flash programming elegantly. The device contains flash memory for storage of program code. The flash memory is programmable from the user software and through the debug interface. The flash controller handles writing and erasing the embedded flash memory. The flash controller allows page-wise erasure and 4-bytewise programming. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. CPU interrupts can be enabled on each pin individually. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 17 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface) achieve highly efficient operation by using the DMA controller for data transfers between SFR or XREG addresses and flash/SRAM. Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR Generation Mode where it counts Timer 3 periods and the output is ANDed with the output of Timer 3 to generate modulated consumer IR signals with minimal CPU interaction. The MAC timer (Timer 2) is specially designed for supporting an IEEE 802.15.4 MAC or other time-slotted protocol in software. The timer has a configurable timer period and an 8-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 16-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends, as well as a 16-bit output compare register that can produce various command strobes (start RX, start TX, etc.) at specific times to the radio modules. Timer 3 and Timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as a PWM output. The sleep timer is an ultralow-power timer that counts 32-kHz crystal oscillator or 32-kHz RC oscillator periods. The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-time counter or as a wake-up timer to get out of power mode 1 or 2. The ADC supports 7 to 12 bits of resolution in a 30 kHz to 4 kHz bandwidth, respectively. DC and audio conversions with up to eight input channels (Port 0) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversion over a sequence of channels. The random-number generator uses a 16-bit LFSR to generate pseudorandom numbers, which can be read by the CPU or used directly by the command strobe processor. The random numbers can, e.g., be used to generate random keys used for security. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The core is able to support the AES operations required by IEEE 802.15.4 MAC security, the ZigBee network layer, and the application layer. A built-in watchdog timer allows the CC2530 to reset itself in case the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. It can alternatively be configured for use as a general 32-kHz timer. USART 0 and USART 1 are each configurable as either a SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. Radio The CC2530 features an IEEE 802.15.4-compliant radio transceiver. The RF core controls the analog radio modules. In addition, it provides an interface between the MCU and the radio which makes it possible to issue commands, read status, and automate and sequence radio events. The radio also includes a packet-filtering and address-recognition module. 18 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 TYPICAL CHARACTERISTICS RX CURRENT (–100 dBm INPUT) vs TEMPERATURE TX CURRENT (TXPOWER = 0xF5) vs TEMPERATURE 36 28 27 26 TX Current − mA RX Current − mA 35 25 24 34 33 23 22 −40 0 40 80 32 −40 120 0 40 80 T − Temperature − °C G002 Figure 8. Figure 9. RX CURRENT (–100 dBm INPUT) vs SUPPLY VOLTAGE TX CURRENT (TXPOWER = 0xF5) vs SUPPLY VOLTAGE 26.0 34.4 25.5 34.2 TX Current − mA RX Current − mA G001 25.0 24.5 24.0 2.0 120 T − Temperature − °C 34.0 33.8 2.4 2.8 3.2 VCC − Supply Voltage − V Figure 10. Copyright © 2009, Texas Instruments Incorporated 3.6 G003 33.6 2.0 2.4 2.8 3.2 VCC − Supply Voltage − V 3.6 G004 Figure 11. Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 19 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) INTERFERER REJECTION (802.15.4 INTERFERER) vs INTERFERER FREQUENCY (CARRIER AT –82 dBm, 2440 MHz) 75 OUTPUT POWER (TXPOWER = 0xF5) vs FREQUENCY 6.0 50 Interferer Rejection − dB PO − Output Power − dBm 5.5 5.0 4.5 25 0 4.0 3.5 2394 2414 2434 2454 2474 −25 2400 2494 f − Frequency − MHz 2420 2440 2460 2480 Interferer Frequency − MHz G005 G006 Figure 12. Figure 13. SENSITIVITY vs TEMPERATURE OUTPUT POWER (TXPOWER = 0xF5) vs TEMPERATURE 8 −92 −93 PO − Output Power − dBm 6 Sensitivity − dBm −94 −95 −96 −97 4 2 0 −98 −99 −40 0 40 80 120 T − Temperature − °C −2 −40 0 40 G007 Figure 14. 20 Submit Documentation Feedback 80 120 T − Temperature − °C G008 Figure 15. Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 TYPICAL CHARACTERISTICS (continued) OUTPUT POWER (TXPOWER = 0xF5) vs SUPPLY VOLTAGE SENSITIVITY vs SUPPLY VOLTAGE 5.0 −94 −95 Sensitivity − dBm PO − Output Power − dBm 4.8 4.6 4.4 −96 −97 −98 4.2 −99 4.0 2.0 2.4 2.8 3.2 VCC − Supply Voltage − V −100 2.0 3.6 2.4 2.8 3.2 VCC − Supply Voltage − V G009 Figure 16. 3.6 G010 Figure 17. Table 1. Recommended Output Power Settings (1) (1) TXPOWER Register Setting Typical Output Power (dBm) Typical Current Consumption (mA) 0xF5 4.5 34 0xE5 2.5 31 0xD5 1 29 0xC5 –0.5 28 0xB5 –1.5 27 0xA5 –3 27 0x95 –4 26 0x85 –6 26 0x75 –8 25 0x65 –10 25 0x55 –12 25 0x45 –14 25 0x35 –16 25 0x25 –18 24 0x15 –20 24 0x05 –22 23 0x05 and TXCTRL = 0x09 –28 23 Measured on Texas Instruments CC2530 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. See [2] for recommended register settings. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 21 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com APPLICATION INFORMATION Few external components are required for the operation of the CC2530. A typical application circuit is shown in Figure 18. Typical values and description of external components are shown in Table 2. 2-V to 3.6-V Power Supply Optional 32-kHz Crystal C331 XTAL2 C401 3 GND AVDD6 31 P2_4/XOSC32K_Q1 32 P2_2 34 P2_1 35 P2_0 36 P1_7 37 P1_6 38 2 GND P2_3/XOSC32K_Q2 33 1 GND DVDD1 39 DCOUPL 40 C321 R301 RBIAS 30 AVDD4 29 AVDD1 28 4 GND AVDD2 27 5 P1_5 RF_N 26 L252 C251 Antenna (50 W) C252 C253 CC2530 6 P1_4 RF_P 25 L261 DIE ATTACH PAD 7 P1_3 AVDD3 24 XOSC_Q2 23 9 P1_1 XOSC_Q1 22 18 P0_1 19 P0_0 17 P0_2 16 P0_3 15 P0_4 14 P0_5 13 P0_6 11 P1_0 10 DVDD2 20 RESET_N 8 P1_2 12 P0_7 C261 C262 AVDD5 21 XTAL1 Power Supply Decoupling Capacitors are Not Shown Digital I/O Not Connected C221 C231 S0383-01 Figure 18. CC2530 Application Circuit Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) Component 22 Description Value C251 Part of the RF matching network 18 pF C261 Part of the RF matching network 18 pF L252 Part of the RF matching network 2 nH L261 Part of the RF matching network 2 nH C262 Part of the RF matching network 1 pF C252 Part of the RF matching network 1 pF C253 Part of the RF matching network 2.2 pF C331 32kHz xtal loading capacitor 15 pF C321 32kHz xtal loading capacitor 15 pF C231 32MHz xtal loading capacitor 27 pF C221 32MHz xtal loading capacitor 27 pF Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 CC2530F32, CC2530F64, CC2530F128, CC2530F256 www.ti.com .......................................................................................................................................................... SWRS081A – APRIL 2009 – REVISED APRIL 2009 Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued) Component Description C401 Decoupling capacitor for the internal digital regulator R301 Resistor used for internal biasing Value 1 µF 56 kΩ Input/Output Matching When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252. If a balanced antenna such as a folded dipole is used, the balun can be omitted. Crystal An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See the 32-MHz Crystal Oscillator section for details. The load capacitance seen by the 32-MHz crystal is given by: 1 + Cparasitic CL = 1 1 + C221 C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by: 1 + Cparasitic CL = 1 1 + C321 C331 (2) A series resistor may be used to comply with the ESR requirement. On-Chip 1.8-V Voltage-Regulator Decoupling The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation. Power-Supply Decoupling and Filtering Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely. References 1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 2. CC253x User's Guide – CC253x System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 and ZigBee Applications (SWRU191) Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 23 CC2530F32, CC2530F64, CC2530F128, CC2530F256 SWRS081A – APRIL 2009 – REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy! The following subsections point to where to find more information. Texas Instruments Low-Power RF Web Site Texas Instruments’ Low-Power RF Web site has all our latest products, application and design notes, FAQ section, news and events updates, and much more. Just go to www.ti.com/lprf. Low-Power RF Online Community • • • Forums, videos, and blogs RF design help E2E interaction Join us today at www.ti.com/lprf-forum. Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: • RF circuit, low-power RF, and ZigBee design services • Low-power RF and ZigBee module solutions and development tools • RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools? Search the Low-Power RF Developer Network tool to find a suitable partner. www.ti.com/lprfnetwork Low-Power RF eNewsletter The Low-Power RF eNewsletter keeps you up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up today on www.ti.com/lprfnewsletter 24 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256 PACKAGE OPTION ADDENDUM www.ti.com 8-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CC2530F128RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2530F128RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2530F256RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2530F256RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2530F32RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2530F32RHAT ACTIVE VQFN RHA 40 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2530F64RHAR ACTIVE VQFN RHA 40 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2530F64RHAT ACTIVE VQFN RHA 40 250 CU NIPDAU Level-3-260C-168 HR Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC2530F128RHAR VQFN RHA 40 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2530F128RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2530F256RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2530F256RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2530F32RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2530F32RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2530F64RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC2530F64RHAT VQFN RHA 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2530F128RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC2530F128RHAT VQFN RHA 40 250 333.2 345.9 28.6 CC2530F256RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC2530F256RHAT VQFN RHA 40 250 333.2 345.9 28.6 CC2530F32RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC2530F32RHAT VQFN RHA 40 250 333.2 345.9 28.6 CC2530F64RHAR VQFN RHA 40 2500 333.2 345.9 28.6 CC2530F64RHAT VQFN RHA 40 250 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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