MA4SPS302 SURMOUNTTM PIN Diode RoHS Compliant Rev. V4 Features MA4SPS302 Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling RoHS Compliant Description This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Tech’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. Absolute Maximum Ratings TAMB = 25°C (unless otherwise specified) Parameter Forward Current Absolute Maximum 600mA Reverse Voltage | -100V | Operating Temperature Storage Temperature Junction Temperature Dissipated Power ( RF & DC ) Mounting Temperature -55°C to +125°C -55 °C to +150°C +175°C 1. Backside metal: 0.1 µM thick. 2. Yellow hatched areas indicate backside ohmic gold INCHES MM DIM Min. Max. Min. Max. A 0.052 0.056 1.321 1.422 B 0.020 0.024 0.508 0.610 C 0.004 0.006 0.102 0.152 D 0.018 0.020 0.457 0.508 E 0.014 0.016 0.356 0.406 800mW +260°C for 30 seconds 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS302 SURMOUNTTM PIN Diode RoHS Compliant Rev. V4 Electrical Specifications @ TAMB = +25°C Symbol Conditions Units Typ Max 1 -40V, 1MHz pF 0.40 0.45 1,3 -40V, 1GHz pF 0.36 RS2,3 10mA, 100MHz W 1.3 2.2 VF 10mA V 0.84 1.00 VR -10µA V IR -70 V nA 100 RqJL IH=1A, IL=10mA °C/W 125 TL +10mA / -6mA ns 460 CT CT 4 Min -70 -100 1000 1. Total Capacitance, CT, is equivalent to the sum of Junction Capacitance and Parasitic Capacitance. CT = CJ (Junction Capacitance) + CPAR (Parasitic Capacitance) 2. Series resistance RS is equivalent to the total diode resistance: RS = RJ (Junction Capacitance Junction Resistance) + RO (Ohmic Resistance) 3 RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package with conductive silver epoxy. Rs vs. Forward Current and Frequency CT vs. Reverse Voltage and Frequency 3 0.600 0.500 0V 0.400 -5V 500uA 2 1mA 1 -40V 2mA 0.300 10mA 0.200 50mA 0.100 0 0.000 0 100 200 300 400 500 600 Frequency (MHz) 700 800 900 1000 0 100 200 300 400 500 600 700 800 900 1000 Frequency (MHz) 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS302 SURMOUNTTM PIN Diode RoHS Compliant Rev. V4 MA4SPS302 ADS SPICE Model & Schematic MA4SPS302 SPICE Model PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=6.5 um Rr=20 K Ohm Cmin=0.40 pF Tau=0.20 usec Rs=0.1 Ohm Cj0=0.50 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=1.0E+6 A/m^2 Kf=0.0 Af=1.0 MA4SPS302 Schematic wBv=100 V wPmax=0.8 W Ffe=1.0 Ls Cp Rp Rvia Rvia _ Notes : Rs = 2 * Rvia + Rp + 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4SPS302 SURMOUNTTM PIN Diode RoHS Compliant Rev. V4 Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Die Attach Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn, 60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but could result in an increase in series and thermal resistance. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce thermal and/or mechanical stresses to the die . It is also not recommended to reflow solder by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attach is completed. Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in Application Note M538 , “Surface Mounting Instructions“. Application Note M541 “Bonding and Handling Procedures for Chip Diode Devices” provides handling and assembly recommendations. Ordering Information The MA4SPS302 SURMOUNT are packaged in gel packs. Part Number Gel Pack MA4SPS302 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.