TB7109F TOSHIBA BiCD Integrated Circuit Silicon Monolithic TB7109F Power supply IC for LNB The TB7109F is single chip power supply ICs for LNB that integrated buck DC-DC converter section utilizing a chopper circuit and series regulator section. The TB7109F contains high-speed P-channel MOSFETs for the high side main switch to achieve high efficiency. And series regulator section is fed into a overcurrent circuit of fold buck type, and it protects this product from the short circuit state of the load. HSON8-P-0505-1.27 Features Weight: 0.068 g (typ.) • Output current: DC-DC Converter section IOUT1 = 500mA(max.) Series Regulator section IOUT2 = 400mA(max.) • High efficiency: DC-DC Converter section η = 95% (typ.) (@VIN1 = 24V, VOUT1 = 17V, IOUT1 = 300mA) • Operating input voltage range: VIN1 = 8V to 27V • On-state resistance: RDS(ON) = 0.7Ω (high-side) typical (@VIN1 = 24V, Tj = 25℃) • Oscillation frequency: fOSC = 400kHz (typ.) • Reference voltage: VREF = 1.215V ± 2.9% (@Tj = 25°C) • Housed in a small surface-mount package (SOP Advance) with a low thermal resistance • Soft-start feature • Overcurrent protection: fold buck type for the Series Regulator section ILMIT2(1) = 550mA(typ.)(@ VIN2 = 17V, VOUT2 = 12.5V), ILMIT2(2) = 100mA(typ.)(@ VIN2 = 17V, VOUT2 = 0V) Part Marking Pin Assignment Part Number (or abbreviation code) TB 7109F VFB1 EN 8 7 VFB2 6 VOUT2 5 Lot No. The dot (•) on the top surface indicates pin 1. 1 2 3 4 Lx VIN1 VIN2 GND The lot number consists of three digits. The first digit represents the last digit of the year of manufacture, and the following two digits indicates the week of manufacture between 01 and either 52 or 53. Manufacturing week code (The first week of the year is 01; the last week is 52 or 53.) Manufacturing year code (last digit of the year of manufacture) This product has a MOS structure and is sensitive to electrostatic discharge. Handle with care. The product(s) in this document (“Product”) contain functions intended to protect the Product from temporary small overloads such as minor short-term overcurrent, or overheating. The protective functions do not necessarily protect Product under all circumstances. When incorporating Product into your system, please design the system (1) to avoid such overloads upon the Product, and (2) to shut down or otherwise relieve the Product of such overload conditions immediately upon occurrence. For details, please refer to the notes appearing below in this document and other documents referenced in this document. 1 2011-05-19 TB7109F Ordering Information Part Number Shipping TB7109F (TE12L, Q) Embossed tape (3000 units per reel) Block Diagram VIN1 Current Detection Slope Oscillator + - Compensation Under Voltage Lockout Control Logic Driver LX Short-Circuit Error Amplifier - VFB1 + Protection Phase Compensation GND Current Detection Error Amplifier EN Soft Start Ref.Voltage (1.215V) + - VIN2 + VOUT2 VFB2 Pin Description Pin No. Symbol Description 1 LX 2 VIN1 This pin is placed in the standby state if VEN=”L”. Standby current is 70 μA(@VIN = 24V) or less. 3 VIN2 Input pin for the Series Regulator section. It uses on the condition of VIN1≧VIN2. 4 GND Ground pin 5 VOUT2 6 VFB2 Switch pin This pin is connected to high-side P-channel MOSFET. Input pin Output pin for the Series Regulator section Feedback pin for the Series Regulator section This input is fed into an internal error amplifier with a reference voltage of 1.215 V (typ.). Enable pin 7 EN When VEN ≥ 1.8V (@ VIN1 = 24V), the internal circuitry is allowed to operate and thus enable the switching operation of the output section. When VEN ≤ 0.5V (@ VIN1 = 24V), the internal circuitry is disabled, putting the TB7109F in Standby mode. This pin has an internal pull-up current of 15µA(typ.). 8 VFB1 Feedback pin for the DC-DC Converter section This input is fed into an internal error amplifier with a reference voltage of 1.215 V (typ.). 2 2011-05-19 TB7109F Absolute Maximum Ratings (Ta = 25°C) (Note) Characteristics Symbol Rating Unit Input pin voltage VIN1 -0.3～30 V Input pin voltage VIN2 -0.3～30 V VLX -0.3～30 V Feedback1 pin voltage VFB1 -0.3～30 V Feedback2 pin voltage VFB2 -0.3～30 V Enable pin voltage VEN -0.3～30 V Switch pin current ILX -0.75 A Output pin current IOUT2 -0.5 A PD 2.2 W Tjopr -40 to 125 ℃ Tj 150 °C Tstg -55 to 150 °C Switch pin voltage Power dissipation (Note 1) (Note 2) Operating junction temperature Junction temperature (Note 3) Storage temperature Thermal Resistance Characteristics Characteristics Symbol Max Unit Thermal resistance, junction to ambient Rth (j-a) 44.6 (Note 2) °C/W Thermal resistance, junction to case (Tc=25℃) Rth (j-c) 4.17 °C/W Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc) Note 1: The switch pin voltage (VLX) doesn’t include the peak voltage generated by TB7109F’s switching. A negative voltage generated in dead time is permitted among the switch pin current (ILX). Note 2: Glass epoxy board FR-4 25.4 × 25.4 × 0.8 (Unit: mm) Single-pulse measurement: pulse width t=10(s) Note 3: The TB7109F may go into thermal shutdown at the rated maximum junction temperature. Thermal design is required to ensure that the rated maximum operating junction temperature, Tjopr, will not be exceeded. 3 2011-05-19 TB7109F Electrical Characteristics (Tj = 25°C, VIN1 = VIN2 = 8V to 27V, unless otherwise specified) Characteristics Symbol Test Condition Min Typ. Max Unit VIN1(OPR) ⎯ 8 ⎯ 27 V ⎯ ⎯ 5 mA ⎯ ⎯ 70 μA VIN1 = 24V 1.8 ⎯ ⎯ VIL(EN) VIN1 = 24V ⎯ ⎯ 0.5 IIH(EN) VIN1 = 24V, VEN = 5V −5 ⎯ 5 IIL(EN) VIN1 = 24V, VEN = 0V ⎯ −15 ⎯ TSD VIN1 = 24V , VEN = 5V ⎯ 155 ⎯ °C Hysteresis ΔTSD VIN1 = 24V , VEN = 5V ⎯ 10 ⎯ °C Detection voltage VUV VEN = 5V 4.6 5.3 6.0 V Recovery voltage VUVR VEN = 5V 5.3 6.0 6.7 V Hysteresis ΔVUV VEN = 5V ⎯ 0.7 ⎯ V VIN1 = 24V , VEN = 5V, IOUT1 = 0A Measured between 0% and 90% 1.2 2.5 4 ms Operating input voltage Operating current IIN1 Standby current IIN1(STBY) VIH(EN) EN threshold voltage EN input current Thermal shutdown (TSD) Undervoltage lockout (UVLO) Detection temperature Internal soft-start time tSS VIN1 = 24V , VEN = 5V VFB1 = 2V VIN1 = 24V , VEN = 0V VFB1 = 0.8V V μA points at VOUT1 Reference voltage VREF VIN1 = 24V , VEN = 5V 1.18 1.215 1.25 V VFB input voltage VFB1 VIN1 = 24V , VEN = 5V ⎯ 1.215 ⎯ V VFB input current IFB1 VIN1 = 24V , VEN = 5V, VFB1 = 2V -1 ⎯ 1 μA 1.215 ⎯ VIN1-3 V ⎯ ⎯ 10 μA DC-DC Converter section Output voltage range High-side switch leakage current VOUT1(OPR) VEN = VIN1 ILEAK (H) VIN1 = 24V, VEN = 0V VFB1 = 0V, VLX = 0V High-side switch on-state resistance RDS(ON)(H) VIN1 = 24V , VEN = 5V, ILX = - 0.1A ⎯ 0.7 ⎯ Ω Low-side switch on-state resistance RDS(ON)(L) VIN1 = 24V , VEN = 5V, ILX = 0.1A ⎯ 5 ⎯ Ω Oscillation frequency fOSC VIN1 = 24V , VEN = 5V 320 400 480 kHz High-side switch duty cycle Dmax VIN1 = 24V , VEN = 5V ⎯ ⎯ 100 % LX current limit ILIM1 0.75 0.9 ⎯ A ⎯ ⎯ 1 V ⎯ 1.215 ⎯ V -5 ⎯ -5 μA ⎯ ⎯ 150 mV 400 550 ⎯ mA ⎯ 100 ⎯ mA VIN1 = 24V , VEN = 5V VOUT1 = 17V Series Regulator section Dropout voltage VIN2–VOUT2 VOUT2 = 15V , IOUT2 = 400mA VFB input voltage VFB2 VFB input current IFB2 Load regulation Reg・Load ILIM2(1) VOUT2 current limit ILIM2(2) VIN1 = 24V , VEN = 5V VIN1 = 24V , VIN2 = 17V VFB2 = 2V, VEN = 5V VIN1=24V, VIN2=17V, VOUT2=15V IOUT2 = 5mA to 400mA VIN1 = 24V , VIN2 = 17V VFB2 = 1V , VOUT2 = 12.5V VIN1 = 24V , VIN2 = 17V VFB2 = 0V , VOUT2 = 0V 4 2011-05-19 TB7109F Application Circuit Example 1 VIN L Lx VOUT1 VIN2 VFB1 TB7109F EN EN VOUT2 RFB1 VOUT2 VIN1 RFB3 VFB2 CIN GND SBD COUT2 COUT1 RFB2 RFB4 GND GND Component values (reference value@ VIN1 = 24V, VOUT1 = 17.4V, VOUT2 = 15.8V, Ta = 25°C) CIN : VIN1 Input filter capacitor = 4.7μF (ceramic capacitor: GRM31CR71H475KA12L manufactured by Murata Manufacturing Co., Ltd.) COUT1 : VOUT1 Output filter capacitor = 4.7μF (ceramic capacitor: GRM31CR71H475KA12L manufactured by Murata Manufacturing Co., Ltd.) C OUT2 : VOUT2 Output capacitor = 4.7μF (ceramic capacitor: GRM31CR71H475KA12L manufactured by Murata Manufacturing Co., Ltd.) RFB1 : Output voltage setting resistor for the DC-DC converter section = 20kΩ RFB2 : Output voltage setting resistor for the DC-DC converter section = 1.5kΩ RFB3 : Output voltage setting resistor for the Series regulator section = 18kΩ RFB4 : Output voltage setting resistor for the Series regulator section = 1.5kΩ L : Inductor = 22μH(SLF7055T-220M2R5-3PF manufactured by TDK-EPC Corporation) SBD : Schottky barrier diode(CRS20I40B manufactured by Toshiba Corporation) Application Circuit Example 2 ・Output voltage switch function, BS/CS power supply circuit for LNB VIN L1 22μH VIN2 Lx TB7109F EN EN C1 4.7μF C2 4.7μF GND LR R7 10kΩ VOUT R1 VOUT2 VIN1 VFB1 R4 VFB2 GND D1 CRS20I40B C3 4.7μF C4 4.7μF R3 R2 R6 R5 D2 CRG03 C5 C6 4.7μF 4.7μF GND Q1 RN1106 C7 1μ F Q2 RN1106 Figure 1 TB7109F Application Circuit Examples 5 2011-05-19 TB7109F Application Notes DC-DC Converter section Inductor Selection The inductance required for inductor L can be calculated as follows: VIN1: Input voltage (V) VIN1 − VOUT1 VOUT1 VOUT1: Output voltage (V) L= ⋅ ·············· (1) fOSC ⋅ΔIL VIN1 fOSC: Oscillation frequency = 400kHz (typ.) ΔIL: Inductor ripple current (A) *: ΔIL should be set to approximately 0.5A. The inductor should have a current rating greater than the peak output current of 0.75A. If the inductor current rating is exceeded, the inductor becomes saturated, leading to an unstable DC-DC converter operation. L= = VIN1 − VOUT1 VOUT1 ⋅ fOSC ⋅ΔIL VIN1 24V − 17 V 17 V ⋅ 400kHz ⋅ 0.5A 24 V ΔIL When VIN1 = 24V and VOUT1 = 17V, the required inductance can be calculated as follows. Be sure to select an appropriate inductor, taking the input voltage range into account. IL 0 T= = 24.8 μH 1 TON = T ⋅ fosc VOUT1 VIN1 Figure 2 Inductor Current Waveform Setting the Output Voltage A resistive voltage divider is connected as shown in Figure 3 to set the output voltage; it is given by Equation 2 based on the reference voltage of the error amplifier (1.215V typ.), which is connected to the Feedback pin, VFB. RFB2 should be up to 10kΩ or so, because an extremely large-value RFB2 incurs a delay due to parasitic capacitance at the VFB1 pin. It is recommended that resistors with a precision of ±1% or higher be used for RFB1 and RFB2. VFB1 ⎛ R ⎞ = 1.215 V × ⎜⎜1 + FB1 ⎟⎟ ···· (2) ⎝ R FB2 ⎠ VOUT1 RFB2 RFB1 LX ⎞ ⎛ R VOUT1 = VFB1 × ⎜⎜1 + FB1 ⎟⎟ R FB2 ⎠ ⎝ Figure 3 Output Voltage Setting Resistors Output Filter Capacitor Selection Use a low-ESR electrolytic or ceramic capacitor as the output filter capacitor. Since a capacitor is generally sensitive to temperature, choose one with excellent temperature characteristics. When the output voltage exceeds 10V, the capacitance should be 4.7μF or greater for applications. The capacitance should be set to an optimal value that meets the system’s ripple voltage requirement and transient load response characteristics. Rectifier Selection A Schottky barrier diode should be externally connected to the TB7109F as a rectifier between the LX and GND pins. It is recommended CRS20I40B or equivalent be used as Schottky barrier diode. If a large voltage overshoot is on the LX pin, it reduces the voltage to connect a series CR network consisting of a resistor of RS = 47Ω and a capacitor of CS = 330pF with the Schottky barrier diode in parallel. Power loss of the Schottky barrier diode tends to increase due to an increased reverse current caused by the rise in ambient temperature and self-heating due to a supplied current. The rated current should therefore be derated to allow for such conditions in selecting an appropriate diode. 6 2011-05-19 TB7109F Overcurrent Protection（OCP） The TB7109F has built-in overcurrent protection with pulse skip. When the peak current of LX pin exceeds ILIM1=0.9A(typ.)(@VIN1=24V), the ON time of the high-side switch (internal) will be limited. Switching frequency will be reduced and output current will be restricted further if output voltage falls and the voltage of VFB1 pin drops below the overcurrent pulse skip detection voltage VLOC (0.5V typ.) during overcurrent protection . Series Regulator section Overcurrent Protection（OCP） TB7109F is fed into a overcurrent circuit of fold buck type, and it protects this product from the overcurrent state of the load. VOUT2 15.8V 12.5V 0 ILIM2(2) ILIM2(1) 100mA(typ) 550mA(typ) IOUT2 Figure 4 Overcurrent Protection Operation Setting the Output Voltage ⎛ R VOUT2 = VFB2 × ⎜⎜ 1 + FB3 R FB4 ⎝ ⎞ ⎟⎟ ⎠ VOUT2 ⎛ ⎞ ⎜ R FB3 ⎟ ······ (3) = 1.215 V × ⎜1 + ⎟ ⎜ R FB4 ⎟ ⎝ ⎠ VFB2 RFB4 RFB3 A resistive voltage divider is connected as shown in Figure 5 to set the output voltage; it is given by Equation 3 based on the reference voltage of the error amplifier (1.215V typ.), which is connected to the Feedback pin, VFB2. RFB4 should be up to 10kΩ or so, because an extremely large-value RFB4 incurs a delay due to parasitic capacitance at the VFB2 pin. It is recommended that resistors with a precision of ±1% or higher be used for RFB3 and RFB4. Figure 5 Output Voltage Setting Resistors Output Filter Capacitor Selection Use a ceramic capacitor as the output filter capacitor. As a rule of thumb, its capacitance should be 4.7μF or greater. Since a capacitor is generally sensitive to temperature, choose one with excellent temperature characteristics. The IC may oscillate due to external conditions (output current, or temperature etc.). The type of capacitor required must be determined by the actual application circuit in which the IC is used. 7 2011-05-19 TB7109F Note on Electrical Characteristics Soft-Start Feature The TB7109F has a soft-start feature. The soft-start time, tSS for VOUT1 and VOUT2 defaults to 2.5ms (typ.) internally. The soft-start feature is activated when the TB7109F exits the undervoltage lockout (UVLO) state after power-up and when the voltage at the EN pin has changed from logic low to logic high. Thermal Shutdown (TSD) The TB7109F provides thermal shutdown. When the junction temperature continues to rise and reaches TSD (155°C typ.), the TB7109F goes into thermal shutdown and shuts off the power supply. TSD has a hysteresis of about 10°C (typ.). The device is enabled again when the junction temperature has dropped by approximately 10°C from the TSD trip point. The device resumes the power supply when the soft-start circuit is activated upon recovery from TSD state. Thermal shutdown is intended to protect the device against abnormal system conditions. It should be ensured that the TSD circuit will not be activated during normal operation of the system. TSD detection temperature: TSD Recovery from TSD Hysteresis: ΔTSD Tj 0 Switching operation starts VOUT1 VOUT2 GND Switching operation stops Soft start Figure 7 Thermal Shutdown Operation Undervoltage Lockout (UVLO) The TB7109F has undervoltage lockout (UVLO) protection circuitry. The TB7109F does not provide output voltage (VOUT1 and VOUT2) until the input voltage (VIN1) has reached VUVR (6.0V typ.). UVLO has hysteresis of 0.7V (typ.). After the switch turns on, if VIN1 drops below VUV (5.3V typ.), UVLO shuts off the switch at VOUT1 and VOUT2. Undervoltage lockout recovery voltage VUVR VIN1 Undervoltage lockout detection voltage VUV Hysteresis: ΔVUV GND Switching operation starts VOUT1 VOUT2 GND Switching operation stops Soft start Figure 8 Undervoltage Lockout Operation 8 2011-05-19 TB7109F Usage Precautions • The input voltage, output voltage, output current and temperature conditions should be considered when selecting capacitors, inductors and resistors. These components should be evaluated on an actual system prototype for best selection. • Parts of this product in the surrounding are examples of the representative, and the supply might become impossible. Please confirm latest information when using it. • External components such as capacitors, inductors and resistors should be placed as close to the TB7109F as possible. • CIN should be connected as close to the GND and VIN1 pins as possible. Operation might become unstable due to a board layout and a characteristics of capacitance. • The minimum programmable output voltage is 1.215V (typ.). If the difference between the input and output voltages is small, the output voltage might not be regulated accurately and fluctuate significantly. • GND(4) pin is connected with the back of IC chip and serves as the heat radiation pin. Secure the area of a GND pattern as large as possible for greater of heat radiation. • The overcurrent protection circuits in the Product are designed to temporarily protect Product from minor overcurrent of brief duration. When the overcurrent protective function in the Product activates, immediately cease application of overcurrent to Product. Improper usage of Product, such as application of current to Product exceeding the absolute maximum ratings, could cause the overcurrent protection circuit not to operate properly and/or damage Product permanently even before the protection circuit starts to operate. • The thermal shutdown circuits in the Product are designed to temporarily protect Product from minor overheating of brief duration. When the overheating protective function in the Product activates, immediately correct the overheating situation. Improper usage of Product, such as the application of heat to Product exceeding the absolute maximum ratings, could cause the overheating protection circuit not to operate properly and/or damage Product permanently even before the protection circuit starts to operate. 9 2011-05-19 TB7109F Typical Performance Characteristics IIN1 – VIN1 IIN1 – Tj IIN1 (mA) 2.0 1.5 1 Operating current Operating current IIN1 (mA) 2.0 0.5 VEN = VIN1 VFB1 = VFB2 = 0V Tj = 25°C 0 0 5 10 15 20 Input voltage VIN1 25 1.5 1 0.5 VEN = VIN1 = 24V VFB1 = VFB2 = 0V 0 30 -50 (V) -25 0 50 75 Junction temperature Tj 100 125 (°C) IIH(EN) – VEN VIH(EN), VIL(EN) – Tj 100 2.0 VIN1 = VIN2 = 24V VIN1 = 24V VFB1 = 0V VFB1 = VFB2 = 0V 80 Tj = 25°C 1.5 60 VIH(EN) EN input current IIH(EN) (μA) EN threshold voltage VIH(EN), VIL(EN) (V) 25 1 VIL(EN) 0.5 40 20 0 -20 0 -50 -25 0 25 50 75 Junction temperature Tj 100 0 125 5 10 VEN 30 (V) 7.0 VIN1 = VIN2 VEN = VIN1 VFB1 = 0V VFB2 = VOUT2 Tj = 25°C 1.2 Undervoltage lockout voltage VUV,VUVR (V) (V) VOUT2 25 VUV, VUVR – Tj VOUT2 – VIN1 Output voltage 20 EN input voltage (°C) 1.5 0.9 0.6 0.3 0 15 6.5 Recovery voltage VUVR 6.0 5.5 5.0 Detection voltage VUV 4.5 VEN = VIN1 = 24V VFB1 = 0V 4.0 4 4.5 5 5.5 Input voltage 6 VIN1 6.5 -50 7 -25 0 25 50 Junction temperature (V) 10 75 Tj 100 125 (°C) 2011-05-19 TB7109F VFB2 – VIN1 VFB2 – Tj 1.28 (V) 1.26 VFB2 VIN1 = VIN2 VEN = VIN1 Tj = 25°C 1.24 Feedback pin voltage (V) 1.24 Feedback pin voltage 1.26 VFB2 1.28 1.22 1.20 1.18 1.22 1.20 1.18 1.16 5 10 15 Input voltage 20 VIN1 50 75 Tj 100 125 (°C) fOSC – Tj Oscillation frequency fOSC 420 380 340 VIN1 = 24V 420 380 340 300 10 15 Input voltage 20 VIN1 25 30 -50 (V) -25 0 25 50 75 Junction temperature ΔVOUT1 – IOUT1 (DC-DC Converter section) 150 Tj 100 125 (°C) ΔVOUT1 – IOUT1 (DC-DC Converter section) 50 0 (mV) 100 100 ΔVOUT1 150 VIN1 = 24V , VOUT1 = 17.4V L = 22μH , COUT1 = 4.7μF Ta = 25°C , LS : CRS20I40B 50 Output voltage (mV) 25 460 Tj = 25°C 5 ΔVOUT1 0 Junction temperature 300 Output voltage -25 (V) (kHz) (kHz) fOSC 1.16 -50 30 fOSC – VIN1 460 Oscillation frequency 25 VIN1 = VIN2 = 24V VEN = VIN1 -50 -100 VIN1 = 24V , VOUT1 = 13.3V L = 22μH , COUT1 = 4.7μF Ta = 25°C , LS : CRS20I40B 0 -50 -100 -150 -150 0 0.1 0.2 Output current 0.3 IOUT1 0.4 (A) 0.5 0 0.1 0.2 Output current 11 0.3 IOUT1 0.4 0.5 (A) 2011-05-19 TB7109F η – IOUT1 η – IOUT1 90 90 VIN1 = 24V VOUT1 = 17.4 V L = 22 μH COUT1 = 4.7μF Ta = 25°C LS : CRS20I40B 60 η 70 80 Efficiency η 80 Efficiency (%) 100 (%) 100 70 VIN1 = 24V VOUT1 = 13.3V L = 22 μH COUT1 = 4.7μF Ta = 25°C LS : CRS20I40B 60 50 50 0 0.1 0.2 0.3 Output current 0.4 IOUT1 0 0.5 (A) (V) (V) 0.5 (A) 15 VOUT1 VOUT1 10 Output voltage Output voltage IOUT1 0.4 20 15 5 VIN1 = 24V VOUT1 = 17.4 V L = 22μH , Ta = 25°C 0 0 0.3 10 5 VIN1 = 24V VOUT1 = 13.3 V L = 22μH , Ta = 25°C 0 0.6 0.9 Output current 1.2 IOUT1 1.5 0 0.3 (A) 0.6 0.9 Output current IOUT1 1.2 1.5 (A) ΔVOUT2 – IOUT2 (Series regulator section) ΔVOUT2 – IOUT2 (Series regulator section) 150 150 ΔVOUT2 100 (mV) VIN1 = 24V VOUT1 = 17.4 V, VOUT2 = 15.8V L = 22μH , COUT2 = 4.7μF Ta = 25°C , LS : CRS20I40B 50 0 Output voltage (mV) 0.3 Overcurrent Protection (DC-DC Converter section) 20 ΔVOUT2 0.2 Output current Overcurrent Protection (DC-DC Converter section) Output voltage 0.1 -50 -100 VIN1 = 24V VOUT1 = 13 .3V , VOUT2 = 12.0V L = 22 μH , COUT2 = 4.7μF Ta = 25°C , LS : CRS20I40B 100 50 0 -50 -100 -150 -150 0 0.1 0.2 Output current 0.3 IOUT2 0 0.4 0.1 0.2 Output current (A) 12 0.3 IOUT2 0.4 (A) 2011-05-19 TB7109F Overcurrent Protection (Series regulator section) Overcurrent Protection (Series regulator section) 20 (V) 15 VOUT2 15 10 Output voltage Output voltage VOUT2 (V) 20 5 VIN1 = 24V , Ta = 25°C VOUT1 = 17.4V VOUT2 = 15.8V 0 0 0.2 0.4 Output current 0.6 IOUT2 5 VIN1 = 24V , Ta = 25°C VOUT1 = 13.3V VOUT2 = 12.0V 0 0.8 0 (A) 0.2 0.4 Output current Startup Characteristics (Internal Soft-Start Time) VIN1 = 24V VOUT1 = 17.4V VOUT2 = 15.8V Ta = 25°C L = 22μH 10 0.6 IOUT2 0.8 (A) Startup Characteristics (Internal Soft-Start Time) VIN1 = 24V VOUT1 = 13.3V VOUT2 = 12.0V Ta = 25°C L = 22μH Output voltage : VOUT1 (5V/div) Output voltage : VOUT1 (5V/div) Output voltage : VOUT2 (5V/div) Output voltage : VOUT2 (5V/div) EN input voltage:VEN:L→H EN input voltage:VEN:L→H 1 ms/div 1 ms/div 13 2011-05-19 TB7109F Package Dimensions HSON8-P-0505-1.27 Unit: mm Weight: 0.068 g (typ.) 14 2011-05-19 TB7109F RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. 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Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 15 2011-05-19