MC14008B 4-Bit Full Adder The MC14008B 4−bit full adder is constructed with MOS P−Channel and N−Channel enhancement mode devices in a single monolithic structure. This device consists of four full adders with fast internal look−ahead carry output. It is useful in binary addition and other arithmetic applications. The fast parallel carry output bit allows high−speed operation when used with other adders in a system. http://onsemi.com Features • • • • • • • • Look−Ahead Carry Output Diode Protection on All Inputs All Outputs Buffered Supply Voltage Range = 3.0 Vdc to 18 Vdc Capable of Driving Two Low−Power TTL Loads or One Low−Power Schottky TTL Load Over the Rated Temperature Range Pin−for−Pin Replacement for CD4008B These Devices are Pb−Free and are RoHS Compliant NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable MARKING DIAGRAMS PDIP−16 P SUFFIX CASE 648 16 MC14008BCP AWLYYWWG 1 16 SOIC−16 D SUFFIX CASE 751B 14008BG AWLYWW 1 MAXIMUM RATINGS (Voltages Referenced to VSS) Symbol Value Unit −0.5 to +18.0 V −0.5 to VDD + 0.5 V Input or Output Current (DC or Transient) per Pin ± 10 mA PD Power Dissipation, per Package (Note 1) 500 mW TA Ambient Temperature Range −55 to +125 °C Tstg Storage Temperature Range −65 to +150 °C TL Lead Temperature (8−Second Soldering) 260 °C VDD Vin, Vout Iin, Iout Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Indicator ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. © Semiconductor Components Industries, LLC, 2013 April, 2013 − Rev. 7 1 Publication Order Number: MC14008B/D MC14008B PIN ASSIGNMENT A4 1 16 VDD B3 2 15 B4 A3 3 14 Cout B2 4 13 S4 A2 5 12 S3 B1 6 11 S2 A1 7 10 S1 VSS 8 9 Cin TRUTH TABLE (One Stage) Cin B A Cout S 0 0 0 0 0 0 1 1 0 1 0 1 0 0 0 1 0 1 1 0 1 1 1 1 0 0 1 1 0 1 0 1 0 1 1 1 1 0 0 1 BLOCK DIAGRAM HIGH-SPEED PARALLEL CARRY B4 15 A4 1 B3 2 A3 3 B2 4 A2 5 B1 6 A1 7 Cin 9 14Cout ADDER 4 13S4 C4 ADDER 3 12S3 C3 ADDER 2 11S2 C2 ADDER 1 10S1 VDD = PIN 16 VSS = PIN 8 ORDERING INFORMATION Package Shipping† MC14008BCPG PDIP−16 (Pb−Free) 500 Units / Rail MC14008BDR2G SOIC−16 (Pb−Free) 2500 Units / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MC14008B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) Characteristic Symbol − 55_C 25_C 125_C VDD Vdc Min Max Min Typ (Note 2) Max Min Max Unit Output Voltage Vin = VDD or 0 “0” Level VOL 5.0 10 15 — — — 0.05 0.05 0.05 — — — 0 0 0 0.05 0.05 0.05 — — — 0.05 0.05 0.05 Vdc Vin = 0 or VDD “1” Level VOH 5.0 10 15 4.95 9.95 14.95 — — — 4.95 9.95 14.95 5.0 10 15 — — — 4.95 9.95 14.95 — — — Vdc Input Voltage “0” Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) VIL 5.0 10 15 — — — 1.5 3.0 4.0 — — — 2.25 4.50 6.75 1.5 3.0 4.0 — — — 1.5 3.0 4.0 (VO = 0.5 or 4.5 Vdc) “1” Level (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) VIH 5.0 10 15 3.5 7.0 11 — — — 3.5 7.0 11 2.75 5.50 8.25 — — — 3.5 7.0 11 — — — 5.0 5.0 10 15 – 3.0 – 0.64 – 1.6 – 4.2 — — — — – 2.4 – 0.51 − 1.3 − 3.4 – 4.2 – 0.88 – 2.25 − 8.8 — — — — – 1.7 − 0.36 – 0.9 − 2.4 — — — — IOL 5.0 10 15 0.64 1.6 4.2 — — — 0.51 1.3 3.4 0.88 2.25 8.8 — — — 0.36 0.9 2.4 — — — mAdc Input Current Iin 15 — ± 0.1 — ± 0.00001 ± 0.1 — ± 1.0 mAdc Input Capacitance (Vin = 0) Cin — — — — 5.0 7.5 — — pF Quiescent Current (Per Package) IDD 5.0 10 15 — — — 5.0 10 20 — — — 0.005 0.010 0.015 5.0 10 20 — — — 150 300 600 mAdc IT 5.0 10 15 Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Source Sink Total Supply Current (Notes 3 & 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IOH Vdc Vdc mAdc IT = (1.7 mA/kHz) f + IDD IT = (3.4 mA/kHz) f + IDD IT = (5.0 mA/kHz) f + IDD 2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL − 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.005. http://onsemi.com 3 mAdc MC14008B ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C) Characteristic Symbol Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns Min Typ (Note 6) Max 5.0 10 15 — — — 100 50 40 200 100 80 Unit ns tTLH, tTHL Propagation Delay Time Sum in to Sum Out tPLH, tPHL = (1.7 ns/pF) CL + 315 ns tPLH, tPHL = (0.66 ns/pF) CL + 127 ns tPLH, tPHL = (0.5 ns/pF) CL + 90 ns Sum In to Carry Out tPLH, tPHL = (1.7 ns/pF) CL + 220 ns tPLH, tPHL = (0.66 ns/pF) CL + 112 ns tPLH, tPHL = (0.5 ns/pF) CL + 85 ns Carry In to Sum Out tPLH, tPHL = (1.7 ns/pF) CL + 290 ns tPLH, tPHL = (0.66 ns/pF) CL + 122 ns tPLH, tPHL = (0.5 ns/pF) CL + 90 ns Carry In to Carry Out tPLH, tPHL = (1.7 ns/pF) CL + 85 ns tPLH, tPHL = (0.66 ns/pF) CL + 42 ns tPLH, tPHL = (0.5 ns/pF) CL + 30 ns VDD Vdc tPLH, tPHL ns 5.0 10 15 — — — 400 160 115 800 320 230 5.0 10 15 — — — 305 145 110 610 290 220 5.0 10 15 — — — 375 155 115 750 310 230 5.0 10 15 — — — 170 75 55 340 150 110 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. VDD = -VGS Vout VDD = VGS 16 B4 A4 B3 A3 B2 A2 S4 B1 A1 Cin S1 8 16 S3 S2 IOH Cout VSS Vout EXTERNAL POWER SUPPLY B4 A4 B3 A3 B2 A2 S4 B1 A1 Cin S1 8 Figure 1. Typical Source Current Characteristics Test Circuit S3 S2 IOL Cout VSS EXTERNAL POWER SUPPLY Figure 2. Typical Sink Current Characteristics Test Circuit http://onsemi.com 4 MC14008B VDD 16 20 ns Vin 20 ns 90% 10% VDD VSS PULSE GENERATOR B4 A4 B3 A3 B2 A2 S4 B1 A1 Cin S1 8 S3 S2 CL CL CL Cout CL CL VSS IDD 500 mF Figure 3. Dynamic Power Dissipation Test Circuit and Waveform VDD 16 B4 A4 B3 A3 B2 A2 B1 A1 PULSE GENERATOR Cin 8 S4 S3 S2 CL S1 CL CL Cout CL CL VSS IDD 20 ns Cin 20 ns VDD 90% 50% 10% VSS tPHL tPLH VOH 90% 50% 10% S1 - S4 VOL tTHL tTLH VOH Cout 50% VOL tPLH tPHL Figure 4. Switching Time Test Circuit and Waveforms http://onsemi.com 5 MC14008B Cout B4 S4 A4 B3 S3 A3 B2 S2 A2 B1 S1 A1 Cin Figure 5. Logic Diagram TYPICAL APPLICATION WORD A + B INPUTS A1 Cin S1 B4 CHIP 1 Cout S4 A1 Cin S1 B4 CHIP 2 Cout S4 A1 Cin S1 B4 CHIP 3 Cout S4 A1 Cin B4 CHIP 4 S1 SUM OUTPUTS Calculation of 16−bit adder speed: tP total = tP (Sum to Carry) + tP (Carry to Sum) + 2 tP (Carry to Carry) The guaranteed 16−bit adder speed at 10 V, 25°C, CL = 50 pF is: tp total = 290 + 310 + 300 = 900 ns Figure 6. Using the MC14008B in a 16−Bit Adder Configuration http://onsemi.com 6 Cout S4 MC14008B PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 7 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC14008B PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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