74AHC1G32; 74AHCT1G32 2-input OR gate Rev. 07 — 14 May 2009 Product data sheet 1. General description 74AHC1G32 and 74AHCT1G32 are high-speed Si-gate CMOS devices. They provide a 2-input OR function. The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V. The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. 2. Features n Symmetrical output impedance n High noise immunity n ESD protection: u HBM JESD22-A114E: exceeds 2000 V u MM JESD22-A115-A: exceeds 200 V u CDM JESD22-C101C: exceeds 1000 V n Low power dissipation n Balanced propagation delays n SOT353-1 and SOT753 package options n Specified from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number 74AHC1G32GW Package Temperature range Name Description Version −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 74AHCT1G32GW 74AHC1G32GV 74AHCT1G32GV 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate 4. Marking Table 2. Marking codes Type number Marking code 74AHC1G32GW AG 74AHCT1G32GW CG 74AHC1G32GV A32 74AHCT1G32GV C32 5. Functional diagram 1 B 2 A Y 1 4 4 mna165 mna164 Fig 1. ≥1 2 Logic symbol Fig 2. IEC logic symbol B Y A mna166 Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74AHC1G32 74AHCT1G32 B 1 A 2 GND 3 5 VCC 4 Y 001aak129 Fig 4. Pin configuration SOT353-1 (TSSOP5) and SOT753 (SC-74A) 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 2 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate 6.2 Pin description Table 3. Pin description Symbol Pin Description B 1 data input A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage 7. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Inputs Output A B Y L L L L H H H L H H H H 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC Min Max Unit supply voltage −0.5 +7.0 V VI input voltage −0.5 +7.0 V IIK input clamping current VI < −0.5 V −20 - mA IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V - ±20 mA IO output current −0.5 V < VO < VCC + 0.5 V - ±25 mA ICC supply current - 75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Conditions Tamb = −40 °C to +125 °C [1] [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 3 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74AHC1G32 74AHCT1G32 Unit Min Typ Max Min Typ Max VCC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V VI input voltage 0 - 5.5 0 - 5.5 V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature −40 +25 +125 −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.3 V ± 0.3 V - - 100 - - - ns/V VCC = 5.0 V ± 0.5 V - - 20 - - 20 ns/V 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions Min Typ −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max For type 74AHC1G32 VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage VCC = 2.0 V 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA CI input capacitance - 1.5 10 - 10 - 10 pF 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 4 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions Min Typ −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max For type 74AHCT1G32 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −50 µA 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.8 - 3.70 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA IO = −8.0 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 µA IO = 8.0 mA II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA ∆ICC additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 1.5 10 - 10 - 10 pF 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; tr = tf = ≤ 3.0 ns. For waveform see Figure 5. For test circuit see Figure 6. Symbol Parameter 25 °C Conditions Min Typ −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max For type 74AHC1G32 tpd propagation delay A and B to Y VCC = 3.0 V to 3.6 V [1] [2] CL = 15 pF - 4.4 7.9 1.0 9.5 1.0 10.0 ns CL = 50 pF - 6.3 11.4 1.0 13.0 1.0 14.5 ns - 3.2 5.5 1.0 6.5 1.0 7.0 ns - 4.6 7.5 1.0 - 16 - VCC = 4.5 V to 5.5 V [3] CL = 15 pF CL = 50 pF CPD power per buffer; dissipation CL = 50 pF; f = 1 MHz; capacitance VI = GND to VCC [4] 74AHC_AHCT1G32_7 Product data sheet 8.5 - 1.0 - 9.5 - ns - pF © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 5 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate Table 8. Dynamic characteristics …continued GND = 0 V; tr = tf = ≤ 3.0 ns. For waveform see Figure 5. For test circuit see Figure 6. Symbol Parameter 25 °C Conditions Min Typ −40 °C to +85 °C −40 °C to +125 °C Unit Max Min Max Min Max For type 74AHCT1G32 propagation delay tpd A and B to Y; see Figure 5; VCC = 4.5 V to 5.5 V [1] [3] CL = 15 pF CL = 50 pF power per buffer; dissipation CL = 50 pF; f = 1 MHz; capacitance VI = GND to VCC CPD [1] [4] - 3.3 6.9 1.0 - 4.8 7.9 1.0 - 17 - 8.0 1.0 9.0 - 9.0 1.0 - ns 10 - ns - pF tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 12. Waveforms A, B input VM tPHL Y output tPLH VM mna167 Measurement points are given in Table 9. Fig 5. Table 9. The input (A and B) to output (Y) propagation delays Measurement points Type number Input Output VI VM VM 74AHC1G32 GND to VCC 0.5 × VCC 0.5 × VCC 74AHCT1G32 GND to 3.0 V 1.5 V 0.5 × VCC 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 6 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate VCC PULSE GENERATOR VI VO DUT RT CL mna101 Test data is given in Table 8. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. Load circuitry for switching times 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 7 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 Fig 7. REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Package outline SOT353-1 (TSSOP5) 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 8 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 Fig 8. JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Package outline SOT753 (SC-74A) 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 9 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate 14. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT1G32_7 20090514 Product data sheet - 74AHC_AHCT1G32_6 Modifications: • Pin configuration SOT353-1 (TSSOP5) and SOT753 (SC-74A) drawing corrected. 74AHC_AHCT1G32_6 20070702 Product data sheet - 74AHC_AHCT1G32_5 74AHC_AHCT1G32_5 20020605 Product specification - 74AHC_AHCT1G32_4 74AHC_AHCT1G32_4 20020326 Product specification - 74AHC_AHCT1G32_3 74AHC_AHCT1G32_3 20010222 Product specification - 74AHC_AHCT1G32_2 74AHC_AHCT1G32_2 19990127 Product specification - 74AHC_AHCT1G32_N_1 74AHC_AHCT1G32_N_1 19981125 Product specification - - 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 10 of 12 74AHC1G32; 74AHCT1G32 NXP Semiconductors 2-input OR gate 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AHC_AHCT1G32_7 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 07 — 14 May 2009 11 of 12 NXP Semiconductors 74AHC1G32; 74AHCT1G32 2-input OR gate 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 May 2009 Document identifier: 74AHC_AHCT1G32_7