NL7WB66 Ultra-Small SPST Analog Switch The NL7WB66 is a very low RON dual SPST analog switch. RON is 5.0 (Typ) at 5.0 V. The device is offered in the very popular low cost US8 package. It is designed as a general purpose dual switch and can be used to switch either analog signals such as audio and video or digital signal such as TTL, CMOS, LVDS, ECL, or complex digital signals such as QPSK. http://onsemi.com MARKING DIAGRAM Features • • • • • • • • • • • 8 Excellent Performance RDSON = 5.0 at 5.0 V High Speed Operation: tPD = 0.25 ns (Max) at 5.0 V 1.65 to 5.5 V Operating Range Reduced Threshold Voltages for LVTTL on Control Pin ♦ Eliminates the Need for Translators for Many Applications ♦ TTL Compatibility when VCC is 5.0 V ♦ Can Operate with 1.8 V Inputs, if VCC is 3.0 ♦ Also Meets Full CMOS Specifications Ultra−Low Charge Injection = 7.5 pC at 5.0 V Low Stand−by Power ICC = 1.0 nA (Max) at TA = 25°C Control Pins IN1, IN2, are Overvoltage Tolerant Pin for Pin Replacement TC7WB66, NC7WB66, 74LVC2G66 ESD Protection: Machine Model >200 V, Human Body Model >2000 V Latchup Max Rating: 200 mA This is a Pb−Free Device Typical Applications • • • • • Cell Phones PDAs Digital Still Cameras Video Digital Video US8 US SUFFIX CASE 493 8 1 AJ M G G 1 AJ M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT Pin Function OVT 1 NO1 − 2 COM1 − 3 OE2 Yes 4 GND − 5 NO2 − 6 COM2 − 7 OE1 Yes 8 VCC − FUNCTION TABLE NO1 1 8 VCC COM1 2 7 OE1 OE2 3 6 COM2 GND 4 5 On/Off Enable Input State of Analog Switch L H Off On ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. NO2 Figure 1. Pin Assignment Diagram © Semiconductor Components Industries, LLC, 2011 August, 2011 − Rev. 4 1 Publication Order Number: NL7WB66/D NL7WB66 MAXIMUM RATINGS Symbol Value Unit DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to )7.0 V VI < GND *50 mA VO < GND *50 mA VCC Rating IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias 260 °C )150 °C JA Thermal Resistance 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW Level 1 − UL 94 V−0 @ 0.125 in − > 2000 > 200 N/A V MSL Moisture Sensitivity FR Flammability Rating VESD Oxygen Index: 28 to 34 ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit 5.5 V VCC Positive DC Supply Voltage 1.65 VIN Digital Input Voltage (Enable) GND 5.5 V VIO Static or Dynamic Voltage Across an Off Switch GND VCC V VIS Analog Input Voltage GND VCC V TA Operating Temperature Range, All Package Types −55 +125 °C tr, tf Input Rise or Fall Time (Enable Input) 0 0 100 20 ns/V NO COM VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V http://onsemi.com 2 NL7WB66 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80°C 117.8 47.9 20.4 9.4 TJ = 90°C 1,032,200 419,300 178,700 79,600 TJ = 100°C 80 90 100 110 TJ = 110°C Time, Years TJ = 120°C Time, Hours FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130°C Junction Temperature 5C NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VS. TIME TO 0.1% BOND FAILURES 1 1 10 100 1000 TIME, YEARS Figure 2. Failure Rate vs. Time Junction Temperature DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND) Guaranteed Max Limit Symbol Parameter Condition VCC 255C −40 to 855C −55 to <1255C Unit VIH High−level Input Voltage, Control Input 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 VCC x 0.65 VCC x 0.7 VCC x 0.7 VCC x 0.7 VCC x 0.65 VCC x 0.7 VCC x 0.7 VCC x 0.7 VCC x 0.65 VCC x 0.7 VCC x 0.7 VCC x 0.7 V VIL Low−level Input Voltage, Control Input 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 VCC x 0.35 VCC x 0.3 VCC x 0.3 VCC x 0.3 VCC x 0.35 VCC x 0.3 VCC x 0.3 VCC x 0.3 VCC x 0.35 VCC x 0.3 VCC x 0.3 VCC x 0.3 V IIN Maximum Input Leakage Current, Enable Inputs VIN = 5.5 V or GND 0 V to 5.5 V +0.1 +1.0 +1.0 A ICC Maximum Quiescent Supply Current (per package) Enable and VIS = VCC or GND 5.5 1.0 1.0 2.0 A http://onsemi.com 3 NL7WB66 DC ELECTRICAL CHARACTERISTICS − Analog Section Guaranteed Max Limit Symbol RON Parameter Condition VCC 255C −40 to 855C −55 to <1255C Unit On−State Switch Resistance VIS = VCC VIS = GND VIS = VCC VIS = GND VIS = VCC VIS = GND VIS = VCC VIS = 2.4 VIS = GND IS = 4 mA IS = 4 mA IS = 8 mA IS = 8 mA IS = 24 mA IS = 24 mA IS = 32 mA IS = 15 mA IS = 32 mA 1.65 1.65 2.3 2.3 3.0 3.0 4.5 4.5 4.5 30 15 20 10 15 7.0 10 8.0 5.0 30 15 20 10 15 7.0 10 8.0 5.0 30 15 20 10 15 7.0 10 8.0 5.0 RON(p) Peak On−State Resistance VIS = VCC to GND, IS = 4 mA VIN = VIH IS = 8 mA IS = 24 mA IS = 32 mA 1.65 2.3 3.0 4.5 120 30 20 15 120 30 20 15 120 30 20 15 RON Difference of On−State Resistance between Switches VIS = VCC to GND, IS = 4 mA VIN = VIH IS = 8 mA IS = 24 mA IS = 32 mA 1.65 2.3 3.0 4.5 1.2 1.3 1.5 2.0 1.2 1.3 1.5 2.0 1.2 1.3 1.5 2.0 VIS = VCC to GND IS = 4 mA IS = 8 mA IS = 24 mA IS = 32 mA 1.65 2.3 3.0 4.5 240 60 14 5.0 240 60 14 5.0 240 60 14 5.0 RFLAT INO(OFF) Off Leakage Current VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V 5.5 1.0 10 100 nA ICOM(OFF) Off Leakage Current VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V 5.5 1.0 10 100 nA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit Symbol Parameter Test Conditions VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.3 V $0.3 V VCC = 5.0 V $0.5 V Min Max Min Max Min Max Min Max Unit tON Output Enable Time 2.3 10 1.6 5.6 1.5 4.4 1.3 3.9 ns tOFF Output Disable Time 2.5 10.5 1.2 6.9 2.0 7.2 1.1 6.3 ns tPD Propagation Delay Time − 0.55 − 0.5 − 0.35 − 0.25 ns CIN CNO1 or CNO2 CCOM(OFF) CCOM(ON) Maximum Input Capacitance, Select Input Analog I/O (Switch Off) Common I/O (Switch Off) Feed−through (Switch Off) http://onsemi.com 4 Typical @ 255C, VCC = 5.0 V Unit 3.0 10 10 10 pF NL7WB66 ADDITIONAL APPLICATIONS CHARACTERISTICS (Voltage Reference to GND Unless Noted) Symbol Condition VCC (V) Typical 255C Unit BW Maximum On−Channel −3.0 dB Bandwidth or Minimum Frequency Response VIS = 0 dBm VIS centered between VCC and GND 2.0 3.0 4.5 102 180 186 MHz VONL Maximum Feed−Through On Loss VIS = 0 dBm @ 10 kHz VIS centered between VCC and GND 2.0 3.0 4.5 −2.2 −0.8 −0.4 dB VISO Off−Channel Isolation f = 100 kHz VIS = 1.0 V RMS VIS centered between VCC and GND 2.0 3.0 4.5 −73 −74 −75 dB VIS = VCC to GND, FIS = 20 kHz tr = tf = 3.0 nS RIS = 0 , CL = 100 pF 3.0 5.5 4.8 7.5 3.0 5.5 0.19 0.06 Q THD Parameter Charge Injection Enable Input to Common I/O Total Harmonic Distortion TDH + Noise FIS = 10 Hz to 100 kHz, RL = Rgen = 600 , CL = 50 pF VIS = 3.0 VPP Sine Wave VIS = 5.0 VPP Sine Wave pC % DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL7WB66USG Circuit Indicator Technology Device Function Package Suffix Package Type Tape and Reel Size NL AS 2066 US US8 (Pb−Free) 178 mm (7″) 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NL7WB66 TIMING INFORMATION VCC DUT NO VCC Input 50% 50% 0V COM VOUT 0.1 F 300 VOH 35 pF 90% 90% Output VOL Input tON Figure 3. tON/tOFF VCC VCC Input DUT NO 50% 50% 0V 300 COM tOFF VOUT VOH 35 pF Output 10% VOL Input Figure 4. tON/tOFF 10% tOFF tON DUT Reference Transmitted COM NO 50 Generator 50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VOUT VISO = Off Channel Isolation = 20 Log VIN for VIN at 100 kHz VOUT for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log VIN ǒ ǒ Ǔ Ǔ Bandwidth (BW) = the frequency 3 dB below VONL Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT NO VCC VIN COM GND CL Output Off VIN Figure 6. Charge Injection: (Q) http://onsemi.com 6 On Off VOUT NL7WB66 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R G P S U C −T− SEATING PLANE D 0.10 (0.004) M H 0.10 (0.004) T K N R 0.10 TYP T X Y V M F DETAIL E DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 0.38 0.015 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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