TI TMP816

TMP816
www.ti.com ........................................................................................................................................................................................................ SLVS787 – MAY 2009
VARIABLE-SPEED SINGLE-PHASE FULL-WAVE FAN-MOTOR PRE-DRIVER
FEATURES
1
•
•
•
•
•
•
•
•
Pre-Driver for Single-Phase Full-Wave Drive
– PNP-NMOS is used as an external power
TR, enabling high-efficiency
low-consumption drive by means of the
low-saturation output and single-phase
full-wave drive. (PMOS-NMOS also
applicable)
External PWM Input Enables Variable-Speed
Control
– Separately-excited upper direct PWM
(f = 25 kHz) control method, enabling highly
silent speed control
Current-Limiter Circuit
– Chopper-type current limit at start
Reactive Current-Cut Circuit
– Reactive current before phase change is
cut to enable silent and low-consumption
drive
Minimum Speed Setting Pin
– Minimum speed can be set with external
resistor. The start assistance circuit
enables start at extremely low speed.
Constant-Voltage Output Pin for Hall Bias
Lock Protection and Automatic Reset
Functions
Rotation Speed Detection (FG) and Lock
Detection (RD) Outputs
PW PACKAGE
(TOP VIEW)
OUT2P
OUT2N
VCC
VLIM
SENSE
RMI
VTH
CPWM
FG
RD
1
2
3
4
5
6
7
8
9
10
OUT1P
OUT1N
SS
SGND
6VREG
ROFF
CT
IN+
HB
IN–
20
19
18
17
16
15
14
13
12
11
DESCRIPTION/
ORDERING INFORMATION
The TMP816 is a single-phase bipolar variable-speed
fan-motor predriver that works with an external PWM
signal. A highly efficient, quiet and low power
consumption motor driver circuit with a large variable
speed can be implemented by adding a small number
of external components.
This device is optimal for driving large-scale fan
motors (with large air volume and large current) such
as those used in servers and consumer products.
<br/>
<br/>
<br/>
<br/>
<br/>
<br/>
<br/>
<br/>
<br/>
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–30°C to 95°C
(1)
(2)
TSSOP – PW
Reel of 2000
ORDERABLE PART NUMBER
TMP816PWR
TOP-SIDE MARKING
TMP816
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TMP816
SLVS787 – MAY 2009 ........................................................................................................................................................................................................ www.ti.com
BLOCK DIAGRAM
CT
Discharge Circuit
0.47 µF
to 1 µF
FG
RD
Discharge
Pulse
VCC
6VREG
6VREG
OUT1N
OUT1P
ROFF
Hall
Controller
Hall Bias
HB
Hysteresis
Amplifier
IN+
IN–
OUT2N
SS
OUT2P
Thermal Shutdown
Oscillator
RMI VTH
VLIM SENSE
CPWM
SGND
TRUTH TABLE
During full-speed rotation
IN–
IN+
CT
OUT1P
OUT1N
OUT2P
OUT2N
FG
RD
MODE
H
L
L
L
–
–
H
L
L
OUT1 → 2 drive
L
H
–
H
L
–
OFF
H
L
L
H
VTH
2
H
CPWM
L
H
H
L
OFF
–
–
H
L
–
H
OFF
–
OFF
OUT2 → 1 drive
OFF
Lock protection
IN–
IN+
OUT1P
OUT1N
OUT2P
OUT2N
MODE
H
L
L
–
–
H
OUT1 → 2 Drive
L
H
–
H
L
–
OUT2 → 1 Drive
H
L
OFF
–
–
H
L
H
–
H
OFF
–
During rotation,
regeneration in lower TR
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
TMP816
www.ti.com ........................................................................................................................................................................................................ SLVS787 – MAY 2009
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
OUT2P
1
O
Upper-side driver output
OUT2N
2
O
Lower-side driver output
Power supply. For the CM capacitor that is a power stabilization capacitor for PWM drive and for
absorption of kickback, the capacitance of 0.1 µF to 1 µF is used. In this device, the lower TR
performs current regeneration by switching the upper TR. Connect CM between VCC and GND,
with the thick pattern and along the shortest route. Use a zener diode if kickback causes
excessive increase of the supply voltage, because such increase may damage the device.
VCC
3
VLIM
4
I
Activates the current limiter when SENSE voltage is higher than VLIM voltage. Connect to
6VREG when not used.
SENSE
5
I
Sense input. Connect to GND when not used.
RMI
6
I
Minimum speed setting. Connect to 6VREG when not used. If device power can be removed
before power is removed from RMI, insert a current limiting resistor to prevent inflow of large
current.
VTH
7
I
VTH voltage is generated by filtering the PWM-IN input. If device power can be removed before
power is removed from VTH, insert a current limiting resistor to prevent inflow of large current.
CPWM
8
O
Connect to capacitor CP to set the PWM oscillation frequency. With CP = 100 pF, oscillation
occurs at 25 kHz and provides the basic frequency of PWM.
FG
9
O
Open collector output, which can detect the rotation speed using the FG output according to the
phase shift. Leave open when not used.
RD
10
O
Open collector output. Outputs low during rotation and high at stop. Leave open when not used.
IN–
11
I
Hall input
HB
12
O
This is a Hall element bias, that is, the 1.5-V constant-voltage output.
IN+
13
I
Hall input. Make connecting traces as short as possible to prevent carrying of noise. To futher
limit noise, insert a capacitor between IN+ and IN–. The Hall input circuit is a comparator having
a hysteresis of 20 mV. The application should ensure that the Hall input level more than three
times (60 mVp-p) this hysteresis.
CT
14
O
Lock detection time setting. Capacitor CT is connected.
ROFF
15
I
Sets the soft switching time to cut the reactive current before phase change. Connect to 6VREG
when not used.
6VREG
16
O
6-V regulator output
SGND
17
SS
18
O
Connect to soft-start setting capacitor. Connect the capacitor between 6VREG and SS. Enables
setting of the soft-start time according to the capacity of the capacitor (see Figure 3 and
Figure 4). Connect to ground if not used.
OUT1N
19
O
Lower-side driver output
OUT1P
20
O
Upper-side driver output
Connected to the control circuit power supply system.
Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
3
TMP816
SLVS787 – MAY 2009 ........................................................................................................................................................................................................ www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
VCC
Supply voltage
VOUT
Output voltage
OUT1P, OUT1N, OUT2P, OUT2N
18 V
IOUT
Continuous output current
OUT1P, OUT1N, OUT2P, OUT2N
50 mA
IHB
Continuous output current
HB
10 mA
VTH
Input voltage
VTH
8 mA
VRD
VFG
Output voltage
RD, FG
18 V
IRD
IFG
Continuous output current
RD, FG
10 mA
θJA
Package thermal impedance (2)
Tstg
Storage temperature range
(1)
(2)
18 V
83°C/W
–65°C to 150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
TA = 25°C
VCC
Supply voltage
VTH
VTH input voltage
VICM
Hall input common phase input voltage
TA
Operating free-air temperature
MIN
MAX
6
16
V
0
7
V
0.2
3
V
–30
95
°C
MIN
TYP
MAX
UNIT
5.8
6
6.15
V
4.35
4.55
4.75
V
1.45
1.65
1.85
18
25
32
kHz
V
Full-speed mode
UNIT
ELECTRICAL CHARACTERISTICS
VCC = 12 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V6VREG
Output voltage
VCRH
High-level output voltage
VCRL
Low-level output voltage
fPWM
Oscillation frequency
VCTH
High-level output voltage
3.4
3.6
3.8
VCTL
Low-level output voltage
1.4
1.6
1.8
V
ICT1
Charge current
1.6
2
2.5
µA
ICT2
Discharge current
0.16
0.2
0.28
µA
RCT
Charge/discharge current ratio
8
10
12
VON
Output voltage
OUT_N
4
10
V
IOP
Sink current
OUT_P
15
20
mA
VHN
Hall input sensitivity
H+, H-
VRD
VFG
Low-level output voltage
IRDL
IFGL
Output leakage current
ISS
Discharge current
ICC
Supply current
4
6VREG
IHB = 5 mA
CPWM
CP = 100 pF
CT
IO = 20 mA
Zero peak value
(including offset and hysteresis)
IRD = 5 mA or IFG = 5 mA
V
10
20
mV
0.15
0.3
V
30
µA
µA
RD, FG
Submit Documentation Feedback
VRD = 16 V or VFG = 16 V
SS
VSS = 1 V
0.4
0.5
0.6
During drive
4
10
14
During lock protection
4
10
14
mA
Copyright © 2009, Texas Instruments Incorporated
TMP816
www.ti.com ........................................................................................................................................................................................................ SLVS787 – MAY 2009
APPLICATION INFORMATION
CB = ~0.022 µF
RB = 10 kW
ROUT = 100 W
VZ = 18 V
SOP8901
RF
RFG, RRD = 10 kW to 100 W
6VREG
VCC
6VREG
H
SS
RD
HB
FG
IN–
SENSE
IN+
VLIM
RMI
6VREG
ROFF
R = 0 to 5 kW
OUT1P
VTH
OUT1N
PWM-IN
CPWM
CP = 100 pF
25 kHz
OUT2P
CT
OUT2N
SGND
CT = 0.47 µF
Figure 1. 12-V Sample Application Circuit
Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
5
TMP816
SLVS787 – MAY 2009 ........................................................................................................................................................................................................ www.ti.com
f = 25 kHz (CP = 100 pF)
ON duty large
VTH voltage
4.55 V
RMI voltage
CPWM
1.65 V
ON duty small
PWM-IN disconnected
0V
Rotation set to
minimum speed
(stop mode)
PWM control
variable speed
Low speed
High speed
Full speed
12 V
VCC
0V
FG
A.
Minimum speed setting (stop) mode
PWM-IN input is filtered to generate the VTH voltage. At low speed, the fan rotates with the minimum speed set with
RMI during low speed. If the minimum speed is not set (RMI = 6VREG), the fan stops.
B.
Low ↔ high speed mode
PWM control is made through comparison of oscillation and VTH voltages with CPWM changing between 1.6 V ↔ 4.6
V.
Upper and lower TRs are turned ON when the VTH voltage is higher. The upper output TR is turned OFF when the
VTH voltage is lower, and the coil current is regenerated in the lower TR. Therefore, as the VTH voltage lowers, the
output ON duty increases, increasing the coil current and raising the motor speed. The rotation speed is fed back by
the FG output.
C.
Full speed mode
The full-speed mode becomes effective with the VTH voltage of 1.65 V or less. (VTH must be equal to GND when the
speed control is not used.)
D.
PWM-IN input disconnection mode
When the PWM-IN input pin is disconnected, VTH becomes 1.65 V or less and the output enables full drive at 100%.
The fan runs at full speed (see Figure 1).
Figure 2. Control Timing
6
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
TMP816
www.ti.com ........................................................................................................................................................................................................ SLVS787 – MAY 2009
SS Voltage
4.55 V
RMI Voltage
CPWM
VTH Voltage
1.65 V
0V
Lock Protection
Soft-Start Section
VTH Set Speed
100%
ON Duty Cycle
0%
Time
Figure 3. Soft-Start Control Timing (VTH < RMI Voltage)
SS Voltage
VTH Voltage
4.55 V
RMI Voltage
CPWM
1.65 V
0V
Lock Protection
RMI Set Speed
SoftStart
Section
100%
ON Duty Cycle
0%
Time
Figure 4. Soft-Start Control Timing (VTH > RMI Voltage)
Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
7
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TMP816PWR
Package Package Pins
Type Drawing
TSSOP
PW
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
6.95
B0
(mm)
K0
(mm)
P1
(mm)
7.1
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP816PWR
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated