APL3520A/B/C/D USB Dual Power-Distribution Switches Features General Description • 70mΩ High Side MOSFET • Continuous Current The APL3520 series of power switches are designed for USB applications. The 70mΩ N-channel MOSFET power switch satisfies the voltage drop requirements of USB specification. -APL3520A/B: 1.5A -APL3520C/D: 1A • Wide Supply Voltage Range: 2.7V to 5.5V • Current Limit and Short-Circuit Protections • Over-Temperature Protection • Deglitched Fault Indication Output • Logic Level Enable Input • Lead Free and Green Devices Available The protection features include current-limit protection, short circuit protection, and over-temperature protection. The device limits the output current at current limit threshold level, and when VOUT drops below 1.5V, the devices limit the current to a lower and safe level. The OTP limits the junction temperature below 140 oC in case of short circuit or over load conditions. Other features include deglitched OCBx output to indi- (RoHS Compliant) • UL Approved-File No. 20121029-E328191 • Nemko IEC 60950-1 CB_Scheme Certified, No. cate the fault condition and ENx input to turn on or turn off output. NO70693 • TUV IEC 60950-1 and EN 60950-1 Certified, No.44 Applications 780 12 406748-007 • Notebook and Desktop Computers • USB Ports • High-Side Power Protection Switchs Simplified Application Circuit APL3520A/B/C/D VIN EN Control 1 EN Control 2 VIN VOUT1 OCB1 EN1/ VOUT2 ENB1 OCB2 EN2/ ENB2 GND VOUT1 VOUT2 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 1 www.anpec.com.tw APL3520A/B/C/D Pin Configurations 8 OCB1 GND 1 VIN 2 7 VOUT1 EN1 3 6 VOUT2 EN2 4 GND 1 VIN 2 EN1 3 EN2 4 5 OCB2 8 OCB1 VIN 2 7 VOUT1 ENB1 3 6 VOUT2 ENB2 4 5 OCB2 GND 1 VIN 2 ENB1 3 ENB2 4 8 7 6 5 OCB1 VOUT1 VOUT2 OCB2 GND 1 VIN 2 EN1 3 EN2 4 GND 1 VIN 2 ENB1 3 ENB2 4 TDFN2x2-8 APL3520A/C (Top Voew) 8 7 6 5 8 7 6 5 OCB1 VOUT1 VOUT2 OCB2 OCB1 VOUT1 VOUT2 OCB2 OCB1 VOUT1 VOUT2 OCB2 8 7 6 5 OCB1 VOUT1 VOUT2 OCB2 GND 1 VIN 2 ENB1 3 ENB2 4 MSOP-8P APL3520B/D (Top View) GND 1 VIN 2 8 OCB1 GND 1 8 OCB1 7 VOUT1 EN1 3 6 VOUT2 VIN 2 ENB1 3 7 VOUT1 6 VOUT2 5 OCB2 ENB2 4 EN2 4 TDFN2x2-8 APL3520B/D (Top Voew) 8 7 6 5 MSOP-8P APL3520A/C (Top View) MSOP-8 APL3520B/D (Top View) SOP-8 APL3520B/D (Top View) GND 1 VIN 2 EN1 3 EN2 4 OCB1 VOUT1 VOUT2 OCB2 MSOP-8 APL3520A/C (Top View) SOP-8 APL3520A/C (Top View) GND 1 8 7 6 5 DFN3x3-8 APL3520A/C 5 OCB2 DFN3x3-8 APL3520B/D = Exposed Pad (connected to ground plane for better heat dissipation) Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 2 www.anpec.com.tw APL3520A/B/C/D Ordering and Marking Information Package Code K : SOP-8 X : MSOP-8 XA : MSOP-8P QB : TDFN2x2-8 QA : DFN3x3-8 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Output Current/EN Function A: 1.5A/Active High B: 1.5A/ Active Low C: 1A/Active High D: 1A/Active Low Assembly Material G : Halogen and Lead Free Device APL3520 Assembly Material Handling Code Temperature Range Package Code Output Current/EN Function APL3520A XXXXX APL3520B XXXXX APL3520C XXXXX APL3520D XXXXX XA: L520A XXX XX L520B XXX XX L520C XXX XX L520D XXX XX XXX - Date Code XX APL3520A/B/C/D QB: L20A X L20B X L20C X L20D X X - Date Code APL3520A/B/C/D QA: APL 3520A XXXXX APL 3520B XXXXX APL 3520C XXXXX APL 3520D XXXXX XXXXX - Date Code APL3520A/B/C/D K: APL3520A/B/C/D X: APL3520A/B/C/D XXXXX - Date Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol (Note 1) Rating Unit VIN VIN Input Voltage (VIN to GND) -0.3 ~ 5.7 V VOUT1, VOUT2 VOUT1, VOUT2 to GND Voltage -0.3 ~ 5.7 V EN1, EN2 to GND Voltage (APL3520A/C) -0.3 ~ 5.7 V VENB1, VENB2 ENB1, ENB2 to GND Voltage (APL3520B/D) -0.3 ~ 5.7 V VOCB1, VOCB2 OCB1, OCB2 to GND Voltage -0.3 ~ 5.7 VEN1, VEN2 TJ Parameter Maximum Junction Temperature TSTG Storage Temperature TSDR Maximum Lead Soldering Temperature, 10 Seconds ESD Immunity HBM (Human Body Mode) MM (Machine Mode) V 150 o -65 ~ 150 o 260 o C C C 2 kV 200 V Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 3 www.anpec.com.tw APL3520A/B/C/D Thermal Characteristics Symbol Parameter Typical Value Unit Junction-to-Ambient Resistance in Free Air (Note 2) θJA SOP-8 95 MSOP-8 160 MSOP-8P 50 TDFN2x2-8 80 DFN3x3-8 70 o C/W Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions (Note 3) Symbol VIN Parameter VIN Input Voltage IOUT OUT Output Current (Each Port) TA Ambient Temperature TJ Range Unit 2.7 ~ 5.5 V APL3520A/B 0 ~ 1.5 APL3520C/D 0~1 Junction Temperature A -40 ~ 85 o -40 ~ 125 o C C Note 3 : Refer to the typical application circuit Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 4 www.anpec.com.tw APL3520A/B/C/D Electrical Characteristics Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC. Symbol Parameter APL3520 Test Conditions Unit Min. Typ. Max. No load, VEN1=VEN2=0V or VENB1=VENB2 =5V - - 1 µA No load, VEN1=VEN2=5V or VENB1=VENB2=0V - 90 - µA Leakage Current VOUT1=GND, VEN1=0V or VENB1=5V VOUT2=GND, VEN2=0V or VENB2=5V - - 1 µA Reverse Leakage Current VIN=GND, VOUT1=5V VIN=GND, VOUT2=5V - 0 1 µA - 70 - mΩ IOUT=1A, TA= -40 ~ 85 C - 70 - mΩ VIN rising, TA= -40 ~ 85 oC 1.7 - 2.65 V - 0.2 - V APL3520A/B - 3.2 3.9 A APL3520C/D - 1.7 2.3 A APL3520A/B - 1.5 - A APL3520C/D - 0.8 - A - 0.2 0.4 V - - 1 µA 4 10 15 ms SUPPLY CURRENT VIN Supply Current POWER SWITCH1 & POWER SWITCH2 RDS(ON) Power Switch On Resistance IOUT=1A, TA= 25 oC o UNDER-VOLTAGE LOCKOUT (UVLO) VIN UVLO Threshold Voltage VIN UVLO Hysteresis PROTECTIONS (CURRENT LIMIT1/2 AND SHORT-CIRCUIT1/2) ILIM ISHORT Current Limit Threshold Short-Circuit Output Current VIN=2.7V to 5.5V, TA= -40 ~ 85 oC VIN=2.7V to 5.5V FAULT INDICATION OUTPUT (OCB1 AND OCB2) tD(OCB) OCB Output Low Voltage IOCB=5mA OCB Leakage Current VOCB=5V OCB Deglitch Time o OCB assertion, TA= -40 ~ 85 C ENABLE/DISABLE (EN1/ENB1 AND EN2/ENB2) VIH Input Logic HIGH VIN=2.7V to 5V 2 - - V VIL Input Logic LOW VIN=2.7V to 5V - - 0.8 V Input Current VOUT Discharge Resistance tD(ON) tD(OFF) tSS VEN=0V or VENB=5V, Turn on Delay Time Turn off Delay Time Soft-Start Time No load, COUT=1µF, VIN=5V - - 1 µA - 40 100 Ω - 30 - µs - 5 - µs - 400 - µs - 140 - °C - 20 - °C OVERT-TEMPERATURE PROTECTION (OTP1 & OTP2) TOTP Over-Temperature Threshold TJ rising Over-Temperature Hysteresis Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 5 www.anpec.com.tw APL3520A/B/C/D Pin Description PIN FUNCTION NO. NAME 1 GND Ground. 2 VIN Power Supply Input. Connect this pin to external DC supply. 3 4 EN1 (APL3520A/C) Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN1 pin cannot be left floating. ENB1 (APL3520B/D) Enable Input. Pulling this pin to high will disable the device and pulling this pin to low will enable device. The ENB1 pin cannot be left floating. EN2 (APL3520A/C) Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN2 pin cannot be left floating. ENB2 (APL3520B/D) Enable Input. Pulling this pin to high will disable the device and pulling this pin to low will enable device. The ENB2 pin cannot be left floating. 5 OCB2 Fault Indication Pin. This pin goes low when a current limit or an over-temperature condition is detected in VOUT2 after a 10ms deglitch time. 6 VOUT2 Output Voltage Pin. The output voltage follows the input voltage. When ENB2 is high or EN2 is low the output voltage is discharged by an internal resistor. 7 VOUT1 Output Voltage Pin. The output voltage follows the input voltage. When ENB1 is high or EN1 is low the output voltage is discharged by an internal resistor. 8 OCB1 Fault Indication Pin. This pin goes low when a current limit or an over-temperature condition is detected in VOUT1 after a 10ms deglitch time. - EP Exposed Pad. Connect it to a large ground plane for heat sinking. (TDFN2x2-8, MSOP-8P) Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 6 www.anpec.com.tw APL3520A/B/C/D Typical Operating Characteristics Switch On Resistance vs. Junction Temperature Switch On Resistance vs. Input Voltage 130 Switch On Resistance , RDS(on) (mΩ) Switch On Resistance , RDS(on) (mΩ) 120 100 80 60 40 20 VIN =5V, RLOAD =47Ω, CIN =1uF/X7R, COUT =10µF/X7R, RLOAD =47Ω, CIN =1uF/X7R, COUT =10µF/X7R, TA=25oC 120 110 100 90 80 70 60 50 0 -50 0 50 100 150 2.5 3.0 o Junction Temperature ( C) 4.5 5.0 5.5 Supply Current vs. Input Voltage 100 100 95 Supply Current, ICC (uA) 95 Supply Current, ICC (uA) 4.0 Input Voltage (V) Supply Current vs. Junction Temperature 90 85 80 75 70 90 85 80 75 70 VEN1=VEN2=5V, RLOAD = Open, CIN =COUTx =33µF/Electrolytic, TA=25℃ 65 VIN =VEN1=VEN2=5V, RLOAD = Open, CIN =COUT =33µF/Electrolytic 65 60 60 -50 0 50 100 2.5 150 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage (V) Junction Temperature (oC) Switch Off Supply Current vs. Junction Temperature Current Limit Threshold vs. Input Voltage 4.5 10 VIN = 5V, RLOAD = Open, CIN = COUT =33µF/Elctrolytic 9 8 Current Limit Threshold, ILIM (A) Switch Off Supply Current, ICC(OFF) (uA) 3.5 7 6 5 4 3 2 1 4.0 3.5 3.0 2.5 TA =25oC 2.0 0 -50 0 50 100 2.5 150 Junction Temperature C) Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage (V) (o 7 www.anpec.com.tw APL3520A/B/C/D Typical Operating Characteristics Current-Limit Response vs. Output Peak Current Current Limit Threshold vs. Junction Temperature 5.0 APL3520A, VIN = 5V, TA =25oC 250 Current Limit Threshold, ILIM (A) Current-Limit Response (µs) 300 200 150 100 50 4.5 4.0 3.5 3.0 2.5 2.0 0 0 2 4 6 8 10 -50 Output Peak Current (A) 100 150 Junction Temperature C) EN pin Threshold Voltage vs. Junction Temperature 1.6 3.0 TA=25oC EN pin Threshold Voltage, VEN (V) Short-Circuit Output Current, ISHORT (A) 50 (o Short-Circuit Output Current vs. Input Voltage 1.5 1.4 1.3 1.2 1.1 1.0 2.5 2.0 EN Rising 1.5 EN Falling 1.0 VIN =5V, RLOAD =50Ω, CIN = COUT =33µF/Elctrolytic 0.5 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -50 0 50 100 150 Junction Temperature (oC) Input Voltage (V) Turn-Off Leakage Current vs. Junction Temperature EN pin Threshold Voltage vs. Input Voltage 2.1 4.0 Turn-Off Leakage Current, ILEAK (uΑ) EN pin Threshold Voltage, VEN (V) 0 2.0 1.9 1.8 1.7 1.6 EN Rising 1.5 1.4 1.3 EN Falling 1.2 1.1 RLOAD =50Ω, CIN = COUT =33µF/Elctrolytic, TA=25oC 1.0 0.9 0.8 2.5 3.0 3.5 4.0 4.5 5.0 VIN =5V, RLOAD =0Ω, CIN = COUT =33µF/Elctrolytic 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 5.5 Input Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 3.5 0 50 100 150 o Junction Temperature ( C) 8 www.anpec.com.tw APL3520A/B/C/D Typical Operating Characteristics OCB Deglitch Time vs. Input Voltage OCB Deglitch Time vs. Junction Temperature 15 OCB Deglitch Time , TD(OCB) (ms) OCB Deglitch Time , TD(OCB) (ms) 15 14 13 12 11 10 9 RLOAD =1Ω, CIN = COUT =33µF/Elctrolytic 8 14 13 12 11 10 9 RLOAD =1Ω, CIN = COUT =33µF/Elctrolytic 8 7 7 -50 0 50 100 2.5 150 3.0 UVLO Threshold Voltage vs. Junction Temperature 4.5 5.0 5.5 Output Voltage vs. Output Current 3.2 6 2.8 Output Voltage, VOUT (V) UVLO Threshold Voltage, VVLOC (V) 4.0 Input Voltage (V) Junction Temperature (oC) UVLO Rising 2.4 UVLO Falling 2.0 1.6 VIN Increasing, RLOAD =15mΩ, CIN = COUT =33µF/Elctrolytic 1.2 5 4 3 2 1 0.8 APL3520A, VIN=5V, TA=25℃ 0 -50 0 50 100 150 0.0 0.5 o Junction Temperature ( C) 1.0 1.5 2.0 2.5 3.5 3.0 Output Current (A) Turn-On Rising Time vs. Junction Temperature Output Voltage vs. Output Current 6 Output Voltage, VOUT (V) 350 Turn-On Rising Time, tR (us) 3.5 300 250 200 150 5 4 3 2 100 1 50 VIN = 5V, RLOAD =30Ω, VOUT 10%~90% CIN = 33µF/Elctrolytic, COUT =1µF/X7R 0 0 -50 0 50 100 0.0 150 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Output Current (A) Junction Temperature (oC) Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 APL3520C, VIN=5V, TA=25℃ 9 www.anpec.com.tw APL3520A/B/C/D Operating Waveforms The test condition is VIN=5V, TA= 25oC unless otherwise specified. Turn On Response Turn Off Response VEN 1 VEN1 1 1 VEN2 VEN 2 2 2 VOUT1 VOUT 1 3 3 V OUT2 4 V OUT2 4 V IN =5V, RLOAD =30Ω, CIN =33uF/Electrolytic , COUT =1µF/Electrolytic, CH1: VEN1, 5V/Div, DC CH2: VEN2, 5V/Div, DC CH3: VOUT1, 2V/Div, DC CH4: VOUT2, 2V/Div, DC TIME: 200us/Div UVLO at Rising VIN =5V, RLOAD =30Ω, CIN =33uF/Electrolytic, COUT =1µF/Electrolytic, CH1: VEN1, 5V/Div, DC CH2: VEN2, 5V/Div, DC CH3: VOUT 1, 2V/Div, DC CH4: VOUT 2, 2V/Div, DC TIME: 200us/Div UVLO at Falling VIN VIN 1 1 VOUT1 V OUT1 2 2 VOUT2 V OUT2 3 3 VIN =5V, RLOAD =30Ω, EN1 and EN2 tied to VIN, CIN =33uF/Electrolytic, COUT =1µF/Electrolytic , CH1: VIN, 2V/Div, DC CH2: VOUT 1, 1V/Div, DC CH3: VOUT 2, 1V/Div, DC TIME:5ms/Div VIN =5V, RLOAD =30Ω, EN1 and EN2 tied to VIN, CIN =33uF/Electrolytic, COUT =1µF/Electrolytic , CH1: VIN, 2V/Div, DC CH2: VOUT1, 2V/Div, DC CH3: VOUT2, 2V/Div, DC TIME:5ms/Div Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 10 www.anpec.com.tw APL3520A/B/C/D Operating Waveforms The test condition is VIN=5V, TA= 25oC unless otherwise specified. OCB Response during Short Circuit OCB Response during Over Load VOCBx VOCBx 1 1 VOUTx VOUTx 2 2 I OUTx IOUTx 3 3 VIN =5V, VOUTx switched into ground, CIN =COUT =33uF/Electrolytic CH1: VOCBx , 5V/Div, AC CH2: VOUTx , 2V/Div, DC CH3: IOUTx , 5A/Div, DC TIME: 2ms/Div VIN =5V, RLOAD =1Ω touches VOUTx, CIN =COUT =33uF/Electrolytic CH1: VOCBx , 5V/Div, AC CH2: VOUTx , 2V/Div, DC CH3: IOUTx , 2A/Div, DC TIME: 2ms/Div OCB Response with Ramped Load Load-Transient VOCBx VOUT V IN VOUTx 1 VOUTx I OUTx 2 3 I OUTx 1 I OUT 3 2 VIN =5V, IOUT =0 to 2A, CIN =COUT=33uF/Electrolytic CH1: VIN, 2V/Div, DC CH2: VOUTx , 1V/Div, DC CH3: IOUT , 2A/Div, DC VIN =5V, CIN =COUT=33uF/Electrolytic CH1: VOCBx, 5V/Div, AC CH2: VOUTx , 2V/Div, DC CH3: IOUT , 5A/Div, DC TIME: 2ms/Div TIME: 20µs/Div Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 11 www.anpec.com.tw APL3520A/B/C/D Block Diagram VIN VOUT1 UVLO Charge Pump1 Short-Circuit Protection 1 Current Limit1 Gate Driver and Control Logic1 EN1/ ENB1 OCB1 GND OTP1 VOUT2 Charge Pump2 EN2/ ENB2 Short-Circuit Protection2 Current Limit2 Gate Driver and Control Logic2 OCB2 OTP2 Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 12 www.anpec.com.tw APL3520A/B/C/D Typical Application Circuit 3.3V COUT1 0.1µF 150µF 5V CIN 1µF 50kΩ VIN USB Port1 VBUS VOUT1 D+ APL3520A/B/C/D DOCB1 GND EN1/ENB1 USB Controller COUT2 50kΩ 0.1µF 150µF OCB2 VOUT2 USB Port2 VBUS EN2/ENB2 D+ GND DGND Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 13 www.anpec.com.tw APL3520A/B/C/D Function Description VIN Under-Voltage Lockout (UVLO) than 1µA. The enable input is compatible with both TTL The APL3520 series of power switches have a built-in and CMOS logic levels. The EN1/EN2 or ENB1/ENB2 pin cannot be left floating. under-voltage lockout circuit to keep the output shutting off and discharging through an internal resistor until in- Over-Temperature Protection ternal circuitry is operating properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically When the junction temperature exceeds 140oC, the inter- ignore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage nal thermal sense circuit turns off the power FET and allows the device to cool down. When the device’s junc- starts a soft-start to reduce the inrush current. tion temperature cools by 20 oC, the internal thermal sense circuit will enable the device, resulting in a pulsed Power Switch output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of The power switches are N-channel MOSFETs with low RDS(ON). The internal power MOSFETs do not have the body over temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125oC. diode. When IC is off, the MOSFETs prevent current flowing from the VOUTx back to VIN and VIN to VOUTx. Current-Limit Protection The APL3520 series of power switches provide the current-limit protection function. During current limit, the devices limit output current at current limit threshold. For reliable operation, the device should not be operated in current limit for extended period. Short-Circuit Protection When the output voltage drops below 1.5V, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. The short-circuit current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature reaches over-temperature threshold, the device will enter the thermal shutdown. OCB Output The APL3520 series of power switches provide an opendrain output to indicate that a fault has occurred. When any of current limit or over-temperature protection occurs for a deglitch time of tD(OCB), the OCB1/OCB2 goes low. Since the OCB1/OCB2 pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Disable Pull the ENB1/ENB2 above 2V or EN1/EN2 below 0.8V will disable the device, and pull ENB1/ENB2 pin below 0.8V or EN1/EN2 above 2V will enable the device. When the IC is disabled, the supply current is reduced to less Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 14 www.anpec.com.tw APL3520A/B/C/D Application Information (Cont.) Recommended Minimum Footprint 5.385 0.28 1.537 2.49 1.27 0.305 0.5 0.66 2.49 1.83 Unit: mm Unit: mm SOP-8 MSOP-8P 0.23 0.57 0.24 1.537 1.3 0.305 0.50 0.66 0.8 4.585 Unit: mm Unit: mm MSOP-8 TDFN2X2-8 0.305 0.61 2.146 0.305 0.66 1.575 Unit: mm DFN3X3-8 Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 15 www.anpec.com.tw APL3520A/B/C/D Package Information SOP-8 D E E1 SEE VIEW A h X 45 ° c A 0.25 b GAUGE PLANE SEATING PLANE A1 A2 e L VIEW A S Y M B O L SOP-8 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.75 0.069 0.004 0.25 0.010 A1 0.10 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 0.049 1.27 BSC 0.050 BSC h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 0 0° 8° 0° 8° Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 16 www.anpec.com.tw APL3520A/B/C/D Package Information MSOP-8 D b 0.25 A A1 A2 c L GAUGE PLANE SEATING PLANE 0 e E E1 SEE VIEW A VIEW A S Y M B O L MSOP-8 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.10 0.043 0.00 0.15 0.000 0.006 A2 0.75 0.95 0.030 0.037 b 0.22 0.38 0.009 0.015 c 0.08 0.23 0.003 0.009 A1 D 2.90 3.10 0.114 0.122 E 4.70 5.10 0.185 0.201 E1 2.90 3.10 0.114 e 0.65 BSC 0.122 0.026 BSC L 0.40 0.80 0.016 0.031 0 0° 8° 0° 8° Note: 1. Follow JEDEC MO-187 AA. 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E1”does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side. Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 17 www.anpec.com.tw APL3520A/B/C/D Package Information MSOP-8P D SEE VIEW A E c A 0.25 b GAUGE PLANE SEATING PLANE A1 L 0 A2 e E1 EXPOSED PAD E2 D1 VIEW A S Y M B O L A MSOP-8P INCHES MILLIMETERS MIN. MAX. MIN. MAX. 1.10 0.043 A1 0.00 0.15 0.000 0.006 A2 0.75 0.95 0.030 0.037 b 0.22 0.38 0.009 0.015 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 D1 1.50 2.50 0.059 0.098 E 4.70 5.10 0.185 0.201 E1 2.90 3.10 0.114 0.122 E2 1.50 2.50 0.059 0.098 e 0.65 BSC 0.026 BSC L 0.40 0.80 0.016 0.031 0 0° 8° 0° 8° Note: 1. Follow JEDEC MO-187 AA-T 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not flash or protrusions. 3. Dimension “E1” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 6 mil per side. Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 18 www.anpec.com.tw APL3520A/B/C/D Package Information TDFN2x2-8 A b E D A1 D2 A3 L E2 Pin 1 Cornar e S Y M B O L TDFN2x2-8 MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 A3 0.20 REF 0.008 REF b 0.18 0.30 0.007 0.012 D 1.90 2.10 0.075 0.083 D2 1.00 1.60 0.039 0.063 E 1.90 2.10 0.075 0.083 E2 0.60 1.00 0.024 0.039 e L 0.50 BSC 0.30 0.020 BSC 0.012 0.45 0.018 Note : 1. Followed from JEDEC MO-229 WCCD-3. Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 19 www.anpec.com.tw APL3520A/B/C/D Package Information DFN3x3-8 D b E A Pin 1 A1 D2 A3 L K E2 Pin 1 Corner e S Y M B O L DFN3x3-8 MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 A3 0.20 REF 0.008 REF b 0.25 0.35 0.010 0.014 D 2.90 3.10 0.114 0.122 0.094 D2 1.90 2.40 0.075 E 2.90 3.10 0.114 0.122 E2 1.40 1.75 0.055 0.069 0.50 0.012 e 0.65 BSC L 0.30 K 0.20 Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 0.026 BSC 0.020 0.008 20 www.anpec.com.tw APL3520A/B/C/D Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOP-8 MSOP-8(P) TDFN2x2-8 DFN3x3-8 A H T1 C d D 330.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.40±0.20 5.20±0.20 2.10±0.20 T1 C d D W E1 F 1.5 MIN. 20.2 MIN. 4.0±0.10 8.0±0.10 A H 330.0±2.00 50 MIN. P0 P1 12.4+2.00 13.0+0.50 -0.00 -0.20 P2 D0 1.5+0.10 -0.00 12.0±0.30 1.75±0.10 12.0±0.30 1.75±0.10 F 5.5±0.05 5.5±0.05 T A0 B0 K0 1.5 MIN. 0.6+0.00 -0.40 5.30±0.20 3.30±0.20 1.40±0.20 d D W E1 F 1.5 MIN. 20.2 MIN. 8.0±0.20 1.75±0.10 3.50±0.05 D1 A0 B0 K0 2.35±0.20 2.35±0.20 1.30±0.20 d T 0.6+0.00 -0.4 D W E1 F 12.0±0.30 1.75±0.10 8.00±0.10 2.00±0.05 A H 178.0±2.00 50 MIN. P0 P1 T1 8.4+2.00 -0.00 P2 4.0±0.10 4.0±0.10 2.0±0.05 A H T1 C 13.0+0.50 -0.20 D0 1.5+0.10 -0.00 C 178.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. P0 P1 P2 D0 D1 T 4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 21 E1 D1 4.00±0.10 Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 W 1.5 MIN. 0.6+0.00 -0.40 5.5±0.05 A0 B0 K0 3.30±0.20 3.30±0.20 1.30±0.20 (mm) www.anpec.com.tw APL3520A/B/C/D Devices Per Unit Package Type Unit Quantity SOP-8 Tape & Reel 2500 MSOP-8(P) Tape & Reel 3000 TDFN2x2-8 Tape & Reel 3000 DFN3x3-8 Tape & Reel 3000 Taping Direction Information SOP-8 USER DIRECTION OF FEED MSOP-8(P) USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 22 www.anpec.com.tw APL3520A/B/C/D Taping Direction Information (Cont.) TDFN2x2-8 USER DIRECTION OF FEED DFN3x3-8 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 23 www.anpec.com.tw APL3520A/B/C/D Classification Profile Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 24 www.anpec.com.tw APL3520A/B/C/D Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 25 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA www.anpec.com.tw APL3520A/B/C/D Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 26 www.anpec.com.tw