ONSEMI NCP4680DMX12TCG

NCP4680
150 mA, Low Noise Low
Dropout Regulator
The NCP4680 is a CMOS linear voltage regulator with 150 mA
output current capability. The device is available in a tiny 0.8x0.8 mm
XDFN, and has high output voltage accuracy, low supply current and
high ripple rejection. The NCP4680 is easy to use and includes output
current fold−back protection. A Chip Enable function is included to
save power by lowering supply current. The line and load transient
responses are very good, making this regulator ideal for use as a power
supply for communication equipment.
Features
•
•
•
•
•
•
•
•
•
•
•
Operating Input Voltage Range: 1.40 V to 5.25 V
Output Voltage Range: 0.8 V to 3.6 V (available in 0.1 V steps)
Output Voltage Accuracy: ±1.0%
Supply Current: 50 mA typical
Dropout Voltage: 0.25 V (IOUT = 150 mA, VOUT = 2.5 V)
High PSRR: 75 dB (f = 1 kHz, VOUT = 2.5 V)
Line Regulation: 0.02%/V Typ.
Stable with Ceramic Capacitors: 0.1 mF or more
Current Fold Back Protection
Available in XDFN4 0.8 x 0.8 mm, SC−70, SOT23 Packages
These are Pb−Free Devices
http://onsemi.com
MARKING
DIAGRAMS
XXX
XMM
SC−70
CASE 419A
XX
M
SOT−23−5
CASE 1212
1
XDFN4
CASE 711AB
1
XM
M
Typical Applications
•
•
•
•
Battery−powered Equipment
Networking and Communication Equipment
Cameras, DVRs, STB and Camcorders
Home Appliances
XX, XXX= Specific Device Code
M, MM = Date Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
NCP4680x
VIN
VIN
CE
C1
100n
VOUT
VOUT
GND
(Note: Microdot may be in either location)
ORDERING INFORMATION
C2
100n
See detailed ordering and shipping information in the package
dimensions section on page 17 of this data sheet.
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2011
June, 2011 − Rev. 1
1
Publication Order Number:
NCP4680/D
NCP4680
VIN
VOUT
VIN
Vref
VOUT
Vref
Current Limit
CE
CE
Current Limit
GND
GND
NCP4680Hxxxx
NCP4680Dxxxx
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN4*
Pin No.
SC−70
Pin No.
SOT23
Pin Name
1
4
5
VOUT
Output pin
2
3
2
GND
Ground
3
1
3
CE
Chip enable pin (Active “H”)
4
5
1
VIN
Input pin
−
2
4
NC
No connection
Description
*Tab is GND level. (They are connected to the reverse side of this IC.
The tab is better to be connected to the GND, but leaving it open is also acceptable.
ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Output Voltage
Symbol
Value
Unit
VIN
6.0
V
VOUT
−0.3 to VIN + 0.3
V
Chip Enable Input
VCE
6.0
V
Output Current
IOUT
180
mA
286
mW
Power Dissipation XDFN0808
Power Dissipation SC−70
PD
Power Dissipation SOT23
380
420
Junction Temperature
Storage Temperature
TJ
−40 to 150
°C
TSTG
−55 to 125
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latch−up Current Maximum Rating tested per JEDEC standard: JESD78.
http://onsemi.com
2
NCP4680
THERMAL CHARACTERISTICS
Symbol
Value
Unit
Thermal Characteristics, XDFN 0.8 x 0.8 mm
Thermal Resistance, Junction−to−Air
Rating
RqJA
350
°C/W
Thermal Characteristics, SOT23
Thermal Resistance, Junction−to−Air
RqJA
238
°C/W
Thermal Characteristics, SC−70
Thermal Resistance, Junction−to−Air
RqJA
263
°C/W
ELECTRICAL CHARACTERISTICS
−40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.1 mF, unless otherwise noted.
Typical values are at TA = +25°C.
Parameter
Test Conditions
Operating Input Voltage
Output Voltage
VOUT ≥ 1.8 V
TA = +25 °C
−40°C ≤ TA ≤ 85°C
Output Voltage Temp. Coefficient
Min
Max
Unit
VIN
1.40
Typ
5.25
V
VOUT
x0.99
x1.01
V
VOUT < 1.8 V
−18
18
mV
VOUT ≥ 1.8 V
x0.985
x1.015
V
VOUT < 1.8 V
−50
50
mV
VOUT ≥ 1.8 V
−40°C ≤ TA ≤ 85°C
Symbol
±30
DVOUT/DTA
VOUT < 1.8 V
ppm/°C
±100
Line Regulation
VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.25 V, VIN ≥ 1.4 V
LineReg
0.02
0.10
%/V
Load Regulation
IOUT = 1 mA to 150 mA
LoadReg
5
30
mV
VDO
V
Dropout Voltage
VOUT = 0.8 V
0.70
1.00
VOUT = 0.9 V
0.62
0.91
1.0 V ≤ VOUT < 1.2 V
0.56
0.82
1.2 V ≤ VOUT < 1.4 V
0.47
0.67
1.4 V ≤ VOUT < 1.8 V
0.39
0.54
1.8 V ≤ VOUT < 2.1 V
0.33
0.48
2.1 V ≤ VOUT < 2.5 V
0.28
0.40
2.5 V ≤ VOUT < 3.0 V
0.25
0.35
0.23
0.32
IOUT = 150 mA
3.0 V ≤ VOUT < 3.6 V
Output Current
Short Current Limit
IOUT
150
mA
VOUT = 0 V
ISC
IQ
50
70
mA
Standby Current
VCE = 0 V, TA = 25°C
ISTB
0.1
1.0
mA
CE Pin Threshold Voltage
CE Input Voltage “H”
VCEH
CE Input Voltage “L”
VCEL
Quiescent Current
CE Pull Down Current
Power Supply Rejection Ratio
Output Noise Voltage
VIN = VOUT + 1 V, DVIN = 0.2 Vpk−pk,
IOUT = 30 mA, f = 1 kHz
f = 10 Hz to 100 kHz,
IOUT = 30 mA
VOUT ≥ 1.8 V
40
mA
1.0
V
0.4
ICEPD
0.3
mA
PSRR
75
dB
VN
20 x
VOUT
mVrms
VOUT < 1.8 V
40 x
VOUT
Low Output N−channel Tr. On Resistance
VIN = 4 V, VCE = 0 V
RLOW
60
W
Minimum Start−up Equivalent Resistance
VOUT ≤ 1.8 V (Note 3)
RSUMIN
13 *
VOUT
W
VOUT > 1.8 V
6.7 *
VOUT
3. See Current Limit paragraph in application part for explanation.
http://onsemi.com
3
NCP4680
TYPICAL CHARACTERISTICS
0.9
2.0
0.8
VIN = 1.4 V
0.7
VOUT (V)
1.8 V
0.4
0.3
3.8 V
1.2
5.25 V
1.0
0.8
0.6
0.2
4.8 V
3.8 V
0.4
0.1
0.0
2.8 V
1.4
0.5
0.2
0
50
100
150
200
IOUT (mA)
250
300
0.0
350
0
Figure 3. Output Voltage vs. Output Current
0.8 V Version (TJ = 255C)
VIN = 3 V
300
350
400
4.5 V
2.5
VOUT (V)
3.5 V
1.5
1.0
5.25 V
VIN = 3.5 V
3.0
2.0
VOUT (V)
150 200 250
IOUT (mA)
5.25 V
3.2 V
4.5 V
3.6 V
2.0
1.5
1.0
0.5
0.5
0
50
100
150
200
IOUT (mA)
250
300
0.0
350
0
Figure 5. Output Voltage vs. Output Current
2.8 V Version (TJ = 255C)
0.40
0.7
0.35
TJ = 85°C
0.5
VDO (V)
−40°C
0.3
0.05
75
100
300
350
125
0
150
25°C
0.15
0.1
50
250
TJ = 85°C
0.20
0.10
25
150
200
IOUT (mA)
0.25
0.2
0
100
0.30
25°C
0.4
50
Figure 6. Output Voltage vs. Output Current
3.3 V Version (TJ = 255C)
0.8
0.6
VDO (V)
100
3.5
2.5
0
50
Figure 4. Output Voltage vs. Output Current
1.8 V Version (TJ = 255C)
3.0
0.0
4.8 V
VIN = 2.2 V
1.6
1.5 V
0.6
VOUT (V)
1.8
2.8 V
1.6 V
−40°C
0
IOUT (mA)
25
50
75
IOUT (mA)
Figure 7. Dropout Voltage vs. Output Current
0.8 V Version
100
125
150
Figure 8. Dropout Voltage vs. Output Current
1.8 V Version
http://onsemi.com
4
NCP4680
TYPICAL CHARACTERISTICS
0.30
0.30
0.25
0.25
0.20
TJ = 85°C
VDO (V)
VDO (V)
0.20
0.15
25°C
0.10
0
25
50
75
IOUT (mA)
100
125
150
−40°C
0
50
75
IOUT (mA)
100
125
150
1.82
0.81
1.81
VOUT (V)
1.83
0.82
0.80
0.79
1.80
1.79
0.78
1.78
0.77
1.77
0.76
1.76
−20
0
20
40
60
VIN = 2.8 V
1.84
0.83
1.75
−40
80
−20
0
20
40
60
80
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. Output Voltage vs. Temperature,
0.8 V Version
Figure 12. Output Voltage vs. Temperature,
1.8 V Version
2.85
3.35
VIN = 3.8 V
2.84
3.32
2.81
3.31
VOUT (V)
3.33
2.82
2.80
2.79
3.30
3.29
2.78
3.28
2.77
3.27
2.76
3.26
−20
0
20
40
60
VIN = 4.3 V
3.34
2.83
2.75
−40
25
1.85
VIN = 1.8 V
0.84
0.75
−40
0
Figure 10. Dropout Voltage vs. Output Current
3.3 V Version
0.85
VOUT (V)
25°C
0.05
Figure 9. Dropout Voltage vs. Output Current
2.8 V Version
VOUT (V)
TJ = 85°C
0.10
−40°C
0.05
0
0.15
3.25
−40
80
−20
0
20
40
60
80
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Output Voltage vs. Temperature,
2.8 V Version
Figure 14. Output Voltage vs. Temperature,
3.3 V Version
http://onsemi.com
5
NCP4680
TYPICAL CHARACTERISTICS
120
140
100
120
100
IGND (mA)
IGND (mA)
80
60
40
0
1
2
3
4
0
5
2
3
4
5
VIN, INPUT VOLTAGE (V)
Figure 16. Supply Current vs. Input Voltage,
1.8 V Version
120
100
100
IGND (mA)
120
80
60
80
60
40
40
20
20
1
2
3
4
0
5
0
1
2
3
4
5
VIN, INPUT VOLTAGE (V)
VIN, INPUT VOLTAGE (V)
Figure 17. Supply Current vs. Input Voltage,
2.8 V Version
Figure 18. Supply Current vs. Input Voltage,
3.3 V Version
60
60
55
55
50
50
45
45
40
−40
1
VIN, INPUT VOLTAGE (V)
140
0
0
Figure 15. Supply Current vs. Input Voltage,
0.8 V Version
IGND (mA)
IGND (mA)
20
140
0
IGND (mA)
60
40
20
0
80
−20
0
20
40
60
40
−40
80
−20
0
20
40
60
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Supply Current vs. Temperature,
0.8 V Version
Figure 20. Supply Current vs. Temperature,
1.8 V Version
http://onsemi.com
6
80
NCP4680
60
60
55
55
IGND (mA)
IGND (mA)
TYPICAL CHARACTERISTICS
50
45
45
40
−40
−20
0
20
40
60
40
−40
80
40
60
80
Figure 22. Supply Current vs. Temperature,
3.3 V Version
1.8
0.7
1.6
1.4
VOUT (V)
1 mA
0.5
0.4
30 mA
0.3
1.2
1.0
1 mA
0.8
30 mA
0.6
IOUT = 50 mA
0.2
0.4
0.1
IOUT = 50 mA
0.2
0
1
2
3
4
VIN, INPUT VOLTAGE (V)
0
5
0
Figure 23. Output Voltage vs. Input Voltage,
0.8 V Version
1
2
3
4
VIN, INPUT VOLTAGE (V)
5
Figure 24. Output Voltage vs. Input Voltage,
1.8 V Version
3.0
3.5
2.5
3.0
2.5
VOUT (V)
2.0
VOUT (V)
20
Figure 21. Supply Current vs. Temperature,
2.8 V Version
0.8
1.5
1.0
1 mA
0.5
0
0
TJ, JUNCTION TEMPERATURE (°C)
2.0
0
−20
TJ, JUNCTION TEMPERATURE (°C)
0.9
0.6
VOUT (V)
50
0
1
2.0
1.5
30 mA
1.0
IOUT = 50 mA
0.5
2
3
4
VIN, INPUT VOLTAGE (V)
0.0
5
1 mA
30 mA
IOUT = 50 mA
0
Figure 25. Output Voltage vs. Input Voltage,
2.8 V Version
1
2
3
4
VIN, INPUT VOLTAGE (V)
Figure 26. Output Voltage vs. Input Voltage,
3.3 V Version
http://onsemi.com
7
5
NCP4680
TYPICAL CHARACTERISTICS
120
120
100
60
150 mA
40
IOUT = 1 mA
80
PSRR (dB)
80
PSRR (dB)
100
IOUT = 1 mA
30 mA
30 mA
60
150 mA
40
20
20
0
0.1
1
10
FREQUENCY (kHz)
100
0
0.1
1000
Figure 27. PSRR, 0.8 V Version, VIN = 1.8 V
10
FREQUENCY (kHz)
100
1000
Figure 28. PSRR, 1.8 V Version, VIN = 2.8 V
120
120
IOUT = 1 mA
80
60
100
30 mA
PSRR (dB)
100
PSRR (dB)
1
150 mA
40
20
IOUT = 1 mA
80
30 mA
60
150 mA
40
20
0
0.1
1
10
FREQUENCY (kHz)
100
0
0.1
1000
Figure 29. PSRR, 2.8 V Version, VIN = 3.8 V
1
10
FREQUENCY (kHz)
100
1000
Figure 30. PSRR, 3.3 V Version, VIN = 4.3 V
2.0
2.0
VN (mVrms/√Hz)
2.5
VN (mVrms/√Hz)
2.5
1.5
1.0
1.5
1.0
0.5
0.5
0
0.01
0.1
1
10
100
0.1
0.01
1000
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 31. Output Voltage Noise, 0.8 V Version,
VIN = 1.8 V
Figure 32. Output Voltage Noise, 1.8 V Version,
VIN = 2.8 V
http://onsemi.com
8
NCP4680
TYPICAL CHARACTERISTICS
4.0
5.0
3.5
4.5
4.0
VN (mVrms/√Hz)
2.5
2.0
1.5
1.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.5
0
0.01
0.1
1
10
100
0
0.01
1000
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 33. Output Voltage Noise, 2.8 V Version,
VIN = 3.8 V
Figure 34. Output Voltage Noise, 3.3 V Version,
VIN = 4.3 V
3.3
2.8
2.3
1.3
0.801
VIN (V)
VOUT (V)
1.8
0.800
0.799
0.798
0.797
0
10
20
30
40
50
60
70
80
90
100
t (ms)
Figure 35. Line Transients, 0.8 V Version,
tR = tF = 5 ms, IOUT = 30 mA
4.3
3.8
3.3
2.3
1.801
1.800
1.799
1.798
1.797
0
10
20
30
40
50
t (ms)
60
70
80
90
Figure 36. Line Transients, 1.8 V Version,
tR = tF = 5 ms, IOUT = 30 mA
http://onsemi.com
9
100
VIN (V)
2.8
VOUT (V)
VN (mVrms/√Hz)
3.0
NCP4680
TYPICAL CHARACTERISTICS
5.3
4.8
4.3
3.3
2.801
VIN (V)
VOUT (V)
3.8
2.800
2.799
2.798
2.797
0
10
20
30
40
50
60
70
80
90
100
t (ms)
Figure 37. Line Transients, 2.8 V Version,
tR = tF = 5 ms, IOUT = 30 mA
5.8
5.3
4.8
3.8
3.302
3.301
VIN (V)
VOUT (V)
4.3
3.300
3.299
3.298
3.297
0
10
20
30
40
50
60
70
80
90
100
t (ms)
Figure 38. Line Transients, 3.3 V Version,
tR = tF = 5 ms, IOUT = 30 mA
150
100
50
0.83
IOUT (mA)
VOUT (V)
0
0.82
0.81
0.80
0.79
0.78
0.77
0
10
20
30
40
50
t (ms)
60
70
80
90
Figure 39. Load Transients, 0.8 V Version,
IOUT = 50 − 100 mA, tR = tF = 0.5 ms, VIN = 1.8 V
http://onsemi.com
10
100
NCP4680
TYPICAL CHARACTERISTICS
150
100
50
IOUT (mA)
VOUT (V)
0
1.83
1.82
1.81
1.80
1.79
1.78
1.77
0
10
20
30
40
50
60
70
80
90
100
t (ms)
Figure 40. Load Transients, 1.8 V Version,
IOUT = 50 − 100 mA, tR = tF = 0.5 ms, VIN = 2.8 V
150
100
50
IOUT (mA)
VOUT (V)
0
2.83
2.82
2.81
2.80
2.79
2.78
2.77
0
10
20
30
40
50
60
70
80
90
100
t (ms)
Figure 41. Load Transients, 2.8 V Version,
IOUT = 50 − 100 mA, tR = tF = 0.5 ms, VIN = 3.8 V
150
100
50
2.83
IOUT (mA)
VOUT (V)
0
2.82
2.81
2.80
2.79
2.78
2.77
0
10
20
30
40
50
60
70
80
90
t (ms)
Figure 42. Load Transients, 3.3 V Version,
IOUT = 50 − 100 mA, tR = tF = 0.5 ms, VIN = 4.3 V
http://onsemi.com
11
100
NCP4680
TYPICAL CHARACTERISTICS
225
150
75
IOUT (mA)
VOUT (V)
0
0.90
0.85
0.80
0.75
0.70
0.65
0
10
20
30
40
50
t (ms)
60
70
80
90
100
Figure 43. Load Transients, 0.8 V Version,
IOUT = 1 − 150 mA, tR = tF = 0.5 ms, VIN = 1.8 V
225
150
75
IOUT (mA)
VOUT (V)
0
1.90
1.85
1.80
1.75
1.70
1.65
0
10
20
30
40
50
60
70
80
90
100
t (ms)
Figure 44. Load Transients, 1.8 V Version,
IOUT = 1 − 150 mA, tR = tF = 0.5 ms, VIN = 2.8 V
225
150
75
IOUT (mA)
VOUT (V)
0
2.90
2.85
2.80
2.75
2.70
2.65
0
10
20
30
40
50
60
70
80
90
t (ms)
Figure 45. Load Transients, 2.8 V Version,
IOUT = 1 − 150 mA, tR = tF = 0.5 ms, VIN = 3.8 V
http://onsemi.com
12
100
NCP4680
TYPICAL CHARACTERISTICS
225
150
75
IOUT (mA)
VOUT (V)
0
3.40
3.35
3.30
3.25
3.20
3.15
0
10
20
30
40
50
t (ms)
60
70
80
90
100
Figure 46. Load Transients, 3.3 V Version,
IOUT = 1 − 150 mA, tR = tF = 0.5 ms, VIN = 4.3 V
2.0
Chip Enable
1.5
1.0
0
0.8
0.6
IOUT = 1 mA
0.4
VCE (V)
VOUT (V)
0.5
IOUT = 100 mA
0.2
0
−0.2
0
5
10
15
20
25
t (ms)
30
35
40
45
50
Figure 47. Start−up, 0.8 V Version, VIN = 1.8 V
4
3
Chip Enable
2
0
2.0
1.5
IOUT = 1 mA
1.0
IOUT = 150 mA
0.5
0
−0.5
0
5
10
15
20
25
t (ms)
30
35
40
45
Figure 48. Start−up, 1.8 V Version, VIN = 2.8 V
http://onsemi.com
13
50
VCE (V)
VOUT (V)
1
NCP4680
TYPICAL CHARACTERISTICS
4.5
3.0
Chip Enable
1.5
0
2.5
2.0
VCE (V)
VOUT (V)
3.0
IOUT = 1 mA
1.5
1.0
IOUT = 150 mA
0.5
0
−0.5
0
5
10
15
20
25
30
35
40
45
50
t (ms)
Figure 49. Start−up, 2.8 V Version, VIN = 3.8 V
6.0
4.5
Chip Enable
3.0
0
4
3
2
IOUT = 1 mA
1
IOUT = 150 mA
VCE (V)
VOUT (V)
1.5
0
−1
0
5
10
15
20
25
30
35
40
45
50
t (ms)
Figure 50. Start−up, 3.3 V Version, VIN = 4.3 V
2.0
1.5
1.0
0
Chip Enable
0.8
0.6
IOUT = 1 mA
IOUT = 30 mA
0.4
IOUT = 100 mA
0.2
0
−0.2
0
10
20
30
40
50
60
70
80
90
t (ms)
Figure 51. Shutdown, 0.8 V Version D,
VIN = 1.8 V
http://onsemi.com
14
100
VCE (V)
VOUT (V)
0.5
NCP4680
TYPICAL CHARACTERISTICS
4
3
2
0
Chip Enable
2.0
IOUT = 1 mA
1.5
1.0
IOUT = 30 mA
0.5
IOUT = 150 mA
VCE (V)
VOUT (V)
1
0
−0.5
0
10
20
30
40
50
t (ms)
60
70
80
90
100
Figure 52. Shutdown, 1.8 V Version D,
VIN = 2.8 V
4.5
3.0
1.5
0
Chip Enable
2.5
VCE (V)
VOUT (V)
3.0
IOUT = 1 mA
2.0
1.5
IOUT = 30 mA
1.0
0.5
IOUT = 150 mA
0
−0.5
0
10
20
30
40
50
t (ms)
60
70
80
90
100
Figure 53. Shutdown, 2.8 V Version D,
VIN = 3.8 V
6.0
4.5
3.0
VOUT (V)
0
4
3
IOUT = 1 mA
IOUT = 30 mA
2
1
IOUT = 150 mA
0
−1
0
10
20
30
40
50
t (ms)
60
70
80
90
Figure 54. Shutdown, 3.3 V Version D,
VIN = 4.3 V
http://onsemi.com
15
100
VCE (V)
1.5
Chip Enable
NCP4680
APPLICATION INFORMATION
start−up into at least double the minimum equivalent load.
The minimum equivalent resistance can be computed by
formula 1:
A typical application circuit for NCP4680 series is shown
in Figure 55.
NCP4680x
VIN
VIN
C1
100n
VOUT
R EQMIN +
VOUT
CE
GND
V OUT(NOM)
I OUTMAX
(eq. 1)
This leads us to the result that the minimum equivalent
start up resistance for VOUT(NOM) < 1.8 V is:
C2
100n
R SUMIN + 2 @ R EQMIN
(eq. 2)
Enable Operation
The enable pin CE may be used for turning the regulator
on and off. The IC is switched on when a high level voltage
is applied to the CE pin. The enable pin has an internal pull
down current source. If the enable function is not needed
connect CE pin to VIN.
Figure 55. Typical Application Schematic
Input Decoupling Capacitor (C1)
A 0.1 mF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4680. Higher values and lower ESR improves line
transient response.
Output Discharger
The D version includes a transistor between VOUT and
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Output Decoupling Capacitor (C2)
A 0.1 mF ceramic output decoupling capacitor is enough
to achieve stable operation of the IC. If a tantalum capacitor
is used, and its ESR is high, loop oscillation may result. The
capacitors should be connected as close as possible to the
output and ground pins. Larger values and lower ESR
improves dynamic parameters.
Thermal
As power across the IC increase, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature increase for the
part. When the device has good thermal conductivity
through the PCB the junction temperature will be relatively
low in high power dissipation applications.
Current Limit
The NCP4680 includes fold−back type current limit
protection. Its typical characteristic for 0.8 V version is
shown in Figure 3. The advantage of this protection is that
power loss at the regulator is minimized at over current or
short circuit conditions. When the over current or short
circuit event disappears, the regulator reverts from fold back
to regulation. This kind of current limit may cause issues at
start−up for voltage versions below 1.8 V and some load
types: for these lower voltage options it is recommended to
PCB layout
Make the VIN and GND line as large as practical. If their
impedance is high, noise pickup or unstable operation may
result. Connect capacitors C1 and C2 as close as possible to
the IC, and make wiring as short as possible.
http://onsemi.com
16
NCP4680
ORDERING INFORMATION
Nominal Output
Voltage
Description
Marking
Package
Shipping†
NCP4680DMX10TCG
1.0 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DMX12TCG
1.2 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DMX15TCG
1.5 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DMX18TCG
1.8 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DMX23TCG
2.3 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DMX28TCG
2.8 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DMX30TCG
3.0 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DMX33TCG
3.3 V
Auto discharge
A (fixed)*
XDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4680DSQ08T1G
0.8 V
Auto discharge
AF08
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ09T1G
0.9 V
Auto discharge
AF09
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ12T1G
1.2 V
Auto discharge
AF12
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ15T1G
1.5 V
Auto discharge
AF15
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ18T1G
1.8 V
Auto discharge
AF18
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ25T1G
2.5 V
Auto discharge
AF25
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ28T1G
2.8 V
Auto discharge
AF28
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ30T1G
3.0 V
Auto discharge
AF30
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4680DSQ33T1G
3.3 V
Auto discharge
AF33
SC−70
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Marking codes for XDFN0808 packages are unified.
**To order other package and voltage variants, please contact your ON Semiconductor sales representative.
http://onsemi.com
17
NCP4680
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
H
K
http://onsemi.com
18
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NCP4680
PACKAGE DIMENSIONS
SOT−23 5−LEAD
CASE 1212−01
ISSUE A
A
5
E
1
L1
A1
4
2
L
3
5X
e
A2
0.05 S
B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
A
E1
b
0.10
C
M
C B
S
A
S
C
RECOMMENDED
SOLDERING FOOTPRINT*
3.30
DIM
A
A1
A2
b
c
D
E
E1
e
L
L1
5X
0.85
5X
0.95
PITCH
0.56
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
19
MILLIMETERS
MIN
MAX
--1.45
0.00
0.10
1.00
1.30
0.30
0.50
0.10
0.25
2.70
3.10
2.50
3.10
1.50
1.80
0.95 BSC
0.20
--0.45
0.75
NCP4680
PACKAGE DIMENSIONS
XDFN4 0.8x0.8, 0.48P
CASE 711AB−01
ISSUE O
PIN ONE
REFERENCE
2X
0.05 C
4X
A
B
D
ÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINALS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L3
L2
0.06
E
REF
DETAIL A
DIM
A
A1
A3
b
D
D2
E
e
L
L2
L3
0.05 C
2X
TOP VIEW
0.07
(A3)
0.05 C
4X
0.17
0.37
A
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
DETAIL B
RECOMMENDED
MOUNTING FOOTPRINT*
e
e/2
DETAIL A
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.10 REF
0.17
0.27
0.80 BSC
0.20
0.30
0.80 BSC
0.48 BSC
0.23
0.33
0.17
0.27
0.01
0.11
1
4X
D2
2
0.27
3X
0.44
45 5
0.32
3X
L
4
PACKAGE
OUTLINE
3
4X
b
0.05
M
BOTTOM VIEW
1.00
DETAIL B
C A B
0.48
PITCH
NOTE 3
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
20
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP4680/D