PSMN009-100P N-channel TrenchMOS SiliconMAX standard level FET Rev. 02 — 30 September 2009 Product data sheet 1. Product profile 1.1 General description SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only. 1.2 Features and benefits Low conduction losses due to low on-state resistance Suitable for high frequency applications due to fast switching characteristics 1.3 Applications High frequency computer motherboard DC-to-DC convertors OR-ing applicationss 1.4 Quick reference data Table 1. Quick reference Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - - 100 V ID drain current Tmb = 25 °C; VGS = 10 V; see Figure 1; see Figure 3 - - 75 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 230 W VGS = 10 V; ID = 75 A; VDS = 80 V; Tj = 25 °C; see Figure 11 - 44 - nC VGS = 10 V; ID = 25 A; Tj = 25 °C; see Figure 9; see Figure 10 - 7.5 8.8 mΩ Dynamic characteristics QGD gate-drain charge Static characteristics RDSon drain-source on-state resistance PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 G gate 2 D drain 3 S source mb D mounting base; connected to drain Graphic symbol D mb G mbb076 S 1 2 3 SOT78 (TO-220AB) 3. Ordering information Table 3. Ordering information Type number Package Name Description PSMN009-100P TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead SOT78 TO-220AB PSMN009-100P_2 Product data sheet Version © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 2 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 100 V VDGR drain-gate voltage Tj ≤ 175 °C; Tj ≥ 25 °C; RGS = 20 kΩ VGS gate-source voltage ID drain current - 100 V -20 20 V VGS = 10 V; Tmb = 100 °C; see Figure 1 - 65 A VGS = 10 V; Tmb = 25 °C; see Figure 1; see Figure 3 - 75 A IDM peak drain current tp ≤ 10 µs; pulsed; Tmb = 25 °C; see Figure 3 - 400 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 230 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C VGSM peak gate-source voltage -30 30 V pulsed; tp ≤ 50 µs; Tj ≤ 150 °C; δ = 25 % Source-drain diode IS source current Tmb = 25 °C - 75 A ISM peak source current tp ≤ 10 µs; pulsed; Tmb = 25 °C - 400 A Avalanche ruggedness EDS(AL)S non-repetitive VGS = 10 V; Tj(init) = 25 °C; ID = 35 A; Vsup = 15 V; drain-source avalanche unclamped; tp = 0.1 ms; RGS = 50 Ω energy - 120 mJ IDS(AL)S non-repetitive VGS = 10 V; Vsup = 15 V; RGS = 50 Ω; drain-source avalanche Tj(init) = 25 °C; unclamped current - 75 A PSMN009-100P_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 3 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 03ah99 120 Ider (%) 03aa16 120 Pder (%) 100 80 80 60 40 40 20 0 Fig 1. 0 30 60 90 120 0 150 180 Tmb (°C) Normalized continuous drain current as a function of mounting base temperature 0 50 100 150 200 Tmb (°C) Fig 2. Normalized total power dissipation as a function of mounting base temperature 03ai01 103 ID (A) Limit RDSon = VDS/ID tp = 10 µs 102 100 µs DC 1 ms 10 10 ms 100 ms 1 1 102 10 103 VDS (V) Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PSMN009-100P_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 4 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-mb) Rth(j-a) Conditions Min Typ Max Unit thermal resistance from see Figure 4 junction to mounting base - - 0.65 K/W thermal resistance from vertical in free air junction to ambient - 60 - K/W 03af48 1 Zth(j-mb) (K/W) δ = 0.5 0.2 10−1 0.1 0.05 0.02 10−2 δ= P tp T single pulse t tp 10−3 10−6 T 10−5 10−4 10−3 10−2 10−1 1 10 tp (s) Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration PSMN009-100P_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 5 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 6. Characteristics Table 6. Symbol Characteristics Parameter Conditions Min Typ Max Unit drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V; Tj = -55 °C 90 - - V ID = 0.25 mA; VGS = 0 V; Tj = 25 °C 100 - - V gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 175 °C; see Figure 8 1 - - V ID = 1 mA; VDS = VGS; Tj = 25 °C; see Figure 8 2 3 4 V ID = 1 mA; VDS = VGS; Tj = -55 °C; see Figure 8 - - 4.4 V Static characteristics V(BR)DSS VGS(th) IDSS IGSS RDSon drain leakage current gate leakage current drain-source on-state resistance VDS = 30 V; VGS = 0 V; Tj = 175 °C - - 500 µA VDS = 30 V; VGS = 0 V; Tj = 25 °C - 0.02 1 µA VGS = 20 V; VDS = 0 V; Tj = 25 °C - 10 100 nA VGS = -20 V; VDS = 0 V; Tj = 25 °C - 10 100 nA VGS = 10 V; ID = 25 A; Tj = 175 °C; see Figure 9; see Figure 10 - 20.25 23.8 mΩ VGS = 10 V; ID = 25 A; Tj = 25 °C; see Figure 9; see Figure 10 - 7.5 8.8 mΩ ID = 75 A; VDS = 80 V; VGS = 10 V; Tj = 25 °C; see Figure 11 - 156 - nC - 31 - nC - 44 - nC Dynamic characteristics QG(tot) total gate charge QGS gate-source charge QGD gate-drain charge Ciss input capacitance Coss output capacitance Crss reverse transfer capacitance td(on) turn-on delay time tr rise time td(off) tf VDS = 25 V; VGS = 0 V; f = 1 MHz; Tj = 25 °C; see Figure 12 - 8250 - pF - 620 - pF - 300 - pF - 38 - ns - 59 - ns turn-off delay time - 120 - ns fall time - 43 - ns - 0.8 1.2 V VDS = 15 V; RL = 1.25 Ω; VGS = 10 V; RG(ext) = 6 Ω; Tj = 25 °C; ID = 12 A Source-drain diode VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C; see Figure 13 PSMN009-100P_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 6 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 03am54 50 Tj = 25 °C ID 03am56 80 10 V 6 V 5.6 V 5.4 V VDS > ID x R DSon ID (A) (A) 40 5.2 V 30 60 5V 40 4.8 V 20 4.6 V 20 10 175 °C 4.4 V Tj = 25 °C VGS = 4.2 V 0 Fig 5. 0 0.2 0.4 0.6 0 0.8 1 VDS (V) Output characteristics: drain current as a function of drain-source voltage; typical values 0 Fig 6. 03aa35 10−1 ID (A) 4 VGS (V) 6 Transfer characteristics: drain current as a function of gate-source voltage; typical values 03aa32 5 VGS(th) (V) min 10−2 typ max 4 10−3 3 10−4 2 10−5 1 10−6 0 2 4 0 −60 6 VGS (V) Fig 7. 2 Sub-threshold drain current as a function of gate-source voltage Fig 8. typ min 0 60 120 180 Tj (°C) Gate-source threshold voltage as a function of junction temperature PSMN009-100P_2 Product data sheet max © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 7 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 03ai03 15 5V 03aa29 3 5.5 V RDSon (mΩ) a VGS = 6 V 12.5 2 8V 10 1 10 V 20 V 7.5 5 0 50 100 150 0 -60 200 0 60 120 ID (A) Fig 9. Drain-source on-state resistance as a function of drain current; typical values 03ai08 10 VGS Tj (°C) 180 Fig 10. Normalized drain-source on-state resistance factor as a function of junction temperature 03ai07 105 C (pF) (V) 8 Ciss 104 6 4 103 Coss 2 Crss 0 0 50 100 150 QG (nC) 200 Fig 11. Gate-source voltage as a function of gate charge; typical values 102 10−1 10 VDS (V) 102 Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values PSMN009-100P_2 Product data sheet 1 © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 8 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 03ai06 100 IS (A) 80 Tj = 175 °C 60 25 °C 40 20 0 0 0.5 1.0 VSD (V) 1.5 Fig 13. Source current as a function of source-drain voltage; typical values PSMN009-100P_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 9 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E A A1 p q mounting base D1 D L1(1) L2(1) Q L b1(2) (3×) b2(2) (2×) 1 2 3 b(3×) c e e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) L2(1) max. p q Q mm 4.7 4.1 1.40 1.25 0.9 0.6 1.6 1.0 1.3 1.0 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 2.54 15.0 12.8 3.30 2.79 3.0 3.8 3.5 3.0 2.7 2.6 2.2 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC JEITA 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 08-04-23 08-06-13 Fig 14. Package outline SOT78 (TO-220AB) PSMN009-100P_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 10 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PSMN009-100P_2 20090930 Product data sheet - Modifications: PSMN009_100P_100B-01 (9397 750 09158) • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Type number PSMN009-100P separated from data sheet PSMN009_100P_100B-01. 20020429 Product data - PSMN009-100P_2 Product data sheet PSMN009_100P_100B-01 - © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 11 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 9. Legal information 9.1 Data sheet status Document status [1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 9.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS — is a trademark of NXP B.V. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PSMN009-100P_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 30 September 2009 12 of 13 PSMN009-100P NXP Semiconductors N-channel TrenchMOS SiliconMAX standard level FET 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Contact information. . . . . . . . . . . . . . . . . . . . . .12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 September 2009 Document identifier: PSMN009-100P_2