ONSEMI MC14017BDG

MC14017B
Decade Counter
The MC14017B is a five−stage Johnson decade counter with
built−in code converter. High speed operation and spike−free outputs
are obtained by use of a Johnson decade counter design. The ten
decoded outputs are normally low, and go high only at their
appropriate decimal time period. The output changes occur on the
positive−going edge of the clock pulse. This part can be used in
frequency division applications as well as decade counter or decimal
decode display applications.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
•
Fully Static Operation
DC Clock Input Circuit Allows Slow Rise Times
Carry Out Output for Cascading
Divide−by−N Counting
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load Over the Rated Temperature Range
Pin−for−Pin Replacement for CD4017B
Triple Diode Protection on All Inputs
These Devices are Pb−Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
VDD
Parameter
Unit
16
MC14017BCP
AWLYYWWG
1
16
SOIC−16
D SUFFIX
CASE 751B
14017BG
AWLYWW
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
−0.5 to +18.0
V
ORDERING INFORMATION
−0.5 to VDD + 0.5
V
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation, per Package
(Note 1)
500
mW
Vin, Vout
Iin, Iout
DC Supply Voltage Range
Value
PDIP−16
P SUFFIX
CASE 648
Input or Output Voltage Range
(DC or Transient)
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 8
1
Publication Order Number:
MC14017B/D
MC14017B
PIN ASSIGNMENT
Q5
1
16
VDD
Q1
2
15
RESET
Q0
3
14
CLOCK
Q2
4
13
CE
Q6
5
12
Cout
Q7
6
11
Q9
Q3
7
10
Q4
VSS
8
9
Q8
FUNCTIONAL TRUTH TABLE
(Positive Logic)
Clock
Clock
Enable
0
X
X
X
1
X
0
X
X
1
BLOCK DIAGRAM
Reset
Decode
Output=n
0
0
1
0
0
0
0
n
n
Q0
n+1
n
n
n+1
CLOCK 14
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Cout
CLOCK
13
ENABLE
X = Don’t Care. If n < 5 Carry = “1”,
Otherwise = “0”.
RESET 15
3
2
4
7
10
1
5
6
9
11
12
VDD = PIN 16
VSS = PIN 8
LOGIC DIAGRAM
Q5
Q1
1
2
C Q
C
D Q
R R
C Q
C
D Q
R R
Q7
6
Q3
7
Q9
11
14
CLOCK
CLOCK
ENABLE
RESET
12
13
15
3
C Q
C
D Q
R R
5
Q0
4
Q6
Q2
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2
C Q
C
D Q
R R
C Q
C
D Q
R R
9
10
Q3
Q4
CARRY
MC14017B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
− 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
mAdc
IT
5.0
10
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
Total Supply Current (Notes 3 & 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IOH
Vdc
Vdc
mAdc
IT = (0.27 mA/kHz) f + IDD
IT = (0.55 mA/kHz) f + IDD
IT = (0.83 mA/kHz) f + IDD
mAdc
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.0011.
ORDERING INFORMATION
Package
Shipping†
MC14017BCPG
PDIP−16
(Pb−Free)
500 Units / Rail
MC14017BDG
SOIC−16
48 Units / Rail
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
Device
NLV14017BDG*
MC14017BDR2G
NLV14017BDR2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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3
MC14017B
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SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Reset to Decode Output
tPLH, tPHL = (1.7 ns/pF) CL + 415 ns
tPLH, tPHL = (0.66 ns/PF) CL + 197 ns
tPLH, tPHL = (0.5 ns/pF) CL + 150 ns
tPLH,
tPHL
Propagation Delay Time
Clock to Cout
tPLH, tPHL = (1.7 ns/pF) CL + 315 ns
tPLH, tPHL = (0.66 ns/pF) CL + 142 ns
tPLH, tPHL = (0.5 ns/pF) CL + 100 ns
tPLH,
tPHL
Propagation Delay Time
Clock to Decode Output
tPLH, tPHL = (1.7 ns/pF) CL + 415 ns
tPLH, tPHL = (0.66 ns/pF) CL + 197 ns
tPLH, tPHL = (0.5 ns/pF) CL + 150 ns
tPLH,
tPHL
Turn−Off Delay Time
Reset to Cout
tPLH = (1.7 ns/pF) CL + 315 ns
tPLH = (0.66 ns/pF) CL + 142 ns
tPLH = (0.5 ns/pF) CL + 100 ns
tPLH
Clock Pulse Width
VDD
Vdc
Min
Typ
(Note 6)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
—
—
—
500
230
175
1000
460
350
ns
5.0
10
15
—
—
—
400
175
125
800
350
250
ns
5.0
10
15
—
—
—
500
230
175
1000
460
350
ns
5.0
10
15
—
—
—
400
175
125
800
350
250
tw(H)
5.0
10
15
250
100
75
125
50
35
—
—
—
ns
fcl
5.0
10
15
—
—
—
5.0
12
16
2.0
5.0
6.7
MHz
Reset Pulse Width
tw(H)
5.0
10
15
500
250
190
250
125
95
—
—
—
ns
Reset Removal Time
trem
5.0
10
15
750
275
210
375
135
105
—
—
—
ns
Clock Input Rise and Fall Time
tTLH,
tTHL
5.0
10
15
Clock Enable Setup Time
tsu
5.0
10
15
350
150
115
175
75
52
—
—
—
ns
Clock Enable Removal Time
trem
5.0
10
15
420
200
140
260
100
70
—
—
—
ns
Clock Frequency
—
No Limit
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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4
MC14017B
VDD
VSS
VDD
VSS
A
B
S1
S1
Output
Sink Drive
Output
Source Drive
Decode
Outputs
(S1 to A)
Clock to
desired
outputs
(S1 to B)
Carry
Clock to 5
thru 9
(S1 to B)
S1 to A
VGS =
VDD
− VDD
VDS =
Vout
Vout − VDD
Vout
CLOCK Q0
ENABLE
Q1
Q2
Q3
Q4
RESET Q5
Q6
Q7
Q8
Q9
CLOCK Cout
ID
EXTERNAL
POWER
SUPPLY
VSS
Figure 1. Typical Output Source and Output Sink Characteristics Test Circuit
VDD
500 mF
0.01 mF
CERAMIC
ID
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Cout
CLOCK
ENABLE
RESET
PULSE
GENERATOR
fc
CLOCK
VSS
CL
CL
CL
CL
CL
Figure 2. Typical Power Dissipation Test Circuit
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5
CL
CL
CL
CL
CL
CL
MC14017B
APPLICATIONS INFORMATION
Figure 3 shows a technique for extending the number of decoded output states for the MC14017B. Decoded outputs are
sequential within each stage and from stage to stage, with no dead time (except propagation delay).
RESET
CLOCK
CE MC14017B
RESET
CLOCK
CE MC14017B
Q0 Q1 • • • Q8 Q9
Q0Q1 • • • Q8 Q9
9 DECODED
OUTPUTS
RESET
CLOCK
CE MC14017B
Q1 • • • Q8 Q9
8 DECODED
OUTPUTS
8 DECODED
OUTPUTS
CLOCK
FIRST STAGE
INTERMEDIATE STAGES
LAST STAGE
Figure 3. Counter Expansion
Pcp
Ncp
90%
CLOCK
50%
trem
CLOCK
ENABLE
trem
RESET
20 ns
Q0
Q2
Q3
Q4
20 ns
20 ns
VDD
20 ns
20 ns
20 ns
tPLH
tPHL
tTLH
tPHL
90%
10%
tPLH
VDD
VSS
tPLH
tPHL
tPLH
tTHL
tTLH
tPHL
tTLH
VOH
VOL
tTHL
VOH
50%
tPLH
tPHL
tTLH
tPHL
tPLH
tPLH
tTHL
VOL
tTHL
VOH
VOL
tTHL
tTLH
tPHL
tTLH
tPHL
90%
10%
tTHL
VOH
VOL
Q7
tTHL
Q8
VOH
VOL
tPLH
tTLH
tTHL
tPLH
tPHL
Q9
Cout
VOH
VOL
VOH
VOL
tTHL
tPHL
tPLH
VOH
VOL
VOH
VOL
50%
Q5
Q6
VDD
VSS
VSS
tPLH
Q1
tsu
10%
tTLH
tPHL
tPLH
tTHL
tPHL
tTLH
Figure 4. AC Measurement Definition and Functional Waveforms
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6
tTHL
VOH
VOL
VOH
VOL
MC14017B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
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7
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14017B
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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MC14017B/D