MA4SPS552 Surface Mount Monolithic PIN Diode Chip Features n n n n n n n V 1.00 Case Style ODS-1281 Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking) A B Description This device is a silicon-glass PIN diode chip fabricated with M/A-COM’s patented HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. C D Applications E F These packageless devices are suitable for usage in moderate incident power (5 W C.W.) or higher incident peak power (200 W) series, shunt, or series-shunt switches. Small parasitic inductance, 0.7 nH, and excellent RC time constant, 0.20 pS, make the devices ideal for wireless TR switch and accessory switch circuits, where higher P1dB and IP3 values are required. G These diodes can also be used in π, T, tapered resistance, and switched-pad attenuator control circuits for 50Ω or 75Ω systems. Absolute Maximum Ratings1 @ T A = +25°C (unless otherwise specified) Parameter Forward Current 100 mA Reverse Voltage -200 V Operating Temperature -65 °C to +150 °C Storage Temperature -65 °C to +150 °C Junction Temperature +175 °C Dissipated RF & DC Power Mounting Temperature Dim Absolute Maximum 1W +235 °C for 10 seconds 1. Exceeding these limits may cause permanent damage. Inches Millimeters A Min. 0.0207 Max. 0.0226 Min. 0.525 Max. 0.575 B 0.0108 0.0128 0.275 0.325 C 0.0040 0.0080 0.102 0.203 D 0.0069 0.0089 0.175 0.225 E 0.0018 0.0037 0.045 0.095 F 0.0061 0.0081 0.155 0.205 G 0.0069 0.0089 0.175 0.225 1. Backside metal: 0.1 micron thk. 2. Hatched areas indicate bond pads. MA4SPS552 SurMount TM Series Surface Mount PIN Diode Chip V 1.00 Electrical Specifications: @ +25 °C Symbol Parameter Conditions CT Total Capacitance -40 V, 1 MHz CT Total Capacitance RS Units Min. Typ. Max. pF 0.08 0.14 -40 V, 1 GHz pF 0.06 Series Resistance 100 mA, 100 MHz Ω 1.7 RS Series Resistance 20 mA, 100 MHz Ω 2.4 VF Forward Voltage 100 mA V 1.00 1.25 VF Forward Voltage 10 mA V 0.86 1.00 VR Reverse Voltage -10 µA V IR Reverse Leakage Current -40 V nA l -10 l RθJL Thermal Resistance Steady State °C/W 30 TL Minority Carrier Lifetime (50% - 90% V) +10 mA / -6 mA µs 2.5 l -200 l l -275 l Handling Procedures When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board’s mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Techniques Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these diodes and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is recommended, with an equal temperature profile across the contacts. Conductive epoxy paste for attachment may also be used. Since the HMIC™ glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 MA4SPS552 SurMount TM Series Surface Mount PIN Diode Chip V 1.00 Capacitance vs Frequency 0.20 0.18 0.16 0V 0.14 0.12 -5V 0.10 0.08 -40V 0.06 0.04 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 Frequency ( GHz ) Capacitance vs Voltage 0.20 0.18 100 MHz 0.16 1 GHz 0.14 0.12 0.10 0.08 0.06 0.04 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 Voltage ( V ) 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 MA4SPS552 SurMount TM Series Surface Mount PIN Diode Chip V 1.00 Rs vs I 100.0 1GHz 10.0 100MHz 1.0 0.01 0.10 1.00 10.00 100.00 I ( mA ) Rs vs Frequency 4.0 3.5 10mA 3.0 2.5 20mA 2.0 50mA 1.5 100mA 1.0 0.5 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (GHz) 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 MA4SPS552 SurMount TM Series Surface Mount PIN Diode Chip V 1.00 Parallel Resistance vs V 1.0E+06 100MHz 1.0E+05 1GHz 1.0E+04 1.0E+03 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 Reverse Bias ( -V ) 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 MA4SPS552 SurMount TM Series Surface Mount PIN Diode Chip V 1.00 SURMOUNT PIN Diode Model Ls = 0.7 nH Cp Rp Rvia = 0.05 Ω _ Rvia = 0.05 Ω Rs = Rp + 2 * Rvia + Ordering Information Part Number Package MA4SPS552 Die in Carrier MA4SPS552-T Tape/Reel MA4SPS552-W Wafer on Frame 6 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n n n North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300