AME 1.5A CMOS LDO AME8865 n General Description The AME8865 family of positive, CMOS linear regulators, provide low dropout voltage (400mV @ 1.5A) and excellent PSRR, thus making them ideal for power-saving systems. These rugged devices have both Thermal Shutdown, and Current limit to prevent device failure under the "Worst" of operating conditions. The AME8865 is stable with an output capacitance of 4.7µF or larger. n Typical Application IN 400mV Dropout @1.5A Excellent Line and Load Regulation Guaranteed 1.5A Output Current Fixed Output Voltage: 1V to 3.3V Adjustable Output Voltage from 0.8V to 4.5V Over Temperature/Over Current Protection RoHS Compliant and 100%Lead (Pb)-Free n Applications AME8865 OUT GND C1 4.7µF n Features l l l l l l l OUT IN C2 4.7µF ( Fixed Version ) IN OUT IN EN AME8865 GND OUT ADJ R1 C1 4.7µF R2 C2 4.7µF (Adjustable Version ) l Motherboard, Desktop and Computer Peripherals l LCD Monitor l Handheld Device l Data-Communication Rev. A.04 1 AME 1.5A CMOS LDO AME8865 n Functional Block Diagram IN OUT 4 2 EN 1 EN REF R1 AMP R2 OCP/OTP GND 3 (Fixed Version ) IN OUT 4 2 EN 1 EN REF R1 AMP ADJ 5 OCP/OTP GND R2 3 (Adjustable Version ) 2 Rev. A.04 AME 1.5A CMOS LDO AME8865 n Pin Configuration 3 Pin SOT-223 Top View SOT-223 Top View AME 8865-AGTxxx 1. IN 2. GND (TAB) 3. OUT AME8865 1 2 3 * Die Attach: Conductive Epoxy TO-252-2 Top View AME8865 1 2 3 AME8865 1 2 3 AME 8865-ACSxxx 1. IN 2. GND (TAB) 3. OUT * Die Attach: Conductive Epoxy AME8865 1 2 3 Rev. A.04 2 3 AME 8865-BCSxxx 1. GND 2. OUT (TAB) 3. IN * Die Attach: Non-Conductive Epoxy TO-220-3 Top View AME 8865-ABTxxx 1. IN 2. GND (TAB) 3. OUT AME8865 AME 8865-BBTxxx 1. GND 2. OUT (TAB) 3. IN * Die Attach: Non-Conductive Epoxy * Die Attach: Conductive Epoxy 1 * Die Attach: Non-Conductive Epoxy TO-252-2 Top View TO-220-3 Top View AME8865 AME 8865-BGTxxx 1. GND 2. OUT (TAB) 3. IN 1 2 3 3 AME 1.5A CMOS LDO AME8865 n Pin Configuration (Contd.) 3 Pin TO-263-3 Top View AME8865 1 2 3 TO-263-3 Top View AME 8865-ADTxxx 1. IN 2. GND (TAB) 3. OUT * Die Attach: Conductive Epoxy TO-263-2 Top View AME8865 1 2 3 AME8865 1 2 3 AME 8865-BDTxxx 1. GND 2. OUT (TAB) 3. IN * Die Attach: Non-Conductive Epoxy TO-263-2 Top View AME 8865-ADSxxx 1. IN 2. GND (TAB) 3. OUT * Die Attach: Conductive Epoxy AME8865 1 2 3 AME 8865-BDSxxx 1. GND 2. OUT (TAB) 3. IN * Die Attach: Non-Conductive Epoxy 5 Pin TO-263-5 Top View TO-263-5 Top View AME8865 1 2 3 4 5 AME 8865-ADVxxx 1. EN 2. IN 3. GND (TAB) 4. OUT 5. NC * Die Attach: Conductive Epoxy 4 AME8865 1 2 3 4 5 AME 8865-BDVADJ 1. EN 2. IN 3. GND (TAB) 4. OUT 5. ADJ * Die Attach: Conductive Epoxy Rev. A.04 AME 1.5A CMOS LDO AME8865 n Pin Configuration (Contd.) 8 Pin SOP-8/PP Top View 8 7 6 5 AME8865 1 2 3 4 SOP-8/PP Top View AME 8865-AZAADJ 1. ADJ 2. GND 3. GND 4. EN 5. IN 6. GND 7. GND 8. OUT 8 7 6 5 AME8865 1 2 3 4 * Die Attach: Conductive Epoxy SOP-8/PP Top View 8 7 6 2 3 * Die Attach: Conductive Epoxy SOP-8 Top View 5 AME8865 1 AME 8865-BZAADJ 1. EN 2. IN 3. OUT 4. ADJ 5. GND 6. GND 7. GND 8. GND 4 AME 8865-CZAxxx 1. NC 2. GND 3. GND 4. EN 5. IN 6. GND 7. GND 8. OUT * Die Attach: Conductive Epoxy 8 7 6 5 AME8865 1 2 3 4 AME 8865-AHAxxx 1. EN 2. IN 3. OUT 4. ADJ 5. GND 6. GND 7. GND 8. GND * Die Attach: Conductive Epoxy Note: Connect exposed pad (heat sink on the back) to GND. Rev. A.04 5 AME 1.5A CMOS LDO AME8865 n Pin Configuration 3 Pin Pin Number SOT-223 TO-252-2 TO-220-3 TO-263 Pin Name Pin Description Input voltage pin; should be decoupled with 4.7 F or greater capacitor. A B A B A B A B 1 3 1 3 1 3 1 3 IN 2 1 2 1 2 1 2 1 GND Ground connection pin. 3 2 3 2 3 2 3 2 OUT LDO voltage regulator output pin; should be decoupled with a 4.7 F or greater value low ESR ceramic capacitor. 5 Pin Pin Number TO-263-5 6 Pin Name Pin Description A B 2 2 IN Input voltage pin; should be decoupled with 4.7 F or greater capacitor. 1 1 EN Enable pin, Active “high". When pulled “low”, the PMOS pass transistor turns off, current consuming less than 1 A. When EN pin float outside, it’s weakly pulled high form internal MOS. 3 3 GND Ground connection pin. 4 4 OUT LDO voltage regulator output pin; should be decoupled with a 4.7 F or greater value low ESR ceramic capacitor. 5 N/A NC No connection. N/A 5 ADJ Feedback output voltage for adjustable device. Rev. A.04 AME 1.5A CMOS LDO AME8865 n Pin Configuration (Contd.) 8 Pin Pin Number SOP-8/PP SOP-8 Pin Name Pin Description A B C A 5 2 5 2 IN Input voltage pin; should be decoupled with 4.7 F or greater capacitor. 4 1 4 1 EN Enable pin, Active “high". When pulled “low”, the PMOS pass transistor turns off, current consuming less than 1 A. When EN pin float outside, it’s weakly pulled high form internal MOS. 2 3 6 7 5 6 7 8 2 3 6 7 5 6 7 8 GND Ground connection pin. 8 3 8 3 OUT LDO voltage regulator output pin; should be decoupled with a 4.7 F or greater value low ESR ceramic capacitor. 1 4 1 4 ADJ Feedback output voltage for adjustable device. Rev. A.04 7 AME 1.5A CMOS LDO AME8865 n Ordering Information AME8865 - x x x xxx Output Voltage Number of Pins Package Type Pin Configuration Pin Configuration A (SOT-223) (TO-252-2) 1. IN 2. GND 3. OUT (TO-220-3) (TO-263-3) (TO263-2) B (SOT-223) (TO-252-2) 1. GND 2. OUT 3. IN Package Type B: TO-220 C: TO-252 D: TO-263 G: SOT-223 H: SOP-8 Number of Pins A: 8 S: 2 T: 3 V: 5 Output Voltage 100: 1.0V 120: 1.2V 150: 1.5V 180: 1.8V 250: 2.5V 300: 3.0V 330: 3.3V ADJ: Adjustable (TO-220-3) (TO-263-3) (TO-263-2) A (TO-263-5) B (TO-263-5) A (SOP-8) 8 1. EN 2. IN 3. GND 4. OUT 5. NC 1. EN 2. IN 3. GND 4. OUT 5. ADJ 1. EN 2. IN 3. OUT 4. ADJ 5. GND 6. GND 7. GND 8. GND Rev. A.04 AME 1.5A CMOS LDO AME8865 n Ordering Information (Contd.) AME8865 - x x x xxx Output Voltage Number of Pins Package Type Pin Configuration Pin Configuration A (SOP-8/PP) B (SOP-8/PP) C (SOP-8/PP) Rev. A.04 1. NC 2. GND 3. GND 4. EN 5. IN 6. GND 7. GND 8. OUT Package Type Z: SOP-8/PP Number of Pins A: 8 Output Voltage 100: 1.0V 120: 1.2V 150: 1.5V 180: 1.8V 250: 2.5V 300: 3.0V 330: 3.3V ADJ: Adjustable 1. EN 2. IN 3. OUT 4. ADJ 5. GND 6. GND 7. GND 8. GND 1. NC 2. GND 3. GND 4. EN 5. IN 6. GND 7. GND 8. OUT 9 AME 1.5A CMOS LDO AME8865 n Absolute Maximum Ratings Parameter Maximum Unit -0.3 to 6 V GND - 0.3 to VIN + 0.3 V Electrostatic Discharge (HBM) 2 kV Electrostatic Discharge (MM) 200 Electrostatic Discharge (CDM) 1000 Junction Temperature 150 Storage Temperature Range 200 Input Voltage Output Voltage V o C n Recommended Operating Conditions Parameter 10 Symbol Rating Unit Power Input Voltage VIN 2.5 to 5.5 V Ambient Temperature Range TA - 40 to +85 o C Junction Temperaturen Range TJ - 40 to +125 o C Rev. A.04 AME 1.5A CMOS LDO AME8865 n Thermal Information Parameter Package SOT-223 TO-252-2 Thermal Resistance* (Junction to Case) TO-220-3 Maximum Conductive Epoxy 25 Non-Conductive Epoxy 31 Conductive Epoxy 5 Non-Conductive Epoxy 30 Conductive Epoxy 6 Non-Conductive Epoxy θJC 24 Conductive Epoxy 5 TO-263-2 TO-263-3 Non-Conductive Epoxy 27 SOP-8/PP Conductive Epoxy 19 SOP-8 Conductive Epoxy 60 Conductive Epoxy 120 Non-Conductive Epoxy 135 Conductive Epoxy 90 Non-Conductive Epoxy 140 Conductive Epoxy 55 TO-252-2 Rev. A.04 Symbol TO-263-2 TO-263-3 TO-263-5 SOT-223 Thermal Resistance (Junction to Ambient) Die Attach TO-220-3 Non-Conductive Epoxy θJA 80 TO-263-2 TO-263-3 TO-263-5 Conductive Epoxy 80 TO-263-2 TO-263-3 Non-Conductive Epoxy 100 SOP-8/PP Conductive Epoxy 84 SOP-8 Conductive Epoxy 150 Unit o C/W o C/W 11 AME 1.5A CMOS LDO AME8865 n Thermal Information (Contd.) Parameter Package SOT-223 TO-252-2 TO-220-3 Internal Power Dissipation Die Attach Symbol Maximum Conductive Epoxy 900 Non-Conductive Epoxy 800 Conductive Epoxy 1200 Non-Conductive Epoxy 1000 Conductive Epoxy 2200 Non-Conductive Epoxy PD 1600 TO-263-2 TO-263-3 TO-263-5 Conductive Epoxy 1700 TO-263-2 TO-263-3 Non-Conductive Epoxy 1400 SOP-8/PP Conductive Epoxy 1450 SOP-8 Conductive Epoxy 810 Lead Temperature (soldering 10 sec)** 260 Unit mW o C * Measure θJC on backside center of tab ** MIL-STD-202G 210F 12 Rev. A.04 AME 1.5A CMOS LDO AME8865 n Electrical Specifications Typical values VIN=VOUT+1V( for VOUT< 2V VIN=2.5V) with typical TA=25oC, unless otherwise specified. Parameter Input Voltage Output Accuracy (For Fixed Version) Symbol Max Units 5.5 V VOUT,ACC -2 2 % 0.816 V 1 µA 4.5 V ADJ Input Bias Current IADJ Output Voltage Range (For ADJ Version) VOUT Quiescent Current (For Fixed Version) Typ 2.5 VADJ Output Current Min VIN ADJ Reference Voltage Dropout Voltage (Note1) Test Condition VDROP 0.784 0.8 VIN=5V, VADJ=1.0V 0.8 IOUT=1.5A, 1.2VVOUT(NOM) 1.8V 600 IOUT=1.5A, 1.8V< VOUT(NOM) 2.5V 500 IOUT=1.5A, 2.5V<VOUT(NOM) 400 IOUT Note2 mV 1.5 A IQ IOUT=0mA 500 µA Line Regulation REGLINE VIN,MINVINVIN,MIN+0.7V 10mA 0.25 %/V Load Regulation REGLOAD VIN=VOUT+1V 10mA IOUT 1.5A 0.8 PSRR F=120Hz, IOUT=100mA, COUT=4.7uF 60 Output Current Limit ILIM VOUT = 0.9 x VOUT(NOM) Short Circuit Current ISC VIN= VOUT(NOM)+1V, VOUT < 0.4V 900 Shutdown, temperature increasing 150 Restore, temperature decreasing 130 Power Supply Rejection Ratio Thermal Shutdown Temperature TSHDN EN Pin Voltage High VEH,HI VIN(MIN) VIN 5.5V EN Pin Voltage Low VEN,LO VIN(MIN) VIN 5.5V Enable Input Bias Current Shutdown Current IEN ISHDN 2 dB 1.6 A 1.4 mA o C VIN V 0.4 V VEN = VIN 0.1 1.0 VEN = 0V 0.1 1.0 VEN=0V %/A 1.5 µA µA Note 1. Dropout Voltage is measured at VOUT = VOUT(NOM) x 98% Note 2. VIN(MIN) = VDROP + VOUT(NOM) or VIN(MIN) = 2.5V whichever is greater Rev. A.04 13 AME 1.5A CMOS LDO AME8865 n Detailed Description The AME8865 is low-dropout; low quiescent current linear regulator designed for motherboard, notebook and LCD monitor applications. The output voltage range from 0.8V to 4.5V, and can drive 1.5A loading current. Capacitor Selection and Regulator Stability Use 4.7µF for input capacitor and 4.7µF or greater for output capacitor on the AME8865. Larger input capacitor value and low ESR provide better supply noise rejection and improve line transient response. To reduce output noise and load transient response, use output capacitor greater than 4.7uF. In addition, AME8865 can prevent output voltage overshoot at power-on or enabled through the EN/ENB pin. Calculating the Maximum Output Power The maximum output power of the AME8865 is limited by the maximum power dissipation of the package. By calculation the power dissipation of the package as a function of the input voltage, output voltage and output current, the maximum input voltage can be obtained. The maximum power dissipation should not exceed the package's maximum power rating. PMAX = (VIN(MAX)-VOUT) x IOUT Where: VIN(MAX) = maximum input voltage PMAX = maximum power dissipation of the package Adjustable Version The adjustable version uses external feedback resistors to generate an output voltage anywhere from 1.0V to 5.0V. By the equation: VOUT = V ADJ (1 + R1 ) R2 Feedback resistors R1 and R2 should be high enough to keep quiescent current low, but increasing R1 + R2 will reduce stability. In general, R1 and R2 in the 10’ s of KΩ will produce adequate stability, given reasonable layout precautions. To improve stability characteristics, keep parasites on the ADJ pin to a minimum, and lower R1 and R2 values. 14 Rev. A.04 AME 1.5A CMOS LDO AME8865 n Characterization Curve Load Transient Response Load Transient Response VIN=5V, IOUT=10mA~1A, VOUT=2.5V VIN=5V, IOUT=10mA~1.5A, VOUT=2.5V VOUT C2 (200mV/div) IOUT (1A/div) VOUTC2 (200mV/div) IOUT (1A/div) C4 C4 Time(50µs/div) Time(50µs/div) Power On from VIN Power Off from VIN VIN=5V, IOUT=1.5A, VOUT=2.5V VIN (2V/div) V OUT (2V/div) IIN (1A/div) VIN=5V, IOUT=1.5A, VOUT=2.5V V IN (2V/div) C1 VOUT C2 (2V/div) C1 C2 IIN C4 (1A/div) C4 Time(5ms/div) Time(5ms/div) Line Transient Response VIN=3.5~4.5V, IOUT=10mA, VOUT=2.5V V IN (1V/div) V OUT (20mV/div) C1 C2 Time(500µs/div) Rev. A.04 15 AME 1.5A CMOS LDO AME8865 n Characterization Curve Output Voltage vs. Temperature Quiescent Current vs. Temperature 0.7 Quiescent Current (mA) Output Voltage (V) 3.43 3.39 3.35 3.31 3.27 0.65 0.6 0.55 0.5 0.45 0.4 0.35 0.3 3.23 -40 -25 -10 5 20 35 50 65 80 95 110 -40 125 -25 -10 Temperature ( C) 20 35 50 65 80 95 110 125 o Dropout Voltage vs. Temperature Line Regulation vs. Temperature 0.6 1.4 0.55 Line Regulation (%/V) Dropout Voltage (V) 5 Temperature ( C) o 0.5 0.45 0.4 0.35 0.3 0.25 0.2 1.2 1 0.8 0.6 0.4 0.2 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature ( C) -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature ( C) o o Short Circuit Current vs. Input Voltage Short Circuit Current (A) 1.8 1.7 1.6 1.5 1.4 1.3 2.5 3 3. 5 4 4.5 5 5.5 Input Voltage (V) 16 Rev. A.04 AME 1.5A CMOS LDO AME8865 n Date Code Rule Month Code 1: January 7: July 2: February 8: August 3: March 9: September 4: April A: October 5: May B: November 6: June C: December n Tape and Reel Dimension SOT-223 P W AME AME PIN 1 Carrier Tape, Number of Components Per Reel and Reel Size Rev. A.04 Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOT-223 12.0±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm 17 AME 1.5A CMOS LDO AME8865 n Tape and Reel Dimension (Contd.) TO-252-2 P PIN 1 W AME AME Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size TO-252-2 16.0±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm TO-263-3 P PIN 1 W AME AME Carrier Tape, Number of Components Per Reel and Reel Size 18 Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size TO-263-3 24.0±0.1 mm 4.0±0.1 mm 800pcs 330±1 mm Rev. A.04 AME 1.5A CMOS LDO AME8865 n Tape and Reel Dimension (Contd.) TO-263-2 P W PIN 1 AME AME Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size TO-263-2 24.0±0.1 mm 4.0±0.1 mm 800pcs 330±1 mm TO-263-5 P W PIN 1 AME AME Carrier Tape, Number of Components Per Reel and Reel Size Rev. A.04 Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size TO-263-5 24.0±0.1 mm 4.0±0.1 mm 800pcs 330±1 mm 19 AME 1.5A CMOS LDO AME8865 n Tape and Reel Dimension (Contd.) SOP-8/PP P PIN 1 W AME AME Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOP-8/PP 12.0±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm SOP-8 P PIN 1 W AME AME Carrier Tape, Number of Components Per Reel and Reel Size 20 Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOP-8 12.0±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm Rev. A.04 AME 1.5A CMOS LDO AME8865 n Package Dimension SOT-223 Top View Side View D B1 C o H 13 (4X) E MILLIMETERS SYMBOLS PIN 1 MIN MAX MIN MAX A1 0.01 0.10 0.0004 0.0039 B 0.60 0.84 0.0236 0.0330 B1 2.90 3.15 0.1140 0.1240 C 0.24 0.38 0.0094 0.0150 D 6.20 6.71 0.2441 0.2640 E 3.30 3.71 0.1299 0.1460 2.30 BSC e e Front View 13 o (4X) 1.40 1.80 0.0551 0.0709 H 6.70 7.30 0.2638 0.2874 o o 0 o 10 10o 0 B TO-252-2 SYMBOLS Top View Side View E K B A D1 L F E1 G PIN 1 J 0.0906 BSC F F A1 INCHES H C D MILLIMETERS INCHES MIN MAX MIN MAX A 0.43 0.89 0.0169 0.0350 B 1.60 1.95 0.0630 0.0768 C 0.51 1.78 0.0200 0.0701 D 0.43 0.60 0.0169 0.0236 E 6.35 6.80 0.2500 0.2677 F 5.36 6.22 0.2110 0.2450 G 2.20 3.00 0.0866 0.1181 H - * 2.30 - *0.0906 J 0.50 0.97 0.0197 0.0380 K 4.95 5.50 0.1950 0.2165 L 0.90 1.65 0.0354 0.0650 D1 E1 3.80 REF 3.81 5.10 0.1496 REF 0.1500 0.2008 *: Typical Value Notes: 1. Controlling dimension: Millimeters. 2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material. Rev. A.04 21 AME 1.5A CMOS LDO AME8865 n Package Dimension (Contd.) TO-220-3 Top View G Side View C D Bottom View A A I P P1 G1 PIN 1 M O N E K TO-263-3 Side View Bottom View A K E B1 B H A2 D P G R Front View C N INCHES MIN MAX MIN MAX 5.58 7.49 0.2197 0.2949 C 2.03 4.83 0.0799 0.1902 D 0.50 1.45 0.0197 0.0571 E 0.30 1.15 0.0118 0.0453 G 9.65 10.67 0.3799 0.4201 I 3.53 4.09 0.1390 0.1610 K 0.50 1.15 0.0197 0.0453 M 1.14 1.78 0.0449 0.0701 N 2.28 2.80 0.0898 0.1102 O 12.70 14.74 0.5000 0.5803 P 14.22 16.51 0.5598 0.6500 P1 5.00 5.70 0.1969 0.2244 G1 7.30 8.05 0.2874 0.3169 SYMBOLS Top View PIN 1 MILLIMETERS SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 9.65 10.67 0.380 0.420 B 8.28 9.66 0.326 0.380 C 4.06 4.83 0.160 0.190 D 0.50 1.36 0.020 0.054 E 1.14 1.45 0.045 0.057 * G * 2.54 0.100 H 14.60 15.875 K 0.99 2.93 2.28 0.625 0.03898 0.11535 0.31 N P 0.5748 0.012 2.80 0.08976 0.11024 R 0 B1 A2 5.00 5.70 0.197 0.224 7.30 8.05 0.287 0.317 o 8 o 0o 8o *: Typical Value Notes: 1. Controlling dimension: Millimeters. 2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material. 22 Rev. A.04 AME 1.5A CMOS LDO AME8865 n Package Dimension (Contd.) TO-263-2 MILLIMETERS SYMBOLS TOPVIEW SIDEVIEW BOTTOMVIEW A K E B2 B H G MAX MIN MAX A 9.65 10.42 0.380 0.410 B 8.28 9.66 0.326 0.380 C 4.06 4.83 0.160 0.190 D 0.50 1.36 0.020 0.054 E 1.14 1.45 0.045 * FRONTVIEW 14.60 15.80 0.575 0.622 K 0.99 2.93 0.039 0.115 0.38 REF 2.28 0.015 REF 2.80 0.090 0.110 R 0 B2 6.30 8.20 0.248 0.323 A2 7.30 8.95 0.287 0.352 o 8 o 0 o 8o *: Typical Value Notes: 1. Controlling dimension: Millimeters 2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material. TO-263-5 TOP VIEW SIDE VIEW A BOTTOM VIEW A1 E B1 B H SYMBOLS MILLIMETERS PIN 1 P D N G C FRONT VIEW R INCHES MIN MAX MIN MAX A 9.800 10.668 0.386 0.420 B 8.200 9.169 0.323 0.361 C 4.310 4.800 0.170 0.189 D 0.660 0.910 0.026 0.036 E 1.140 1.450 0.045 0.057 1.70 REF G Rev. A.04 0.100 H P C 0.057 * 2.54 N N R K MIN G P PIN1 D A2 INCHES 0.067 REF H 14.600 15.875 0.575 0.625 K 1.143 1.760 0.045 0.069 N 0.310 0.580 0.012 0.023 P 2.280 2.800 0.090 0.110 R 0o 8o 0o 8o A1 7.500 7.700 0.295 0.303 B1 5.800 6.450 0.228 0.254 23 AME 1.5A CMOS LDO AME8865 n Package Dimension (Contd.) SOP-8/PP TOP VIEW SIDE VIEW D1 θ E1 E2 E L1 C PIN 1 D e A1 FRONT VIEW A A2 b SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 1.350 1.750 0.053 0.069 A1 0.000 0.250 0.000 0.010 A2 1.250 1.650 0.049 0.065 C 0.100 0.250 0.004 0.010 E 3.750 4.150 0.148 0.163 E1 5.700 6.300 0.224 0.248 L1 0.300 1.270 0.012 0.050 b 0.310 0.510 0.012 0.020 D 4.720 5.120 0.186 0.202 1.270 BSC e 0.050 BSC θ 0 E2 2.050 2.600 0.081 0.102 D1 2.090 3.500 0.082 0.138 o 8 o 0 o 8o SOP-8 24 Rev. A.04 www.ame.com.tw E-Mail: [email protected] Life Support Policy: These products of AME, Inc. are not authorized for use as critical components in life-support devices or systems, without the express written approval of the president of AME, Inc. AME, Inc. reserves the right to make changes in the circuitry and specifications of its devices and advises its customers to obtain the latest version of relevant information. AME, Inc. , September 2013 Document: A003B-DS8865-A.04 Corporate Headquarter AME, Inc. 8F, 12 WenHu St., Nei-Hu Taipei 114, Taiwan . Tel: 886 2 2627-8687 Fax: 886 2 2659-2989