PA1162 RF Linear Hybrid Power Amplifier - 4 Watts 800 to 960 MHz Features • • • • Rev. V4 Product Image LOW NOISE FIGURE: 2.0 dB (TYP.) HIGH GAIN: 28 dB (TYP.) HIGH P1dB: +35.5 dBm (TYP.) HIGH IP3: +50 dBm (TYP.) Description The PA1162 is a discrete hybrid linear power amplifier design, which uses thick film solder manufacturing processes for accurate performance and high reliability. This 2 stage GaAs FET transistor design uses feedback loops for flat broadband linear performance, with very low noise figure. The model is particularly suited for power driver applications used in the base station & repeater infrastructure, and for commercial & military radios, where ultra high linearity is critical. Ordering Information Part Number Package PA1162 Flange Mount Carrier Electrical Specifications: Z0 = 50Ω, VCC = +12 VDC Parameter Typical Gurarnteed 25ºC 0ºC to +70ºC Units Frequency MHz 800-960 800-960 Small Signal Gain (min) dB 28.0 26.0 Gain Flatness (max) dB + 0.5 dB 2.0 3.5 Power Output @ 1.0 dB Comp. (min.) dBm +35.5 +34.0 Output IP3 dBm +50.0 DC Current @ +12 Volts (max.) mA Parameter Absolute Maximum Storage Temperature -40ºC to +85ºC Operation Base Temperature +70ºC Max. DC VOltage +13 Vdc Max. Continuous RF Input Power +15 dBm + 1.0 Noise Figure (max) VSWR Input / Output (max.) Absolute Maximum Ratings Thermal Data: VCC = +12 VDC Parameter Rating 2.0:1 2.3:1 Thermal Resistance θjc +7.6ºC/W 825 900 Junction Temperature Rise Above Case Tjc +75ºC 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. PA1162 RF Linear Hybrid Power Amplifier - 4 Watts 800 to 960 MHz Typical Performance Curves at +25°C Rev. V4 Outline Drawing: Flange Mount Carrier * GAIN G ain - 29.0 M/A-COM 28.0 27.0 800 820 840 860 880 900 920 940 960 FREQUENCY - MHZ VSWR 2.0 I nput V SWR VSWR Out put V SWR 1.5 WEIGHT: 18.8 grams (0.67 oz.) max 1.0 800 820 840 860 880 900 920 940 960 FREQUENCY - MHZ Recommended Mounting Notes: 1.) Since the PA1162 is a high frequency design, it is important that a very good electrical ground exists and that low loss transmission lines connecting the RF terminals have a 50 ohm characteristic impedance. For example: for 0.062” thick G-10 fiberglass PCB material (1oz clad, both sides), a 50 ohm line microstrip is 0.100 inches wide. Pow er O utput - Noise Figure - dB NOISE FIGURE 2.2 2.0 1.8 800 820 840 860 880 900 920 940 960 FREQUENCY - MHz POWER OUTPUT* 36.0 35.0 34.0 800 820 840 860 880 900 920 940 960 Intercept Point - dBm FREQUENCY - MHz * @ 1.0 dB Gain Compression 51.0 2.) For the PWB, It is advisable to provide sufficient plated ground through holes for good transfer of the electrical ground plane from front to back to the PCB. The ground vias also serve as good thermal conductors to dissipate the heat generated by the PA module. For the DC transmission line portion, It is a good practice to add external bypass capacitors with >/= 0.1 uF, to prevent any RF feedback from circulating on the DC lines. 3.) The specified flatness over the entire length of the bottom surface of the PA1162 flange is within .0015”. The cavity of the subsystem baseplate should be machined to a similar overall flatness so as to not cause any potential grounding discontinuities. Thermal grease can be used as an interface between the PA and subsystem floor to optimize the heat transfer efficiency. The baseplate needs to provide sufficient heatsinking for the PA module to operate normally. 4.) All interfacing RF, bias, and ground pins are an edge clip design on the side soldered onto the PWB of the PA1162. The pins are both mechanically and solder attached above and below the board. So they will be structurally held in place, even if the solder connection reflows. It is advisable that SN63 solder be used to spot reflow the pins to the mating circuit board. THIRD ORDER INTERCEPT POINT * 5.) To avoid any chance of impedance mismatch on the RF interface connections, it is advisable to mount the PA module as close as possible against the side of the circuit board, to avoid any air gaps which could introduce unwanted parasitic effects. 50.0 49.0 800 * DIMENSIONS ARE IN INCHES 820 840 860 880 900 FREQUENCY - MHz * Output Pow er = +15 dBm 920 940 960 6.) Based on the outline dimensions of the PA module, the depth of the cavity along side the subsystem PWB, should be enough so that when the module is mounted in place, there should be a ~ .003” gap between the top side of the circuit board trace and the bottom side of the mating pin. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.