MA-COM AN-010

AN-010
Reflow Soldering Guidelines for RoHS* Compliant
E-Series Surface Mount Components
Introduction
This application note describes recommended practices and guidelines for the successful
assembly of M/A-COM Technology Solutions ESeries surface mount components using automated
solder reflow techniques. Incorrect handling, storage, reflow and cleaning may damage the components.
Handling and Storage Precautions
Most E-series components are static sensitive and
are packaged accordingly. Appropriate handling precautions should be observed. The typical shelf life of
these components is 24 months. However, corrosive, salty or high humidity atmospheres can have
an adverse affect on the solderability of
contact pads/pins. Manual handling of the
components is not recommended.
Rev. B
Solder Pad Layout
Each E-series surface mount data sheet
recommends a solder pad layout based on IPC
standards. Deviation from these recommended
layouts can adversely effect the solder joint strength
and integrity.
Component Construction
All M/A-COM Technology Solutions E-series components are designed to withstand solder reflow conditions, as recommended in this application note. The
table below details the construction of our most popular surface mount components.
Component Construction
Substrate
Type
Plating Construction
Cover Material (where applicable)
Ceramic
Leadless
Electroless Nickel Immersion Gold
(ENIG)
High temperature polymer mould
High temperature 6/6 nylon disk
DAP
SOT
Sn over Copper
FR-4
Leadless
ENIG
High temperature polymer mould
High temperature 6/6 nylon disk
Galvanised steel
Solder Paste
Component Placement
M/A-COM Technology Solutions E-series components are designed to work with most recommended reflow profiles for the SAC305/SAC405
type solders, and are fully compatible with the standard reflow profiles used for the SN60, SN62 and
SN63 solder pastes, including no-clean pastes.
For most case styles, a paste thickness of 0.25mm
± 0.05mm will provide an adequate
solder joint. For the SM-22 case style, a solder
paste thickness of 0.20mm ± 0.025mm is
recommended.
E-Series components are designed for placement
using automatic Pick and Place equipment.
Component placement is critical to negate shorts
caused by solder bridging. Most E-series
components can accept a side overhang of up to 50%
of the pad width, and a toe overhang of up to 10% of
pad length.
For the SM-22 case style, side overhang must be less
than 25%, and toe overhang less than 5%.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
AN-010
Reflow Soldering Guidelines for RoHS* Compliant
E-Series Surface Mount Components
Rev. B
General Soldering Precautions: Lead-Free Soldering Process
Relation of qualification profile and actual
production profile
Process Requirements
The ovens used should be 100% convection reflow.
Where applicable, thermocouples should be securely
attached to the top surface of a representative component to insure the temperature exposure.
This can be done three times.
The profiles listed in this document are not
production reflow profiles, but are related to those
profiles with an added margin of safety to account
for oven variation, temperature drift, and product
variation and process robustness.
The actual profile used in production will be dictated
primarily by the solder composition selected.
We recommended 90 seconds above 217°C with a
maximum temperature of 260°C.
The 60 seconds at temperatures >250°C is the maximum duration these package types should be exposed to.
Pb-FREE REFLOW PROFILE ENVELOPE
EXTREME PROFILE ENVELOPE
MINIMUM REFLOW ENVELOPE
TEMPERATURE (°C)
PEAK TEMPERATURE > OR = 255°C
TIME ABOVE
217°C > 90sec
TIME ABOVE 150°C > 240sec
TIME ABOVE 100°C < 360sec
TIME FROM 25°C TO PEAK = 360sec
TIME (sec)
2
Condition
Exposure
Average ramp-up rate (30°C to 217°C)
> 100°C
> 150°C
> 217°C
Peak Temperature
Cool-down rate (Peak to 50°C)
Time from 30°C to 255°C
All temperatures shown are +5/-0°C
less than 3°C / second
between 360-600 seconds
at least 240 seconds
at least 90 seconds
greater or equal to 255°C at least 15 seconds
less than 6°C / second
no greater than 360 seconds
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588