Speed TEMPFET BTS 282 Z 6SHHG7(03)(7® ® 1 1 7 ! 7 PG-TO220-7-180 PG-TO220-7-3 " # $ % • Green Product (RoHS compliant) • AEC Qualified 7\SH -.*/0/1 VDS 234 5'*+, 567 PG-TO220-7-230 3DFNDJH "G.%//89: "G.%/20980 "G.%//89/:8 ' "2.- ; "/ ": . * < "7 * "=5=9 Data Sheet " *$ * * / ; ; : .* 2 ' ' 7 < .* 5 * * 9 * * 1 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z 0D[LPXP5DWLQJV 3DUDPHWHU 6\PERO Drain source voltage VDS 23 Drain-gate voltage> RGS ?/8k V 23 Gate source voltage VGS +*%820:, ,'+*%, VGS?2674>9'* 8674>TC?07@ VGS?84>9'* DGR 9DOXH 8QLW 4 /8 :5 8674>TC ?07@ 7/ ,' 08 " ,' :/8 $> (* / B " Ptot :88 D 28666=97 @ , TC?88@>9;* ?2674 ,'?:5>RGS ?/7 TC?/7@ %/, Tj "F+ , 7IF Storage temperature Tstg /88 77666=78 DIN humidity category, DIN 40 040 $J'50 28K78K75 $ /L. # 97@ Data Sheet 2 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z 7KHUPDO&KDUDFWHULVWLFV 3DUDPHWHU 6\PERO 9DOXHV 8QLW PLQ W\S PD[ &KDUDFWHULVWLFV IL RthJC 867 . M6# 5+B, 5/ . M5/ , 5+B, :: 28 <KD (OHFWULFDO&KDUDFWHULVWLFV 3DUDPHWHU 6\PERO 9DOXHV 8QLW PLQ W\S PD[ V(BR)DSS 23 9;*+, 6/ 65 / 7I ?/7@> # 6WDWLF&KDUDFWHULVWLFV Drain-source breakdown voltage 4 VGS?84>,' ?86/7 ; >VGS ?VDS ,'?/28N ,'** 1 N VDS?274>VGS?84>Tj ?28@ 86 VDS?274>VGS?84>Tj ?/7@ 86 VDS?274>VGS?84>Tj ?78@ 88 ,;** ; F VGS?/84>VDS ?84>Tj ?/7@ 8 88 VGS?/84>VDS ?84>Tj ?78@ /8 88 5'*+, '* VGS?2674>,' ?:5 06/ 367 VGS?84>,'?:5 760 567 '78O78O67T$"-U25/+ $>98NF,# 6"- 6 Data Sheet 3 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z (OHFWULFDO&KDUDFWHULVWLFV 3DUDPHWHU 6\PERO 9DOXHV 8QLW PLQ W\S PD[ gfs :8 98 * Ciss :078 2088 Coss 838 :79 Crss 798 97 td(on) :8 27 tr :9 75 td(off) 98 87 tf :5 77 4+, :60 769 4+7, 3/ :0 4+ , 77 /:/ 9+ , :62 7I ?/7@> # '\QDPLF&KDUDFWHULVWLFV VDSV/O,' O5'*+,T>,'?08 Input capacitance VGS?84>VDS?/74>f? ! Output capacitance VGS?84>VDS?/74>f? ! Reverse transfer capacitance VGS?84>VDS?/74>f? ! Turn-on delay time VDD?:84>VGS ?2674>,'?08> RG ?6: Rise time VDD?:84>VGS ?2674>,'?08> RG ?6: Turn-off delay time VDD?:84>VGS ?2674>,'?08> RG ?6: Fall time VDD?:84>VGS ?2674>,'?08> RG ?6: *DWH&KDUJH&KDUDFWHULVWLFV ; VDD?284>'=≥8>>V GS?84 ;7684 VDD?284>,'?08>V GS?874 ; VDD?284>,'?08>V GS?884 ; 4 VDD?284>,'?08 Data Sheet 4 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z (OHFWULFDO&KDUDFWHULVWLFV 6\PERO 3DUDPHWHU 9DOXHV 8QLW PLQ W\S PD[ ,* 08 , :/8 9*' 6/7 65 4 trr 87 79 Qrr 86: 8629 N 7I ?/7@> # 5HYHUVH'LRGH # TC?/7@ Inverse diode direct current,pulsed TC?/7@ # VGS?84>IF ?37 Reverse recovery time VR?:84>IF ?,*> diF/dt?88KN Reverse recovery charge VR?:84>IF ?,*> diF/dt?88KN 6HQVRU&KDUDFWHULVWLFV >66> W.*.".X6 W*# *.".# $X6 KWWSZZZLQILQHRQFRPWHPSIHW 9<+, 4 ,<+,?7>Tj?28666=78@ 6: 62 ,<+,?67>Tj ?78@ 863 * 8 7 588 W"?88N>Tj?28666=78@ ,<+, Tj?28666=78@ * W"?88N>Tj?28666=78@ Data Sheet 5 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z (OHFWULFDO&KDUDFWHULVWLFV 3DUDPHWHU 6\PERO 7I ?/7@> # 9DOXHV 8QLW PLQ W\S PD[ 2 N 88 N 78 6HQVRU&KDUDFWHULVWLFV ,<+##, . F Tj?78@ W 6 , Tj?28666=78@>,<+, ?86:> 9<+U,Y8674 9<U$,/, W$ Tj?28666=78@>,<+, ?86: &KDUDFWHULVWLFV ,<+ , >4<+##,?74 Tj?/7@ 8687 867 Tj?78@ 8687 86: 7.*+, 78 58 98 @ W## 867 /67 N 9<+, 867 4 . 9.*?74 .##+";=<=*, 9.*?74>,.*+,?/ U 7I?28666=78@ 6HQVRUUHFRYHU\EHKDYLRXU 6 H Q V R U5 ( 6 ( 7 9 $ . >9 @ WUH V H W 6 HQVRU 2 1 W UH F R Y H U\ 5 HVHW 2)) **$ /.# 4 24 < Data Sheet 6 Rev.1.2, 2009-07-31 Speed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ata Sheet 8 : W 7 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z 6DIHRSHUDWLQJDUHD 7\SRXWSXWFKDUDFWHULVWLF ,' I9'6 '?868J 7 ?/7@J 9;* ?2674 ,' I9'6.I ?/7@ "L4;* /88 94 84 74 54 58 ,' ,' 28 2674 /8 88 24 08 :674 58 28 :4 /8 8 8 4 / 2 9'* 2QVWDWHUHVLVWDQFH 2QVWDWHUHVLVWDQFH 521 I7M ,'?:5J 9;* ?2674 521 I7M ,'?:5J 9;* ?84 /8 2 T6 T6 5'*+, 5'*+, 5 2 $6 / 8 $6 0 8 5 0 5 2 2 / / 8 78 /7 8 /7 78 97 88 /7 @ 8 78 97 7I Data Sheet /7 8 /7 78 97 88 /7 @ 97 7I 8 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z 7\SWUDQVIHUFKDUDFWHULVWLFV 7\SLQSXWWKUHVKROGYROWDJH ,' I9*6 9'*?/4J7I?/7@ 9*6WK I7M 9'* ?9;* "L ,' /62 78 4 /68 /8 9;*+, 8 ,' 88 38 08 60 /28 65 /2 62 6/ 98 58 68 78 860 28 /62 /28N 865 :8 862 /8 86/ 8 8 868 867 68 67 /68 /67 :68 :67 268 4 868 78 768 /7 8 /7 78 88 /7 @ 97 9;* 97 7I 7\SFDSDFLWDQFHV 7\SUHYHUVHGLRGHIRUZDUG & I9'6 9;* ?84>I? ! FKDUFWHULVWLFV ,) I96' W?08N+,J"L7I 8 : 8 / 8 / 8 & , 78@ 8 8 8 8 8 8 7 8 7 /8 /7 :8 4 8 868 28 9'* Data Sheet /7@ 8 86/ 862 865 860 68 4 62 9*' 9 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z 7\SJDWHFKDUJH 'UDLQVRXUFHEUHDNGRZQYROWDJH 9*6 I4*DWH "L ,' ?08 9+-U,'**?#+7I , -.*/0/1 5 70 4 4 9+-U,'** 75 VGS / 8 8>/ 9'*T 8>0 9'*T 77 72 7: 7/ 0 7 78 5 23 2 20 29 / 25 8 8 28 08 /8 58 27 78 /28 4; Data Sheet /7 8 /7 78 97 88 /7 @ 97 7I 10 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z Package Outlines Package Outlines 9.9 ±0.2 A 9.5 ±0.2 B 7.5 4.4 1.3 +0.1 -0.02 2.8 ±0.2 3.7 -0.15 0.05 9.2 ±0.2 13 15.6 ±0.3 C 0...0.15 10.2 ±0.3 1) 8.6 ±0.3 17.5 ±0.3 6.6 0.5 ±0.1 7x 0.6 ±0.1 6x 1.27 3.3 ±0.3 1 2.4 0.25 M 4.5 ±0.3 A B C 8.4 ±0.3 1) Shear and punch direction no burrs this surface. Back side, heatsink contour All metal surfaces tin plated, except area of cut. PG-TO220-7-3 (Please Insert Package Long Name!) B A 4.4 1.3 +0.1 -0.02 0.05 1) 1.5 ±0.4 3.6 0 ... 0.15 0.6 +0.1 -0.03 0.5 +0.15 1.27 6 x 1.27 = 7.62 (14.1) 0.1 2.4 (1.3) 10.5 ±0.15 6.5 9.9 8 7.5 6.6 9.2 ±0.2 Figure 1 5 0.25 M A B +3 0.1 B 1) Shear and punch direction no burrs this surface Back side, heatsink contour All metal surfaces tin plated, except area of cut Figure 2 Data Sheet PG-TO220-7-180 11 Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z Package Outlines 9.9 ±0.2 A 9.5 ±0.2 B 7.5 4.4 2.8 ±0.2 3.7 -0.15 13 15.6 ±0.3 1) C 0...0.15 6x 1.27 1) Figure 3 0.05 12.5 ±0.5 17.5 ±0.3 6.6 9.2 ±0.2 1.3 +0.1 -0.02 0.5 ±0.1 7x 0.6 ±0.1 2.4 0.25 M A B C Shear and punch direction no burrs this surface. Back side, heatsink contour All metal surfaces tin plated, except area of cut. PG-TO220-7-230 Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 12 Dimensions in mm Rev.1.2, 2009-07-31 Speed TEMPFET BTS 282 Z Revision History 2 Revision History Revision Date Changes 1.2 2009-07-31 removed 100ms and DC line in SOA diagram 1.1 2008-10-21 all pages: added new Infineon logo Creation of the green datasheet. Initial version of RoHS-compliant derivate of the BTS282Z Page 1 and 12: added RoHS compliance statement and Green product feature Page 1, 11 and 12: Package changed to RoHS compliant version page 13: added Revision history page 14: added Disclaimer Data Sheet 13 Rev.1.2, 2009-07-31 Edition 2009-07-31 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.