HI-SINCERITY MICROELECTRONICS GROUP. Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 1/6 H288 Complementary Output Hall Effect Sensor IC Description H288 is designed to integrate Hall sensor with output driver together on the same chip. It is suitable for dual coils brush-less DC motors, dual coils brush-less DC Fan, Speed measurement, and revolution counting. SIP-4L Package It includes a bandgap reference voltage source, a Hall device, a amplifier, a Hysteresis controller and a open-collector output drive capable of sinking up to 300mA current load. An on-chip protection diode is implemented to prevent reverse power fault. H288 has a control circuit to prevent “dead angle” from logic race condition in DC Fan. It has excellent characteristic of temperature compensation. The internal temperature compensated voltage source can let sensor to get uniform sensitivity in a wide temperature range. It is rated for operation over temperature rage from -20oC to +85oC and voltage ranges from 3.0V to 20V. Features • On-chip Hall sensor • 3.0V to 20V operating voltage • Internal Temperature compensation • Special design providing logic race condition immunity, shorter switching time, and good switch reliability • 300mA output sink current • Internal on-chip protection diode • SIP-4L Package Applications • Dual-coil Brush-less DC Motor • Dual-coil Brush-less DC Fan • Revolution Counting • Speed Measurement Pin Assignment Name AX277 H288 1 2 3 4 P/I/O Pin # Description VCC P 1 Power Supply Input DO O 2 Output Pin DOB O 3 Output Pin GND P 4 Ground Typical Application Circuit (Brush-Less DC Fan) AX277 H288 1 2 3 Coil1 Coil2 C1 C2 4 + VCC - H288 HSMC Product Specification HI-SINCERITY MICROELECTRONICS GROUP. Block Diagram Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 2/6 Vcc Temperature Compensation Vout1 Voltage Regulator GND Hall Effect Sensor Differential Amplifier Hysteresis Control Output Driver Vout2 Logic Control GND Test Circuit 14V HAX277 288 1 2 3 RL1=RL2=820Ω 4 CL1=CL2=20pF RL1 Vout1 RL2 Vout2 CL1 CL2 Absolute Maximum Ratings (Ta=25oC) Characteristics Symbol Values Unit VCC 20 V VOUT(breakdown) 35 V Magnetic Flux Density B Unlimited Output Zener Breakdown VZ 28 V Output ON Current (continuous) IC 300 mA ICMAX 1 Supply Voltage Output breakdown Voltage Maximum Output Current Operating Temperature Range TA -20 to +85 C o C Storage Temperature Range TS -65 to +150 Package Power Dissipation PD 500 Maximum Junction Temperature TJ 175 H288 A o mW o C HSMC Product Specification HI-SINCERITY Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 3/6 MICROELECTRONICS GROUP. Electrical Characteristics (T=+25oC, VCC=3V~20V) Characteristic Symbol Supply Voltage Output Saturation Voltage Test Conditions Min. Typ. Max. Units 3 - 20 V VCC=3V, IL=100mA - 200 - VCC=14V, IL=300mA - 300 600 VCC VCE(sat) mV Output Leakage Current Icex Vce=14V, VCC=14V - - 2 uA Supply Current Iccq VCC=20V, Output Open - 10 18 mA Output Rise Time Tr VCC=14V, RL=400Ω, CL=20pF - 1 5 uS Output Falling Time Tf VCC=14V, RL=400Ω, CL=20pF - 0.2 1.2 uS Magnetic Characteristics A Grade Typ. max. Units - - 70 G Brp -70 - - G Bhy - 70 - G Characteristic Symbol Min. Typ. max. Units Operate Point BOP - - 90 G Release Point Brp -90 - - G Hysteresis window Bhy - 70 - G Characteristic Symbol Min. Typ. max. Units Operate Point BOP - 130 G Release Point Brp -130 - - G Hysteresis window Bhy - 70 - G Characteristic Symbol Operate Point BOP Release Point Hysteresis window Min. B Grade C Grade H288 - HSMC Product Specification HI-SINCERITY Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 4/6 MICROELECTRONICS GROUP. H 2 8 8 H y s te re s is C h a ra c te ris tic s c u rv e DO V cc DOB o ff-sta te o ff-sta te V cc Vout Vout Bhy T u rn o ff Bhy T u rn o n o n -s ta te N 0 B rp B op V sa t S T u rn o ff T u rn o n o n -sta te V sa t N B rp M a g n e tic F lu x D e n s ity (g a u s s ) Bop 0 S M a g n e tic F lu x D e n s ity (g a u s s ) Characteristics Curve Supply Current & Supply Voltage Supply Current & Temperature 13.4 16 13.3 14 Supply Current (mA)... Supply Current (mA)... 13.2 12 Test Conditions: VCC=2.8V~20V Output Open, RL=∞ 10 8 TA =25o C (Refer to Test Circuit) 6 4 Test Conditions: VCC=20V Output Open, RL=∞ (Refer to Test Circuit) 13.1 13 12.9 12.8 12.7 12.6 2 12.5 0 12.4 2.8 3 3.5 3.6 4 5 6 7 8 9 10 12 14 16 18 20 0 20 40 Supply Voltage (V) 80 100 120 100 120 80 70 550 Test Conditions: VCC=14V, RL=400Ω CL=20pF (Refer to Test Circuit) 60 500 Hysteresis (G) Power Dissipation (mW) o Hysteresis & Temperature SIP-4L Power Dissipation & Temperature 600 450 400 350 50 40 30 20 300 10 250 0 200 0 20 40 60 80 o Temperature ( C) H288 60 Temperature ( C) 100 120 0 20 40 60 o 80 Temperature ( C) HSMC Product Specification HI-SINCERITY Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 5/6 MICROELECTRONICS GROUP. Brush-less DC Fan Output Current Curve Icoil 1 Current (mA) 180 12V, 0.24A Brush-Less DC Fan (Refer to Typical Application Circuit) Test Conditions: VCC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm 90 0 Icoil 2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 16 18 20 Time (uS) Brush-less DC Fan Output Voltage Curve Output Voltage (V) 20 18 12V, 0.24A Brush-Less DC Fan 16 Test Conditions: VCC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm (Refer to Typical Application Circuit) 14 Vout 1 12 10 8 6 4 2 Vout 2 0 0 H288 2 4 6 8 10 Time (mS) 12 14 HSMC Product Specification HI-SINCERITY MICROELECTRONICS GROUP. Spec. No. : IC200903 Issued Date : 2009.02.12 Revised Date : Page No. : 6/6 SIP-4L Dimension A B J C 1 2 3 Marking: I a2 a1 4 2 8 8 H: Halogen Free Mark H D Pin Style: 1.VCC 2.DO 3.DOB 4.GND K Hall Sensor Location: DIM A B C D E F G H I J Min. Max. 3.962 4.216 2.870 3.124 13.60 15.60 1.245 1.753 0.750REF 0.406 0.508 0.330 0.432 1.27REF 1.87 2.13 1.27 1.53 *: Typical, Unit: mm 2 .0 0 m m G a2 F E 1 .3 7 m m E To p V ie w Marking Site a1 L 4-Lead SIP-4L Plastic HSMC Package Code: AD Material: • Lead solder plating: Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. •HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China Tel: 86-021-58955599 Fax: 86-021-58558038 H288 HSMC Product Specification