SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip Features MADS-002545-1307M V1 Topview • Ultra Low Parasitic Capitance and Inductance • Surface Mountable in Microwave Circuits , No Wirebonds Required • Rugged HMIC Construction with Polyimide Scratch Protection • Reliable, Multilayer Metalization with a Diffusion • Barrier, 100% Stabilization Bake (300 °C, 16 hours) • Lower Susceptibility to ESD Damage A B Description and Applications The MADS-002545-1307M Series SurMount Medium Barrier, Silicon Schottky Cross-Over Quad Diodes are fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of Silicon pedestals which form diodes or via conductors embedded in a glass dielectric, which acts as the low dispersion, low loss, microstrip transmission medium. The combination of silicon and glass allows HMIC devices to have excellent loss and power dissipation characteristics in a low profile, reliable device. The Surmount Schottky devices are excellent choices for circuits requiring the small parasitics of a beam lead device coupled with the superior mechanical performance of a chip. The SurMount structure employs very low resistance silicon vias to connect the Schottky contacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. They have lower susceptibility to electrostatic discharge than conventional beam lead Schottky diodes. C D E D Sideview Case Style 1307 MADS-002545-1307M Equivalent Circuit The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes a platinum diffusion barrier, which permits all devices to be subjected to a 16-hour non-operating stabilization bake at 300°C. The “ 0202 ” outline allows for Surface Mount placement and multi- functional polarity orientations. The MADS-002545-1307M Series SurMountä Medium Barrier Silicon Schottky Cross-Over Quad Diodes are recommended for use in microwave circuits through Ku band frequencies for lower power applications such as mixers, sub-harmonic mixers, detectors and limiters. The HMIC construction facilitates the direct replacement of more fragile beam lead diodes with the corresponding Surmount diode, which can be connected to a hard or soft substrate circuit with solder. Dim A Inches Min. Max. 0.023 0.025 Millimeters Min. Max. 0.575 0.625 B 0.023 0.025 0.575 0.625 C 0.004 0.008 0.102 0.203 D Sq. 0.007 0.009 0.175 0.225 E Sq. 0.007 0.009 0.175 0.225 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip MADS-002545-1307M V1 Electrical Specifications @ + 25 °C (Measured as Single Diodes) Model Type Number Recommended Vf @ 1 mA ∆Vf @ 1mA Ct @ 0V Rt Slope Resistance Frequency Range ( mV ) ( mV ) ( pF ) ( Vf1–Vf2 ) / ( 10.5mA – 9.5mA ) (Ω) MADS-002545-1307M Medium Barrier DC – 18 GHz 470 Max 390 Typ 10 Max 0.22 Max 0.11 Typ 10 Typical 18 Max Rt is the dynamic slope resistance where Rt = Rs + Rj where Rj =26 / Idc ( Idc is in mA ) and Rs is the Ohmic Resistance. Handling Procedures All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount devices allows the use of standard handling and die attach techniques. It is important to note that industry standard electrostatic discharge (ESD) control is required at all times, due to the sensitive nature of Schottky junctions. Bulk handling should insure that abrasion and mechanical shock are minimized. Absolute Maximum Ratings @ 25 °C 1 Parameter Absolute Maximum Operating Temperature -40 °C to +125 °C Storage Temperature -40 °C to +150 °C Junction Temperature +175 °C Die Bonding Temperature +320 °C for 10 sec. Forward Current 20 mA Reverse Voltage l - 10 µ A l I -5 V I RF C.W. Incident Power +20 dBm C.W. RF & DC Dissipated Power 50 mW 1. Operation of this device above any one of these parameters may cause permanent damage. Die Bonding Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the bottom surface of these devices, and are opposite the active junction. The devices are well suited for high temperature solder attachment onto hard substrates. 80Au/20Sn and Sn63/Pb36/Ag2 solders are acceptable for usage. Maximum solder re-flow temperature is 320 °C for 10 seconds. Die Bonding For Hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Reflow the solder paste by applying Equal heat to the circuit at both die-mounting pads. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after die attach is completed. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip MADS-002545-1307M V1 Circuit Mounting Dimensions ( Inches ) 0.012 0.012 0.012 0.012 0.009 0.009 0.012 0.012 Ordering Information Part Number Package MADS-002545-1307MR Wafer on Ring MADS-002545-1307MG Die in Carrie MADS-002545-1307MT Tape/Reel 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.