HALOGEN Shielded Power Inductors HF Pb FREE SD8350 Series Applications • • • • • • • Server/notebook power High power LED driver, portable devices Base station, telecom, and networking Battery chargers, RAM power supply Industrial and automotive power systems Noise filtering output filter chokes Buck/boost converters, output converters Environmental Data • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient plus self temperature rise) • Solder reflow temperature: J-STD-020D compliant SMD Device Description Packaging • • • • • • • • • • Supplied in tape and reel packaging, 750 parts per 13 inch dia. reel Halogen free, lead free 125°C maximum total temperature operation Low-profile surface mount inductor 9.5 x 8.3 x 4.5mm shielded drum core Ferrite core material Inductance range from 1.5µH to 100µH Current range from 0.8 Amps to 9.1 Amps Frequency range up to 1MHz RoHS Compliant Part Number SD8350-1R8-R SD8350-3R9-R SD8350-4R7-R SD8350-6R8-R SD8350-100-R SD8350-150-R SD8350-220-R SD8350-330-R SD8350-470-R SD8350-680-R SD8350-101-R Rated Inductance (µH) 1.8 3.9 4.7 6.8 10 15 22 33 47 68 100 OCL1 µH±30% 1.5 3.2 4.2 6.8 9.9 13.6 20.4 31.4 44.9 65.1 99.7 Product Specifications Irms2 Isat3 (Amps) (Amps) 5.50 9.1 4.50 6.3 4.10 5.5 3.90 4.4 3.20 4.0 2.30 2.9 1.80 2.6 1.40 2.2 1.30 1.8 1.00 1.5 0.80 1.3 1. Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc. 2. Irms: DC current for an approximate ΔT of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 3. Isat Amps peak for approximately 35% rolloff (@25°C) 0911 BU-SB111111 DCR mΩ @ 20°C Typical 11.8 16.2 18.5 20.8 31.4 45.0 63.5 111.4 130.0 200.8 308.0 DCR mΩ @ 20°C Maximum 14.0 19.0 22.0 25.0 36.0 53.0 75.0 125.0 150.0 240.0 360.0 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*ΔI, Bp-p (mT), K: (K factor from table), L: (Inductance in µH), ΔI (Peak to peak ripple current in Amps). 5. Part Number Definition: SD8350-xxx-R SD8350 = Product code and size; -xxx = Inductance value in µH; R = decimal point; If no R is present, third character = # of zeros. -R suffix = RoHS compliant Page 1 of 4 Data Sheet: PM-4146 K-factor4 16.0 9.6 8.5 7.6 6.3 5.3 4.4 3.5 2.9 2.4 2.0 Dimensions - mm SCHEM A TIC RECOMM ENDED PCB LAYOUT TOP VIEW FRONT VI EW BOTTOM VIEW 2.5 8.3 max. 1 2.9 1 4.5 max. 1.2 1.8 XX X wwlly R 6.3 9.5 max. LEFT VIEW 5.7 2 2 Part Marking: Coiltronics logo xxx = Inductance value in μH. (R = Decimal point). If no R is present, third character = number of zeros wwlly - or - wwllyy = Date code R = Revision level Packaging Information - mm Supplied in tape-and-reel packaging, 750 parts per reel, 13” diameter reel. Temperature Rise vs.Total Loss 140 Temperature Rise (°C) 120 100 80 60 40 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Total Loss (W) 0911 BU-SB111111 Page 2 of 4 Data Sheet: PM-4146 0.9 1 Core Loss 10 300kHz 1MHz 500kHz 100kHz 1 Core Loss (W) 200kHz 0. 1 0. 01 0. 001 0. 000 1 1 10 100 100 0 Bp-p (mT) Inductance Characteristics OCL Vs. Isat 120% 100% % OCL 80% 60% +85 Deg. C +25 Deg. C -40 Deg. C 40% 20% 0% 0% 20% 40% 60% 80% 100% 120% % Isat 0911 BU-SB111111 Page 3 of 4 Data Sheet: PM-4146 140% Solder Reflow Profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness <2.5mm _2.5mm > Temperature TL Preheat A T smax Table 1 - Standard SnPb Solder (T c) t Volume mm3 <350 235°C 220°C Volume mm3 _ >350 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin 25°C ts Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. Time 25°C to Peak Temperature * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2011 Cooper Bussmann w w w. c o o p e r bu s s m a n n . c o m 0911 BU-SB111111 Page 4 of 4 Data Sheet: PM-4146