ONSEMI MC14538BDG

MC14538B
Dual Precision
Retriggerable/Resettable
Monostable Multivibrator
The MC14538B is a dual, retriggerable, resettable monostable
multivibrator. It may be triggered from either edge of an input pulse,
and produces an accurate output pulse over a wide range of widths, the
duration and accuracy of which are determined by the external timing
components, CX and RX. Output Pulse Width T = RX @ CX (secs)
RX = W
CX = Farads
Features
•
•
•
•
•
•
•
•
•
•
•
Unlimited Rise and Fall Time Allowed on the A Trigger Input
Pulse Width Range = 10 ms to 10 s
Latched Trigger Inputs
Separate Latched Reset Inputs
3.0 Vdc to 18 Vdc Operational Limits
Triggerable from Positive (A Input) or Negative−Going Edge (B−Input)
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load Over the Rated Temperature Range
Pin−for−pin Compatible with MC14528B and CD4528B (CD4098)
Use the MC54/74HC4538A for Pulse Widths Less Than 10 ms with
Supplies Up to 6 V
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
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MARKING
DIAGRAMS
PDIP−16
P SUFFIX
CASE 648
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
±10
mA
PD
Power Dissipation, per Package
(Note 1)
500
mW
TA
Operating Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
Vin, Vout
Iin, Iout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 10
1
16
14538BG
AWLYWW
1
16
SOIC−16WB
DW SUFFIX
CASE 751G
14538BG
AWLYYWW
1
16
Value
VDD
Parameter
MC14538BCP
AWLYYWWG
SOIC−16
D SUFFIX
CASE 751B
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
16
1
TSSOP−16
DT SUFFIX
CASE 948F
14
538B
ALYWG
G
1
16
SOEIAJ−16
F SUFFIX
CASE 966
MC14538B
ALYWG
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Indicator
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
MC14538B/D
MC14538B
PIN ASSIGNMENT
BLOCK DIAGRAM
CX
VSS
1
16
VDD
CX/RXA
2
15
VSS
RESET A
3
14
CX/RXB
AA
4
13
RESET B
BA
5
12
AB
QA
6
11
BB
QA
7
10
QB
VSS
8
9
QB
1
4
5
1 ms
10 ms
100 ms
1 ms
10 ms
VDD
2
A
B
Q1
6
Q1
RESET
7
3
CX
ONE−SHOT SELECTION GUIDE
100 ns
MC14528B
MC14536B
MC14538B
RX
100 ms
RX
15
1s
12
10 s
23 HR
5 MIN.
MC14541B
MC4538A*
11
VDD
14
A
Q2
B
Q2
RESET
10
9
13
RX AND CX ARE EXTERNAL COMPONENTS.
VDD = PIN 16
VSS = PIN 8, PIN 1, PIN 15
*LIMITED OPERATING VOLTAGE (2 - 6 V)
TOTAL OUTPUT PULSE WIDTH RANGE
RECOMMENDED PULSE WIDTH RANGE
ORDERING INFORMATION
Package
Shipping†
MC14538BCPG
PDIP−16
(Pb−Free)
500 Units / Rail
MC14538BDG
SOIC−16
(Pb−Free)
48 Units / Rail
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
TSSOP−16
(Pb−Free)
2500 Units / Tape & Reel
SOIC−16 WB
(Pb−Free)
47 Units / Rail
SOIC−16 WB
(Pb−Free)
1000 Units / Tape & Reel
MC14538BFG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC14538BFELG
SOEIAJ−16
(Pb−Free)
2000 Units / Tape & Reel
Device
NLV14538BDG*
MC14538BDR2G
NLV14538BDR2G*
MC14538BDTR2G
NLV14538BDTR2G*
MC14538BDWG
NLV14538BDWG*
MC14538BDWR2G
NLV14538BDWR2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC14538B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Symbol
Characteristic
Output Voltage
Vin = VDD or 0
VDD
Vdc
− 55_C
25_C
125_C
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current, Pin 2 or 14
Iin
15
−
± 0.05
−
± 0.00001
± 0.05
−
± 0.5
mAdc
Input Current, Other Inputs
Iin
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
mAdc
Input Capacitance, Pin 2 or 14
Cin
−
−
−
−
25
−
−
−
pF
Input Capacitance, Other Inputs
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
Q = Low, Q = High
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Quiescent Current, Active State
(Both) (Per Package)
Q = High, Q = Low
IDD
5.0
10
15
−
−
−
2.0
2.0
2.0
−
−
−
0.04
0.08
0.13
0.20
0.45
0.70
−
−
−
2.0
2.0
2.0
mAdc
IT
5.0
10
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
Total Supply Current at an external
load capacitance (CL) and at
external timing network (RX, CX)
(Note 3)
IOH
Vdc
Vdc
mAdc
IT = (3.5 x 10–2) RXCXf + 4CXf + 1 x 10–5 CLf
IT = (8.0 x 10–2) RXCXf + 9CXf + 2 x 10–5 CLf
IT = (1.25 x 10–1) RXCXf + 12CXf + 3 x 10–5 CLf
where: IT in mA (one monostable switching only),
where: CX in mF, CL in pF, RX in k ohms, and
where: f in Hz is the input frequency.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
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mAdc
MC14538B
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SWITCHING CHARACTERISTICS (Note 4) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise Time
tTLH = (1.35 ns/pF) CL + 33 ns
tTLH = (0.60 ns/pF) CL + 20 ns
tTLH = (0.40 ns/pF) CL + 20 ns
tTLH
Output Fall Time
tTHL = (1.35 ns/pF) CL + 33 ns
tTHL = (0.60 ns/pF) CL + 20 ns
tTHL = (0.40 ns/pF) CL + 20 ns
tTHL
Propagation Delay Time
A or B to Q or Q
tPLH, tPHL = (0.90 ns/pF) CL + 255 ns
tPLH, tPHL = (0.36 ns/pF) CL + 132 ns
tPLH, tPHL = (0.26 ns/pF) CL + 87 ns
tPLH,
tPHL
All Types
VDD
Vdc
Min
Typ
(Note 5)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
5.0
10
15
−
−
−
100
50
40
200
100
80
Unit
ns
ns
ns
5.0
10
15
−
−
−
300
150
100
600
300
220
5.0
10
15
−
−
−
250
125
95
500
250
190
5
10
15
−
−
−
−
−
−
15
5
4
ms
B Input
5
10
15
−
−
−
300
1.2
0.4
1.0
0.1
0.05
ms
A Input
5
10
15
Reset to Q or Q
tPLH, tPHL = (0.90 ns/pF) CL + 205 ns
tPLH, tPHL = (0.36 ns/pF) CL + 107 ns
tPLH, tPHL = (0.26 ns/pF) CL + 82 ns
Input Rise and Fall Times
Reset
Input Pulse Width
A, B, or Reset
ns
tr, tf
−
No Limit
tWH,
tWL
5.0
10
15
170
90
80
85
45
40
−
−
−
ns
Retrigger Time
trr
5.0
10
15
0
0
0
−
−
−
−
−
−
ns
Output Pulse Width — Q or Q
Refer to Figures 8 and 9
CX = 0.002 mF, RX = 100 kW
T
ms
5.0
10
15
198
200
202
210
212
214
230
232
234
CX = 0.1 mF, RX = 100 kW
5.0
10
15
9.3
9.4
9.5
9.86
10
10.14
10.5
10.6
10.7
ms
CX = 10 mF, RX = 100 kW
5.0
10
15
0.91
0.92
0.93
0.965
0.98
0.99
1.03
1.04
1.06
s
5.0
10
15
−
−
−
± 1.0
± 1.0
± 1.0
± 5.0
± 5.0
± 5.0
%
Pulse Width Match between circuits in
the same package.
CX = 0.1 mF, RX = 100 kW
100
[(T1 – T2)/T1]
4. The formulas given are for the typical characteristics only at 25_C.
5. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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OPERATING CONDITIONS
External Timing Resistance
RX
−
5.0
−
(Note 6)
kW
External Timing Capacitance
CX
−
0
−
No Limit
(Note 7)
mF
6. The maximum usable resistance RX is a function of the leakage of the capacitor CX, leakage of the MC14538B, and leakage due to board
layout and surface resistance. Susceptibility to externally induced noise signals may occur for RX > 1 MW..
7. If CX > 15 mF, use discharge protection diode per Fig. 11.
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MC14538B
VDD
VDD
P1
RX
2 (14)
CX
+
C1
-
Vref1
1 (15)
ENABLE
+
C2
-
Vref2
ENABLE
R
Q
OUTPUT
LATCH
S
Q
N1
A
VSS
4 (12)
6(10)
7(9)
CONTROL
5 (11)
B
RESET
QR
S
3 (13)
NOTE: Pins 1, 8 and 15 must
be externally grounded
QR
R
RESET LATCH
Figure 1. Logic Diagram
(1/2 of DevIce Shown)
VDD
500 pF
0.1 mF
CERAMIC
ID
RX ′
RX
VSS
CX ′
CX
Vin
VSS
CX/RX
A
B
Q
RESET
Q
A′
Q′
B′
Q′
20 ns
CL
20 ns
VDD
90%
CL
CL
10%
Vin
0V
CL
RESET′
VSS
Figure 2. Power Dissipation Test Circuit and Waveforms
VDD
INPUT CONNECTIONS
RX ′
RX
VSS
PULSE
GENERATOR
PULSE
GENERATOR
PULSE
GENERATOR
A
Characteristics
*CL = 50 pF
CX ′
CX
VSS
CX/RX
B
Q
RESET
Q
A′
Q′
B′
CL
CL
CL
Q′
CL
RESET′
VSS
Reset
A
B
tPLH, tPHL, tTLH, tTHL,
T, tWH, tWL
VDD
PG1
VDD
tPLH, tPHL, tTLH, tTHL,
T, tWH, tWL
VDD
VSS
PG2
tPLH(R), tPHL(R),
tWH, tWL
PG3
PG1
PG2
*Includes capacitance of probes,
wiring, and fixture parasitic.
NOTE: Switching test waveforms
for PG1, PG2, PG3 are shown
In Figure 4.
Figure 3. Switching Test Circuit
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5
PG1 =
PG2 =
PG3 =
MC14538B
90%
10%
tTHL
50%
A
tTLH
tWH
50%
tTHL
B
VDD
tTLH
90%
10%
50%
VDD
tWL
tTHL
RESET
tPHL
90%
10%
tPLH
50%
tTHL
tPLH
T
50%
Q
tPHL
Q
50%
tTHL
tPLH
90%
10%
50%
trr
tPHL
50%
tTLH
tPHL
tWL
tTLH
90%
10%
50%
VDD
50%
50%
50%
TA = 25°C
RX = 100 kW
CX = 0.1 mF
NORMALIZED PULSE WIDTH CHANGE
WITH RESPECT TO VALUE AT VDD = 10 V (%)
RELATIVE FREQUENCY OF OCCURRENCE
Figure 4. Switching Test Waveforms
0% POINT PULSE WIDTH
VDD = 5.0 V, T = 9.8 ms
VDD = 10 V, T = 10 ms
VDD = 15 V, T = 10.2 ms
1.0
0.8
0.6
0.4
0.2
0
RX = 100 kW
CX = 0.1 mF
2
1
0
1
2
5
-4 -2
0
2
4
T, OUTPUT PULSE WIDTH (%)
Figure 5. Typical Normalized Distribution
of Units for Output Pulse Width
6
7
8
9
10
11
12
VDD, SUPPLY VOLTAGE (VOLTS)
FUNCTION TABLE
TOTAL SUPPLY CURRENT ( μA)
Inputs
RX = 100 kW, CL = 50 pF
ONE MONOSTABLE SWITCHING ONLY
VDD = 15 V
5.0 V
10
10 V
1.0
0.1
0.001
14
Figure 6. Typical Pulse Width Variation as
a Function of Supply Voltage VDD
1000
100
13
0.1
1.0
10
Reset
A
H
H
L
H
H
H
H
H
L
100
OUTPUT DUTY CYCLE (%)
Figure 7. Typical Total Supply Current
versus Output Duty Cycle
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Outputs
B
Q
Q
H
L
Not Triggered
Not Triggered
L, H,
L
H
L, H,
Not Triggered
Not Triggered
X
X
X
X
L
H
Not Triggered
15
RX = 100 kW
CX = 0.1 mF
VDD = 15 V
2
1
VDD = 10 V
0
VDD = 5 V
-1
TYPICAL NORMALIZED ERROR
WITH RESPECT TO 25°C VALUE AT VDD = 10 V (%)
TYPICAL NORMALIZED ERROR
WITH RESPECT TO 25°C VALUE AT VDD = 10 V (%)
MC14538B
RX = 100 kW
CX = .002 mF
3.0
2.0
1.0
0
-1.0
-2
VDD = 15 V
VDD = 10 V
-2.0
VDD = 5.0 V
-3.0
-60 -40
-20
0
20
40
60
80 100
TA, AMBIENT TEMPERATURE (°C)
120
140
-60 -40
Figure 8. Typical Error of Pulse Width
Equation versus Temperature
-20
0
20
40
60
80 100
TA, AMBIENT TEMPERATURE (°C)
Figure 9. Typical Error of Pulse Width
Equation versus Temperature
THEORY OF OPERATION
1
3
4
A
2
B
5
RESET
Vref2
Vref2
CX/RX
Vref2
Vref2
Vref1
Vref1
Vref1
Vref1
Q
T
120 140
T
T
1
Positive edge trigger
4
Positive edge re−trigger (pulse lengthening)
2
Negative edge trigger
5
Positive edge re−trigger (pulse lengthening)
3
Positive edge trigger
Figure 10. Timing Operation
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MC14538B
TRIGGER OPERATION
on Reset sets the reset latch and causes the capacitor to be
fast charged to VDD by turning on transistor P1 ➄. When the
voltage on the capacitor reaches Vref 2, the reset latch will
clear, and will then be ready to accept another pulse. It the
Reset input is held low, any trigger inputs that occur will be
inhibited and the Q and Q outputs of the output latch will not
change. Since the Q output is reset when an input low level
is detected on the Reset input, the output pulse T can be made
significantly shorter than the minimum pulse width
specification.
The block diagram of the MC14538B is shown in
Figure 1, with circuit operation following.
As shown in Figure 1 and 10, before an input trigger
occurs, the monostable is in the quiescent state with the Q
output low, and the timing capacitor CX completely charged
to VDD. When the trigger input A goes from VSS to VDD
(while inputs B and Reset are held to VDD) a valid trigger is
recognized, which turns on comparator C1 and N−channel
transistor N1 ➀. At the same time the output latch is set. With
transistor N1 on, the capacitor CX rapidly discharges toward
VSS until Vref1 is reached. At this point the output of
comparator C1 changes state and transistor N1 turns off.
Comparator C1 then turns off while at the same time
comparator C2 turns on. With transistor N1 off, the capacitor
CX begins to charge through the timing resistor, RX, toward
VDD. When the voltage across CX equals Vref 2, comparator
C2 changes state, causing the output latch to reset (Q goes
low) while at the same time disabling comparator C2 ➁. This
ends at the timing cycle with the monostable in the quiescent
state, waiting for the next trigger.
In the quiescent state, CX is fully charged to VDD causing
the current through resistor RX to be zero. Both comparators
are “off” with total device current due only to reverse
junction leakages. An added feature of the MC14538B is
that the output latch is set via the input trigger without regard
to the capacitor voltage. Thus, propagation delay from
trigger to Q is independent of the value of CX, RX, or the duty
cycle of the input waveform.
POWER−DOWN CONSIDERATIONS
Large capacitance values can cause problems due to the
large amount of energy stored. When a system containing
the MC14538B is powered down, the capacitor voltage may
discharge from VDD through the standard protection diodes
at pin 2 or 14. Current through the protection diodes should
be limited to 10 mA and therefore the discharge time of the
VDD supply must not be faster than (VDD). (C) / (10 mA).
For example, if VDD = 10 V and CX = 10 mF, the VDD supply
should discharge no faster than (10 V) x (10 mF) / (10 mA)
= 10 ms. This is normally not a problem since power
supplies are heavily filtered and cannot discharge at this rate.
When a more rapid decrease of VDD to zero volts occurs,
the MC14538B can sustain damage. To avoid this possibility
use an external clamping diode, DX, connected as shown in
Fig. 11.
Dx
RETRIGGER OPERATION
Cx
Rx VDD
VSS
The MC14538B is retriggered if a valid trigger occurs ➂
followed by another valid trigger ➃ before the Q output has
returned to the quiescent (zero) state. Any retrigger, after the
timing node voltage at pin 2 or 14 has begun to rise from
Vref 1, but has not yet reached Vref 2, will cause an increase
in output pulse width T. When a valid retrigger is initiated
➃, the voltage at CX/RX will again drop to Vref 1 before
progressing along the RC charging curve toward VDD. The
Q output will remain high until time T, after the last valid
retrigger.
VDD
Q
Q
RESET
Figure 11. Use of a Diode to Limit
Power Down Current Surge
RESET OPERATION
The MC14538B may be reset during the generation of the
output pulse. In the reset mode of operation, an input pulse
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8
MC14538B
TYPICAL APPLICATIONS
CX
RX
CX
RX
VDD
RISING-EDGE
TRIGGER
A
Q
B
Q
VDD
RISING-EDGE
A
TRIGGER
B
Q
Q
B = VDD
RESET = VDD
CX
RESET = VDD
CX
RX
VDD
VDD
A = VSS
Q
B
FALLING-EDGE
TRIGGER
RX
Q
A
B
Q
Q
FALLING-EDGE
TRIGGER
RESET = VDD
RESET = VDD
Figure 12. Retriggerable
Monostables Circuitry
Figure 13. Non−Retriggerable
Monostables Circuitry
NC
A
B
Q
NC
Q
NC
CD
VDD
VDD
Figure 14. Connection of Unused Sections
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9
MC14538B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
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10
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14538B
PACKAGE DIMENSIONS
SOIC−16 WB
CASE 751G−03
ISSUE D
A
D
9
1
8
16X
M
T A
h X 45 _
MILLIMETERS
DIM MIN
MAX
A
2.35
2.65
A1 0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0_
7_
S
B
S
L
A
0.25
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B
B
14X
e
A1
H
E
0.25
8X
M
B
M
16
q
C
T
SEATING
PLANE
SOLDERING FOOTPRINT
16X
0.58
11.00
1
16X
1.27
PITCH
1.62
DIMENSIONS: MILLIMETERS
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11
MC14538B
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
B
M
S
DIM
A
B
C
D
F
G
J
K
M
P
R
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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12
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14538B
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
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13
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC14538B
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966
ISSUE A
16
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
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MC14538B/D