Dual Winding, High Power, Shielded Drum Inductor Pb DRAQ127 Series Applications • • • • • • • Automotive electronics (under the hood, interior and exterior) Telematics LED Modules DC-DC Converters Transformer, 1:1 Flyback, SEPIC Inductor, buck, boost, forward and resonant converters Noise filtering and filter chokes Environmental Data • Storage temperature range: -40°C to +165°C • Operating temperature range: -40°C to +165°C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020D compliant • Complies with AEC-Q200 standard SMD Device Description • • • • • • • • • 165°C Maximum total temperature operation Automotive grade shielded drum core 12.5 x 12.5 x 8.0mm maximum surface mount package Ferrite core material Dual winding inductors that can be used as a single inductor, SEPIC, Flyback, or other coupled inductor/transformer applications (1:1 turns ratio) Windings can be connected in series or parallel, offering a wide range of inductance and current ratings 200Vac isolation between windings Mechanical secure mounting for high shock and vibration environments RoHS compliant Packaging • Supplied in tape and reel packaging, 350 parts per 13” reel Product Specifications Part Number6 OCL1 ±25% (μH) 2 Irms (Amps) Isat13 @25°C (Amps) Isat24 @125°C (Amps) DCR (Ω) @20°C (Typical) DCR (Ω) @20°C (Maximum) K-Factor5 8.96 6.05 0.018 0.040 0.022 0.047 24.0 16.2 4.48 3.03 0.072 0.162 0.089 0.192 12.0 8.1 Parallel Ratings DRAQ127-100-R DRAQ127-220-R 9.63 22.0 6.02 3.98 11.2 7.57 DRAQ127-100-R DRAQ127-220-R 38.52 88.00 3.01 1.99 5.60 3.79 Series Ratings 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc 2. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 165°C under worst case operating conditions verified in the end application. 3. Isat1: Peak current for approximately 30% rolloff at +25°C. 4. Isat2: Peak current for approximately 40% rolloff at +125°C. 0710 BU-SB10746 Page 1 of 4 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak-to-peak ripple current in Amps). 6. Part Number Definition: DRAQxxx-xxx-R - DRAQxxx = Product code and size - xxx= Inductance value in uH, R = decimal point, If no R is present then 3rd digit equals number of zeros. - “-R” suffix = RoHS compliant Data Sheet: 4372 Dimensions - mm 1.6 typ 8.0 m ax 3 3 4 B ottom V iew S ide V iew 12.2 ±0.3 R ecom m ended P ad Layout D ual Inductor M ode S eries Inductor M ode 3.85 3.85 4 Top V iew D R AQ 127 xxx w w llyy 1 12.2 ±0.3 4 10.0 typ 1 4 2 3 0.50 2.50 2.50 2 3 2.0 typ P art m arking: D R A Q 127 13.80 13.80 1 2 2 1 0.50 1.7 typ xxx=(Inductance value in µH ) w w llyy= D ate code S chem atics 1 2 L1 1 L2 3 2 L1 4 3 D ual Inductor 1 L2 2 L1 4 L2 3 4 P arallel M ode S eries M ode Packaging Information - mm Supplied in tape and reel packaging, 350 parts per 13” diameter reel. Temperature Rise vs. Total Loss 80 70 Temp. Rise(°C) 60 50 40 30 20 10 0 0 0 .1 0 .2 0 .3 0 .4 0 .5 0 .6 0 .7 0 .8 0 .9 Total Loss (W) 0710 BU-SB10746 Page 2 of 4 Data Sheet: 4372 1 1 .1 1 .2 1 .3 1 .4 1 .5 Core Loss Core Loss vs. Bp-p 1MHz 500kHz 200kHz 300kHz 100kHz 10 Core Loss (W) 1 0 .1 0 .0 1 10 0 10 0 0 10 0 0 0 Bp-p (Gauss) Inductance Characteristics % of OCL vs. % of Isat1 120% 110% 100% 90% 80% % of OCL 70% -4 0°C 60% 50% +2 5°C 40% 30% +8 5°C 20% +1 2 5°C 10% 0% 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% % of Isat1 0710 BU-SB10746 Page 3 of 4 Data Sheet: 4372 100% 110% 120% 130% 140% Solder Reflow Profile TP TC -5°C Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (T c) tP t Volume mm3 <350 235°C 220°C Volume mm3 _ >350 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm ts 25°C Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. © 2010 Cooper Bussmann S t . L o u i s, M O 6 3 1 7 8 w w w. c o o p e r bu s s m a n n . c o m 0710 BU-SB10746 Page 4 of 4 Data Sheet: 4372