XC25BS5 Series ETR1502_003a PLL Clock Generator ICs with Built-In Divider/Multiplier Circuits (For Low Frequency Range) ■GENERAL DESCRIPTION The XC25BS5 series are high frequency, low power consumption PLL clock generator ICs with divider circuit & multiplier PLL circuit. Laser trimming gives the option of being able to select from divider ratios (M) of 1,3 to 2047 and multiplier ratios (N) of 6 to 2047. Output frequency (Q0) is equal to reference oscillation (fCLKin) multiplied by N/M, within a range of 3MHz to 30MHz. Q1 output is selectable from input reference frequency (f0), input reference frequency/2 (f0/2), ground (GND), and comparative frequency (f0/M). Further, comparative frequencies, within a range of 12KHz to 500KHz, can be obtained by dividing the reference oscillation. By halting operation via the CE pin, consumption current can be controlled and output will be one of high-impedance. ■FEATURES ■APPLICATIONS Output Frequency : 3MHz ~ 30MHz (Q0=fCLKin×N/M) Input Frequency (fCLKin) : 12kHz ~ 35MHz Divider Ratio (M) : Selectable from divisions of 1, 3~2047 Multiplier Ratio (N) : Selectable from multiplications of 6~2047 Output : 3-State Q1 output selectable from input reference ●Crystal oscillation modules ●Personal computers ●PDAs ●Portable audio systems ●Various system clocks oscillation, input reference oscillation/2, GND, comparative frequency. Operating Voltage Range : 2.97V ~ 5.5V Low Power Consumption : CMOS (stand-by function included)*1 Comparative Frequency : 12kHz~500kHz Package : SOT-26, USP-6B *1 High output impedance during standby Environmentally Friendly: EU RoHS Compliant, Pb Free ■PIN CONFIGURATION Q1 6 VDD 5 CLKin 4 ■PIN ASSIGNMENT 1 Q0 2 VSS 3 CE USP-6B (BOTTOM VIEW) SOT-26 (TOP VIEW) *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VDD pin. PIN NUMBER SOT-26 USP-6B 1 3 2 2 3 1 PIN NAME CE VSS Q0 4 6 Q1 5 6 5 4 VDD CLKin FUNCTION Chip Enable GND PLL Output Reference Oscillation, Reference Oscillation/2, GND, or Comparative Frequency Output Power Supply Reference Clock Input ■FUNCTION LIST C E Q0/Q1 Pin Function ●CE, "H" "L" Open FUNCTION Q0, Q1 Clock Output Stand-by. Output Pin = High Impedance Stand-by. Output Pin = High Impedance (VSS Pin Pull-Down Due to IC's Internal Resistor) "H" = High level "L" = Low level 1/12 XC25BS5 Series ■PRODUCT CLASSIFICATION ●Ordering Information XC25BS5①②③④⑤-⑥(*1) DESIGNATOR DESCRIPTION SYMBOL ①②③ Product Number Integer Packages Taping Type (*2) MR MR-G DR DR-G ④⑤-⑥ (*1) (*2) DESCRIPTION Based on internal standards e.g. Product number 001 → ①②③ = 001 SOT-26 SOT-26 USP-6B USP-6B The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: ④R-⑥, Reverse orientation: ④L-⑥) ٛ ■ BLOCK DIAGRAM ■ ABSOLUTE MAXIMUM RATINGS Ta = 25℃ PARAMETER SYMBOL CONDITIONS UNITS Supply Voltage VDD VSS-0.3 ~ VSS+7.0 V CLKin Pin Voltage VCK VSS-0.3 ~ VDD+0.3 V CE Pin Voltage VCE VSS-0.3 ~ VDD+0.3 V Q0 Pin Voltage VQ0 VSS-0.3 ~ VDD+0.3 V Q1 Pin Voltage VQ1 VSS-0.3 ~ VDD+0.3 V Q0 Output Current IQ0 ±50 mA ±50 mA Q0 Output Current Power Dissipation IQ1 SOT-26 USP-6B Pd 150 100 mW Operating Temperature Range Topr - 30 ~ + 80 ℃ Storage Temperature Range Tstg - 40 ~ +125 ℃ 2/12 XC25BS5 Series ■ FREQUENCY CONFIGURATION: EXAMPLE 1 XC25BS51XXMR PARAMETER SYMBOL MIN. TYP. MAX. UNITS Input Frequency f CLKin 11.0000 - 16.9344 MHz Multiplier/Divider Ratio N/M - 1.594 - - PLL Output Frequency fQ0 17.5383 - 27.0000 MHz Q1 Output Frequency Q1 ● Electrical Characteristics (DC) XC25BS51xxMR GND - fCLKin = 16.9344MHz, Multiplier/Divider Ratio = 1.594, Ta = 25℃, No Load PARAMETER SYMBOL Supply Voltage MIN. TYP. MAX. UNITS VDD 2.97 3.30 3.63 V Input Voltage "High" VIH 2.7 - - V Input Voltage "Low" VIL - - 0.6 V Input Current "High" IIH VCK = 3.3V - - 3.0 μA Input Current "Low" IIL VCK = 0V -3.0 - - μA Output Voltage "High" VOH VDD = 2.97V, IOH = -8mA 2.5 - - V Output Voltage "Low" VOL VDD = 2.97V, IOL = 8mA - - 0.4 V Supply Current 1 IDD1 CE = 3.3V - 3.0 6.0 mA Supply Current 2 IDD2 CE = 0V - - 5.0 μA CE "High" Voltage VCEH 2.7 - - V CE "Low" Voltage VCEL - - 0.45 V CE Pull-Down Resistance 1 Rp1 CE = 3.3V 0.5 1.5 2.5 MΩ CE Pull-Down Resistance 2 Rp2 CE = 0.3V 20.0 50.0 80.0 kΩ ● Electrical Characteristics XC25BS51xxMR CONDITIONS (AC) fCLKin=16.9344MHz, Multiplier/Divider Ratio=1.594, Ta=25℃, CL=15pF PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Output Rise Time TTLH VDD=3.3V(20% to 80%) (*1) - 5.0 - ns Output Fall Time TTHL VDD=3.3V(20% to 80%) (*1) - 5.0 - ns Duty Ratio DUTY 40 50 60 % Output Start Time Ton - - 20 ms PLL Output Jitter Tj - 40 - ps (*1) 1σ (*1) *1 R&D guarantee 3/12 XC25BS5 Series ■ FREQUENCY CONFIGURATION: EXAMPLE 2 XC25BS51XXMX PARAMETER SYMBOL MIN. TYP. MAX. UNITS Input Frequency f CLKin 52.0000 - 78.0000 kHz Multiplier/Divider Ratio N/M - 256.000 - - PLL Output Frequency fQ0 13.312 - 19.968 MHz Q1 Output Frequency Q1 ●Electrical Characteristics XC25BS51xxMR GND - (DC) fCLKin=78kHz, Multiplier/Divider Ratio=256, Ta=25℃, No Load PARAMETER SYMBOL Supply Voltage MIN. TYP. MAX. UNITS VDD 2.97 3.30 3.63 V Input Voltage "High" VIH 2.7 - - V Input Voltage "Low" VIL - - 0.6 V Input Current "High" IIH VCK=3.3V - - 3.0 μA Input Current "Low" IIL VCK=0V -3.0 - - μA Output Voltage "High" VOH VDD=2.97V, IOH= - 8mA 2.5 - - V Output Voltage "Low" VOL VDD=2.97V, IOL=8mA - - 0.4 V Supply Current 1 IDD1 CE=0.3V - 2.0 4.0 mA Supply Current 2 IDD2 CE=0V - - 5.0 μA CE " High " Voltage VCEH 2.7 - - V CE "Low" Voltage VCEL - - 0.45 V CE Pull-Down Resistance 1 Rp1 CE=3.3V 0.5 1.5 2.5 MΩ CE Pull-Down Resistance 2 Rp2 CE=0.3V 20.0 50.0 80.0 KΩ ● Electrical Characteristics XC25BS51xxMR CONDITIONS (AC) fCLKin=78kHz, Multiplier/Divider Ratio=256, Ta=25℃, CL=15pF PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Output Rise Time TTLH VDD=3.3V(20% to 80%) (*1) - 5.0 - ns Output Fall Time TTHL VDD=3.3V(20% to 80%) (*1) - 5.0 - ns Duty Ratio DUTY 40 50 60 % Output Start Time Ton - - 20 ms PLL Output Jitter Tj - 20 - ps (*1) 1σ (*1) *1 R&D guarantee 4/12 XC25BS5 Series ■TYPICAL APPLICATION CIRCUITS ① Q1 Pin - reference oscillation, reference oscillation/2, comparative frequency ② Q1 Pin - GND ■NOTE (1) Please insert a by-pass capacitor of 0.1μF. (2) Rq0 and Rq1 are matching resistors. Their use is recommended in order to counter unwanted radiations. (3) Please place a by-pass capacitor and matching resistors as close to the IC as possible. It may be that the output cannot be locked if the by-pass capacitor is not close enough to the IC. Further, there is a possibility of unwanted radiation occurrence between the resistor and the IC pin if the matching resistor is not close enough to the IC. (4) When selecting GND for the Q1 pin, although the output of Q1 pin is GND level, it is also recommended that the Q1 pin be connected to GND pattern on the PCB. (5) When the CE pin is not controlled by external signals, it is recommended that a time constant circuit of R1=1kΩ ×C1 = 0.1μF be added for stability. (6) With this IC, output is achieved by dividing and multiplying the reference oscillation by means of the PLL circuit. In cases where this output is further used as a reference oscillation of another PLL circuit, it may be that the final output signal's jitter increases, so all necessary precautions should be taken to avoid this. (7) It is recommended that a low noise power supply, such as a series regulator, be used for the supply voltage. Using a power supply such as a switching regulator might lead to a larger jitter, which in turn may lead to an inability to lock due to the ripple of the switching regulator. (8) As for this IC, synchronization of input and output signal’s edge is not guaranteed though the input frequency operates to the output frequency multiply. 5/12 XC25BS5 Series ■REFERENCE LAND PATTERN ① Q1 Pin - reference oscillation, reference oscillation/2, comparative frequency ② Q1 Pin - GND 6/12 XC25BS5 Series ■AC CHARACTERISTIC WAVEFORMS 1) Output Rise Time / Output Fall Time DUTY Measurement Level 2) Duty Ratio DUTY Measurement Level 3) Output Start Time 7/12 XC25BS5 Series ■PACKAGING INFORMATION ●SOT-26 ●USP-6B 2.9±0.2 +0.1 0.4 -0.05 (0.5) 6 5 4 2.0±0.05 0～0.1 2 3 +0.1 0.15 -0.05 0.25±0.05 0.7±0.03 1.0±0.05 0.25±0.05 0.65±0.05 (0.95) 0.65±0.05 (0.95) （0.125） 1 ●USP-6B Reference Pattern Layout ●USP-6B Reference Metal Mask Design 2.4 2.3 0.45 0.45 1 6 2 5 3 4 0.05 0.05 1.0 8/12 0.35 0.35 1 6 2 5 3 4 0.15 0.15 0.8 XC25BS5 Series ■ MARKING RULE ●SOT-26 ●XC25BS50 ①② represents product series MARK ① B ●XC25BS51 ① represents product series PRODUCT SERIES ② 5 PRODUCT SERIES XC25BS51**M* XC25BS50**M* ③ represents the 10th digit of product part number SOT-26 (TOP VIEW) MARK 5 MARK 1 5 6 PRODUCT SERIES XC25BS5001M* XC25BS5005M* XC25BS5006M* ②③ represents the 9th and 10th digits of product part number MARK ② ③ 0 7 PRODUCT SERIES XC25BS5107M* ④ represents production lot number 0 to 9,A to Z reversed character 0 to 9,A to Z repeated (G, I, J, O, Q, W excluded) ①,②,③ represents product series ●USP-6B MARK ① ② ③ 2 ④ ⑤ ⑥ 1 3 USP-6B (TOP VIEW) 6 5 PRODUCT SERIES ① ② ③ B S 0 XC25BS50**D* B S 1 XC25BS51**D* 4 ④⑤ represents the 9th and 10th digit of product part number Ex) MARK ④ ⑤ 0 7 PRODUCT SERIES XC25BS5*07D* ⑥ represents production lot number 0 to 9,A to Z repeated (G, I, J, O, Q, W excluded) Note: No character inversion used. 9/12 XC25BS5 Series ■PACKAGING INFORMATION (Continued) ● SOT-26 Power Dissipation Power dissipation data for the SOT-26 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free 2 Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） 25 600 85 240 Thermal Resistance (℃/W) 166.67 Power Dissipation Pd (mW) 許容損失Pd（mW） Pd-Ta特性グラフ Pd vs. Ta 700 600 500 400 300 200 100 0 25 10/12 45 65 85 Ambient Temperature Ta (℃) 周辺温度Ta（℃） 105 125 XC25BS5 Series ■PACKAGING INFORMATION (Continued) ● USP-6B Power Dissipation Power dissipation data for the USP-6B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free 2 Board: Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient Temperature Evaluation Board (Unit: mm) Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） 25 1000 85 400 Thermal Resistance (℃/W) 100.00 Pd vs Ta 1200 1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta（℃） 105 125 11/12 XC25BS5 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 12/12