BRIGHT VIEW ELECTRONICS CO.,LTD SUPER BRIGHTNESS SMD LED BVS-166UG2-12 Cathode mark LED die 0.8 PACKAGE CONFIGURATION 0.6 Soldering terminal Cathode line 1.6 1.0 Soldering Pattem 0.8 0.8 1.0 P C .board 0.3 0.4 Resin 0.8 Polarity 0.7 0.8 0.4 Soldering terminal Tolerance ± 0.1 р DESCRIPTION Dice Material : AlGaInP/GaAs Yellow Green Light Color : Yellow Green Color Lens Color : Milky Diffused ABSOLUTE MAXIMUM RATINGS AT Ta = 25 к PARAMETER Power Dissipation Continuous Forward Current Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width ) Reverse Voltage Derating Linear From 25 к Operating Temperature Range Storage Temperature Range Infrared Soldering Condition 260 к for 5 seconds Reflow Soldering Condition 230 к for 10 seconds ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25 SYMBOL VF IR ӳp ӳd 2Ӱ1/2 PARAMETER Forward Voltage Reverse Current Peak Emission Wavelength Dominant Wavelength Viewing Angle TEST COND. I F = 20 mA V R = 5V I F = 20 mA I F = 20 mA I F = 20 mA MIN. MAX. 55 20 100 5 0.35 Ё30 to Ѐ 80 Ё40 to Ѐ 85 UNIT mW mA mA V mA/oC o C o C к TYP. 2.1 MAX. 2.6 100 575 570 130 UNIT V ӴA nm nm Deg BIN GRADE LIMITS ( I F = 20 mA ) LUMINOUS INTENSITY / mcd Bin Min. Max. x 35 42 y 42 50 z 50 60 A B C 60 70 84 70 84 100 Tolerance ± 15%mcd *Bright View reserves the rights to alter specifications and remove availability of products at any time without notice. *Dominant Wavelength, ӳd is according to CIE Chromaticity Diagram base on color of lamps. *Ӱ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 2004/9/8 – A BRIGHT VIEW ELECTRONICS CO.,LTD SMD APPLICATION ( PB FREE SOLDERING ) Apply to BVS-3XXΕ1XX series. Description: (1) Manual soldering (We do not recommend this method strongly.) (1.1) To prevent cracking,please bake (65к,24hrs)before soldering. (1.2) Temperature at tip of iron: 250к Max.(25W) (1.3) It's banned to load any stress on the resin during soldering. (1.4) Soldering time: 3 sec. Max.(one time only) (2) Reflow Soldering (2.1) To prevent cracking,please bake (65к,24hrs)before soldering. (2.2) When soldering,do not put stress on the LEDs during heating. (2.3) Never take next process until the component is cooled down to room temperature after reflow. (2.4) After soldering,do not warp the circuit board. (2.5) The recommended reflow soldering profile(measuring on the surface of the LED resin)is following: 10 SEC. MAX. 245 C MAX. 0.5к/SEC MAX. 217к 217к TEMPERATURE 150к 1к/SEC. MAX. 50 SEC. MAX. ~75к ~25к 210 SEC. MIN. 100 SEC. MAX. TIME The reflow temperature 240к~245к is recommended and the soldering temperature should be not higher than 245к(one time only) 2005 / 10 / 20 - B BRIGHT VIEW CHIP LEDS PACKING ELECTRONICS CO.,LTD BVS-166/167 Series 2.0 Cathode mark 0.05 4.0 0.10 4.0 1.5 0.10 0.10 0.23 0.05 1.75 0.10 3.5 0.05 1.80 0.10 8.0 0.20 Feeding direction UNIT : mm 0.75 0.10 - BVS-166 0.60 0.10 - BVS-167 178 1.0 60 0.5 Reel : 4,000PCS 12 0.5 UNIT : mm Label 2 Bright View Label 1 Bright View PART NO.: PART NO.: Electronics Co.,Ltd. BVS-16XXXX LOT NO.: GRADE: Q'ty LOT NO.: GRADE: Q'ty X- pcs QA ńłŖŕŊŐŏ pcs Electronics Co.,Ltd. QA ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION 24 Anti-electrostatic bag Normal X: Bin grade : Wavelength : Vf 39 RE CARTON Dimension(cm): 39*24*22 22 ITEM NO. DEVICE: Q'TY N. W.: G. W.: Y PCS. KGS. KGS. Carton : 30 Reels Total : 120,000PCS 2003 / 11 / 12 - A