DIODES FZT855TA

A Product Line of
Diodes Incorporated
Green
FZT855
150V NPN MEDIUM POWER TRANSISTOR IN SOT223
Features
Mechanical Data

BVCEO > 150V


IC = 5A high Continuous Collector Current

Case Material: Molded Plastic. “Green” Molding Compound.

ICM = 10A Peak Pulse Current

UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020

Very Low Saturation Voltage VCE(sat) < 110mV @ 1A


RCE(sat) = 50mΩ for a Low Equivalent On-Resistance


hFE Specified Up to 10A for a High Gain Hold Up

Complementary PNP Type: FZT955

Lead-Free Finish; RoHS compliant (Notes 1 & 2)
Case: SOT223
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208


Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
SOT223
Weight: 0.112 grams (approximate)
C
B
E
Top View
Device Symbol
Top View
Pin-Out
Ordering Information (Note 4)
Product
FZT855TA
Notes:
Marking
FZT855
Reel size (inches)
7
Tape width (mm)
12
Quantity per reel
1,000
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html
Marking Information
FZT
855
FZT855
Document Number DS33176 Rev. 5 - 2
FZT855 = Product type Marking Code
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A Product Line of
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FZT855
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
Value
250
150
7
5
10
1
Unit
V
V
V
A
A
A
Value
3.0
24
1.6
12.8
42
78
8.84
-55 to +150
Unit
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation
Linear derating factor
Thermal Resistance, Junction to Ambient
Thermal Resistance Junction to Lead
Operating and Storage Temperature Range
Symbol
(Note 5)
(Note 6)
(Note 5)
(Note 6)
(Note 7)
PD
RJA
RJA
RJL
TJ, TSTG
W
mW/°C
°C/W
°C
ESD Ratings (Note 8)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Notes:
Symbol
ESD HBM
ESD MM
Value
≥ 8,000
≥ 400
Unit
V
V
JEDEC Class
3B
C
5. For a device surface mounted on 50mm X 50mm FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; device measured when
operating in steady state condition.
6. Same as note (5), except the device is mounted on 25mm X 25mm single sided 1oz weight copper.
7. Thermal resistance from junction to solder-point (at the end of the collector lead).
8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
FZT855
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FZT855
10
VCE(sat)
Max Power Dissipation (W)
IC Collector Current (A)
Thermal Characteristics and Derating Information
Limit
DC
1
1s
100ms
100m
10ms
Single Pulse Tamb=25°C
10m
100m
52mmX52mm
Single sided 2oz Cu
1
1ms
100µs
10
100
VCE Collector-Emitter Voltage (V)
3.0
2.5
52mmX52mm
Single sided 2oz Cu
2.0
1.5
1.0
0.5
0.0
0
25mmX25mm
Single sided 1oz Cu
20
D=0.5
20
Single Pulse
0
100µ
D=0.05
D=0.1
1m
10m 100m
1
Pulse Width (s)
10
100
1k
Max Power Dissipation (W)
Thermal Resistance (°C/W)
30
D=0.2
Document Number DS33176 Rev. 5 - 2
100 120 140 160
Single Pulse T amb=25°C
52mmX52mm
Single sided 2oz Cu
100
Transient Thermal Impedance
FZT855
80
Derating Curve
52mmX52mm
Single sided 2oz Cu
10
60
Temperature (°C)
Safe Operating Area
40
40
10
1
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Pulse Power Dissipation
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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 9)
Emitter-Base Breakdown Voltage
Collector Cut-off Current
Collector Cut-off Current
Emitter Cut-off Current
Symbol
BVCBO
BVCER
BVCEO
BVEBO
Min
250
250
150
7
Typ
375
375
180
8
ICBO


ICER


IEBO

R ≤ 1kΩ
Max




50
1
Unit
V
V
V
V
nA
µA

50
1
10
nA
µA
nA
40
65
110
355
mV
mV
mV
Collector-Emitter Saturation Voltage (Note 9)
VCE(sat)

20
35
60
260
Base-Emitter Saturation Voltage (Note 9)
Base-Emitter Turn-On Voltage (Note 9)
VBE(sat)
VBE(on)




1250
1100
hFE
100
100
15
200
200
30
10

300


fT

90

MHz
Cobo
ton

22
66
2130

pF
ns
ns
DC Current Gain (Note 9)
Current Gain-Bandwidth Product (Note 9)
Output Capacitance (Note 9)
Switching Times
Notes:

toff

Test Condition
IC = 100µA
IC = 1µA,RB ≤ 1kΩ
IC = 1mA
IE = 100µA
VCB = 200V
VCB = 200V, @TA = +100°C
VCB = 200V
VCB = 200V, @TA = +100°C
VEB = 6V
IC = 100mA, IB = 5mA
IC =500mA, IB = 50mA
IC =1A, IB = 100mA
IC =5A, IB = 500mA
IC =5A, IB = 500mA
IC = 5A, VCE = 5V
IC = 10mA, VCE = 5V
IC = 1A, VCE = 5V
IC = 5A, VCE = 5V
IC = 10A, VCE = 5V
VCE = 10V, IC = 100mA
f = 50MHz
VCB = 10V. f = 1MHz
IC = 1A, VCC = 50V
IB1 = -IB2 = 100mA
9. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%
FZT855
Document Number DS33176 Rev. 5 - 2
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Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
FZT855
Document Number DS33176 Rev. 5 - 2
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
SOT223
Dim Min Max Typ
A
1.55 1.65 1.60
A1 0.010 0.15 0.05
b1
2.90 3.10 3.00
b2
0.60 0.80 0.70
C
0.20 0.30 0.25
D
6.45 6.55 6.50
E
3.45 3.55 3.50
E1
6.90 7.10 7.00
e
—
—
4.60
e1
—
—
2.30
L
0.85 1.05 0.95
Q
0.84 0.94 0.89
All Dimensions in mm
A
A1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
Y1
C1
Y2
X2
Dimensions
X1
X2
Y1
Y2
C1
C2
Value (in mm)
3.3
1.2
1.6
1.6
6.4
2.3
C2
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances
between device Terminals and PCB tracking.
FZT855
Document Number DS33176 Rev. 5 - 2
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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Document Number DS33176 Rev. 5 - 2
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