XC7SHU04 Inverter Rev. 01 — 7 September 2009 Product data sheet 1. General description The XC7SHU04 is a high-speed Si-gate CMOS device. It provides an inverting single stage function. 2. Features n n n n n Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays ESD protection: u HBM JESD22-A114E: exceeds 2000 V u MM JESD22-A115-A: exceeds 200 V u CDM JESD22-C101C: exceeds 1000 V n Specified from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version XC7SHU04GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 XC7SHU04GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 XC7SHU04 NXP Semiconductors Inverter 4. Marking Table 2. Marking codes Type number Marking[1] XC7SHU04GW fD XC7SHU04GV fU4 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 2 A Y 4 1 2 mna043 Fig 1. Logic symbol 4 A mna044 Fig 2. Y mna045 IEC logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning XC7SHU04 n.c. 1 A 2 GND 3 5 VCC 4 Y 001aak130 Fig 4. Pin configuration SOT353-1 and SOT753 6.2 Pin description Table 3. Pin description Symbol Pin Description n.c. 1 not connected A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 2 of 14 XC7SHU04 NXP Semiconductors Inverter 7. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Input Output A Y L H H L 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current IO output current Conditions VI < −0.5 V Min Max Unit −0.5 +7.0 V −20 - mA −0.5 +7.0 V VO < −0.5 V or VO > VCC + 0.5 V - ±20 mA −0.5 V < VO < VCC + 0.5 V - ±25 mA [1] ICC supply current - 75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit 2.0 5.0 5.5 V VCC supply voltage VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.3 V ± 0.3 V - - 100 ns/V VCC = 5.0 V ± 0.5 V - - 20 ns/V XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 3 of 14 XC7SHU04 NXP Semiconductors Inverter 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions Min VIH VIL VOH VOL HIGH-level input voltage Typ −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max VCC = 2.0 V 1.7 - - 1.7 - 1.7 - V VCC = 3.0 V 2.4 - - 2.4 - 2.4 - V VCC = 5.5 V 4.4 - - 4.4 - 4.4 - V VCC = 2.0 V - - 0.3 - 0.3 - 0.3 V VCC = 3.0 V - - 0.6 - 0.6 - 0.6 V VCC = 5.5 V - - 1.1 - 1.1 - 1.1 V HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V LOW-level input voltage LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA CI input capacitance - 1.5 10 - 10 - 10 pF XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 4 of 14 XC7SHU04 NXP Semiconductors Inverter 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V. For test circuit see Figure 6. Symbol Parameter 25 °C Conditions Min propagation delay tpd A to Y; see Figure 5 VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V CL = 50 pF Min Max - 3.4 7.1 1.0 8.5 1.0 10.0 ns - 4.9 10.6 1.0 12.0 1.0 13.5 ns - 2.6 5.5 1.0 6.0 1.0 7.0 ns [4] - 3.6 7.0 1.0 8.0 1.0 9.0 ns - 14 - [1] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. XC7SHU04_1 Product data sheet Max [3] CL = 15 pF per buffer; VI = GND to VCC Min [2] CL = 50 pF power dissipation capacitance Max [1] CL = 15 pF CPD Typ −40 °C to +85 °C −40 °C to +125 °C Unit - - - - pF © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 5 of 14 XC7SHU04 NXP Semiconductors Inverter 12. Waveforms VM A input tPHL tPLH VM Y output mna111 Measurement points are given in Table 9. Fig 5. Input (A) to output (Y) propagation delays Table 9. Measurement point Type XC7SHU04 Input Input Output VI VM VM GND to VCC 0.5 × VCC 0.5 × VCC VCC PULSE GENERATOR VI VO DUT CL RT mna101 Test data is given in Table 10. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. Load circuitry for switching times Table 10. Test data Type XC7SHU04 Input Load VI tr, tf CL VCC ≤ 3.0 ns 15 pF, 50 pF XC7SHU04_1 Product data sheet Test tPLH, tPHL © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 6 of 14 XC7SHU04 NXP Semiconductors Inverter 13. Typical transfer characteristics mna397 2.0 VO (V) 1.6 mna398 1.0 VO ICC (mA) 0.8 3.0 10 VO ICC (mA) VO (V) 8 0.6 1.2 6 1.5 0.4 0.8 4 ID (drain current) 0.4 0.2 ID (drain current) 2 0 0 0 0 0.4 0.8 1.2 1.6 0 0 2.0 1 2 VI (V) Fig 7. VCC = 2.0 V; IO = 0 A Fig 8. 3 VI (V) VCC = 3.0 V; IO = 0 A mna399 6 50 VO (V) ICC (mA) 40 VO Rbias = 560 kΩ VCC 30 3 0.47 µF 20 ID (drain current) 10 VI (f = 1 kHz) input output 100 µF A IO GND mna050 0 0 0 Fig 9. 2 VCC = 5.5 V; IO = 0 A 4 VI (V) 6 Fig 10. Test set-up for measuring forward transconductance gfs = ∆IO/∆VI at VO is constant XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 7 of 14 XC7SHU04 NXP Semiconductors Inverter mna400 40 gfs (mA/V) 30 20 10 0 0 2 4 VCC (V) 6 Fig 11. Typical forward transconductance gfs as a function of the supply voltage at Tamb = 25 °C 14. Application information Some applications are: • Linear amplifier (see Figure 12) • In crystal oscillator design (see Figure 13) Remark: All values given are typical unless otherwise specified. R2 R1 VCC 1 µF R2 R1 U04 U04 C1 ZL C2 out mna052 mna053 Maximum Vo(p-p) = VCC − 1.5 V centered at 0.5 × VCC. C1 = 47 pF (typ.) G ol G v = – --------------------------------------R1 1 + ------- ( 1 + G ol ) R2 C2 = 22 pF (typ.) R1 = 1 MΩ to 10 MΩ (typ.) R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC (ICC is typically 2 mA at VCC = 3 V and f = 1 MHz). Gol = open loop gain Gv = voltage gain R1 ≥ 3 kΩ, R2 ≤ 1 MΩ ZL > 10 kΩ; Gol = 20 (typ.) Typical unity gain bandwidth product is 5 MHz. Fig 12. Used as a linear amplifier Fig 13. Crystal oscillator configuration XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 8 of 14 XC7SHU04 NXP Semiconductors Inverter Table 11. External components for resonator (f < 1 MHz) All values given are typical and must be used as an initial set-up. Frequency R1 R2 C1 C2 10 kHz to 15.9 kHz 22 MΩ 220 kΩ 56 pF 20 pF 16 kHz to 24.9 kHz 22 MΩ 220 kΩ 56 pF 10 pF 25 kHz to 54.9 kHz 22 MΩ 100 kΩ 56 pF 10 pF 55 kHz to 129.9 kHz 22 MΩ 100 kΩ 47 pF 5 pF 130 kHz to 199.9 kHz 22 MΩ 47 kΩ 47 pF 5 pF 200 kHz to 349.9 kHz 22 MΩ 47 kΩ 47 pF 5 pF 350 kHz to 600 kHz 22 MΩ 47 kΩ 47 pF 5 pF Table 12. Optimum value for R2 Frequency R2 Optimum for 3 kHz 2.0 kΩ minimum required ICC 8.0 kΩ minimum influence due to change in VCC 1.0 kΩ minimum required ICC 6 kHz 10 kHz 14 kHz > 14 kHz 4.7 kΩ minimum influence by VCC 0.5 kΩ minimum required ICC 2.0 kΩ minimum influence by VCC 0.5 kΩ minimum required ICC 1.0 kΩ minimum influence by VCC - replace R2 by C3 with a typical value of 35 pF XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 9 of 14 XC7SHU04 NXP Semiconductors Inverter 15. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 14. Package outline SOT353-1 (TSSOP5) XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 10 of 14 XC7SHU04 NXP Semiconductors Inverter Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 15. Package outline SOT753 (SC-74A) XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 11 of 14 XC7SHU04 NXP Semiconductors Inverter 16. Abbreviations Table 13. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes XC7SHU04_1 20090907 Product data sheet - - XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 12 of 14 XC7SHU04 NXP Semiconductors Inverter 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] XC7SHU04_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 7 September 2009 13 of 14 XC7SHU04 NXP Semiconductors Inverter 20. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Typical transfer characteristics . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 7 September 2009 Document identifier: XC7SHU04_1