TSC ESH1B_13

ESH1B - ESH1D
CREAT BY ART
1.0AMP Surface Mount Ultra Fast Rectifiers
SMA/DO-214AC
Features
—
Glass passivated junction chip
—
For surface mounted application
—
Low profile package
—
Built-in strain rellef
—
Ideal for automated placement
—
Easy pick and place
—
Ultra fast recovery time for high efficiency
—
High temperature soldering:
260℃/10 seconds at terminals
—
Meet MSL level 1, per J-STD-020D
lead free, maximum peak of 260℃
—
Plastic material used carries Underwriters
Laboratory Classification 94V-0
—
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
—
—
Case: Molded plastic
Terminals: Pure tin plated, lead free
—
Polarity: Indicated by cathode band
—
Packing: 12mm tape per EIA STD RS-481
—
Weight: 0.064 grams
Ordering Information (example)
Part No.
Package
Packing
Packing
code
Packing code
(Green)
ESH1B
SMA
1.8K / 7" REEL
R3
R3G
Maximum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol
ESH1B
ESH1C
ESH1D
Unit
Maximum Repetitive Peak Reverse Voltage
VRRM
100
150
200
V
Maximum RMS Voltage
VRMS
70
105
140
V
Maximum DC Blocking Voltage
VDC
100
150
200
V
Maximum Average Forward Rectified Current
IF(AV)
1.0
A
Peak Forward Surge Current, 8.3 ms Single Half Sine-wave
Superimposed on Rated Load
IFSM
30
A
VF
0.95
V
Maximum Instantaneous Forward Voltage (Note 1)
@ 1.0A
Maximum Reverse Current @ Rated VR
TA=25 ℃
TA=125 ℃
IR
1
uA
25
Maximum Reverse Recovery Time (Note 2)
Trr
15
nS
Typical Junction Capacitance (Note 3)
Cj
16
pF
RθjA
RθjL
85
35
TJ
- 55 to + 175
O
C
- 55 to + 175
O
C
Typical Thermal Resistance
Operating Temperature Range
Storage Temperature Range
TSTG
O
C/W
Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Version:B13
RATINGS AND CHARACTERISTIC CURVES (ESH1B THRU ESH1D)
FIG.1 FORWARD CURRENT DERATING CURVE
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
100
1
0.8
0.6
0.4
RESISTER OR
INDUCTIVE LOAD
0.2
0
75
85
95
105
115
125
135
145
155
165
175
LEAD TEMPERATURE (oC)
30
1
TA=25℃
Pulse Width=300us
1% Duty Cycle
0.1
25
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
FORWARD VOLTAGE (V)
20
15
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
10
1000
5
TA=25℃
0
1
10
NUMBER OF CYCLES AT 60 Hz
100
FIG. 5 TYPICAL JUNCTION CAPACITANCE
100
CAPACITANCE (pF)
10
8.3mS Single Half Sine Wave
JEDEC Method
10
INSTANTANEOUS REVERSE CURRENT (uA)
PEAK FORWARD SURGE CURRENT
(A)
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
INSTANTANEOUS FORWARD CURRENT (A)
AVERAGE FORWARD CURRENT
(A)
1.2
TA=125℃
100
TA=75℃
10
1
TA=25℃
0.1
TA=25℃
0
1
0.1
1
10
REVERSE VOLTAGE (V)
100
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Version:B13
Ordering information
Part No.
ESH1x
(Note)
Package
Packing
SMA
1.8K / 7" REEL
SMA
7.5K / 13" REEL
SMA
7.5K / 13" Plastic REEL
Folded SMA
1.8K / 7" REEL
Folded SMA
7.5K / 13" REEL
Folded SMA 7.5K / 13" Plastic REEL
C SMA
1.8K / 7" REEL
C SMA
7.5K / 13" REEL
Packing
code
Packing code
(Green)
R3
R2
M2
F3
F2
F4
E3
E2
R3G
R2G
M2G
F3G
F2G
F4G
E3G
E2G
Note: "x" is Device Code from "B" thru "D".
Tape & Reel specification
Reel Size Tape Size
7"
12mm
Reel Size Tape Size
13"
12mm
A
±2.0
178
A
max
330
B
±0.4
1.9
B
±0.5
2
C
+0.5;-0.2
13
C
±0.5
13
D
min
21
D
min
20.2
N
±1.0
62
N
±0.5
75
G
+0.8;-0
12.2
G
+2.0;-0
12.4
T
max
14.6
T
max
18.4
Unit (mm)
Suggested PAD Layout
Symbol
A
B
C
D
E
Unit(mm)
1.78
1.51
3.92
2.41
4.43
Package Outline Dimensions
DIM.
Marking Diagram
P/N =
Specific Device Code
G=
Green Compound
YW =
Date Code
Unit(mm)
Unit(inch)
Min
Max
Min
Max
A
1.27
1.58
0.050
0.062
B
2.29
2.83
0.090
0.111
C
4.06
4.60
0.160
0.181
D
1.99
2.50
0.078
0.098
E
0.90
1.41
0.035
0.056
F
0.15
0.31
0.006
0.012
G
0.10
0.20
0.004
0.008
H
4.95
5.33
0.195
0.210