HS3AB SERIES_I13

HS3AB - HS3MB
creat by ART
3.0AMPS High Efficient Surface Mount Rectifiers
SMB/DO-214AA
Features
—
Glass passivated junction chip.
—
For surface mounted application
—
Low forward voltage drop
—
Low profile package
—
Built-in stain relief, ideal for automatic
placement
—
Fast switching for high efficiency
—
High temperature soldering:
260℃/10 seconds at terminals
—
Meet MSL level 1, per J-STD-020D,
lead free maximum peak of 260℃
—
Plastic material used carries Underwriters
Laboratory Classification 94V-0
—
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
—
—
Case: Molded plastic
Terminal: Pure tin plated, lead free
—
Polarity: Indicated by cathode band
—
Packing: 12mm tape per EIA STD RS-481
—
Weight: 0.093 grams
Ordering Information (example)
Part No.
Package
Packing
HS3AB
SMB
850 / 7" REEL
Packing code
Packing code
(Green)
R5
R5G
Maximum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Maximum Repetitive Peak Reverse Voltage
VRRM
HS
3AB
50
Maximum RMS Voltage
VRMS
35
70
140
210
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
300
400
600
800
1000
V
Maximum Average Forward Rectified Current
IF(AV)
3
A
Peak Forward Surge Current, 8.3 ms Single Half Sine-wave
Superimposed on Rated Load (JEDEC method)
IFSM
100
A
Parameter
Symbol
Maximum Instantaneous Forward Voltage (Note 1)
@3A
Maximum Reverse Current @ Rated VR
TA=25 ℃
TA=125 ℃
VF
HS
3BB
100
HS
3DB
200
HS
3FB
300
HS
3GB
400
HS
3JB
600
HS
3KB
800
HS
3MB
1000
1.0
1.3
uA
250
50
75
Typical Junction Capacitance (Note 3)
Cj
80
50
Storage Temperature Range
V
10
IR
Trr
Operating Temperature Range
V
1.7
Maximum Reverse Recovery Time (Note 2)
Typical Thermal Resistance
Unit
nS
pF
O
RθjA
60
TJ
- 55 to + 150
O
C
- 55 to + 150
O
C
TSTG
C/W
Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Version:I13
RATINGS AND CHARACTERISTIC CURVES (HS3AB THRU HS3MB)
FIG.1 FORWARD CURRENT DERATING CURVE
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
3.5
1000
3
2
1.5
1
RESISTIVE OR
INDUCTIVE LOAD
0.5
0
0
25
50
75
100
125
150
175
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
300
250
8.3mS Single Half Sine Wave
JEDEC Method
10
TA=25℃
1
0.1
200
0
20
TA=25℃
150
60
80
100
120
140
FIG. 5 TYPICAL FORWARD CHARACTERISTICS
100
50
TA=25℃
0
10
100
1000
NUMBER OF CYCLES AT 60 Hz
FIG. 4 TYPICAL JUNCTION CAPACITANCE
175
40
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
100
1
150
TA=25℃
125
CAPACITANCE (pF)
TA=125℃
100
100
HS3AB-HS3GB
75
50
INSTANTANEOUS FORWARD CURRENT (A)
PEAK FORWARD SURGE URRENT
(A)
LEAD TEMPERATURE (oC)
INSTANTANEOUS REVERSE CURRENT (uA)
AVERAGE FORWARD
CURRENT (A)
2.5
10
HS3AB-HS3DB
HS3GB
1
HS3JB-HS3MB
HS3JB-HS3MB
25
0.1
0
0.1
1
10
REVERSE VOLTAGE (V)
100
1000
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
FORWARD VOLTAGE (V)
Version:I13
Ordering information
Part No.
HS3XB
(Note)
Packing code
Packing code
(Green)
850 / 7" REEL
R5
R5G
3K / 13" REEL
R4
R4G
M4
M4G
Package
Packing
SMB
SMB
3K / 13" Plastic REEL
SMB
Note: "x" is Device Code from "A" thru "B".
Tape & Reel specification
Reel Size Tape Size
7"
12mm
Reel Size Tape Size
13"
12mm
A
±2.0
178
A
max
330
B
±0.4
1.9
B
±0.5
2
C
+0.5;-0.2
13
C
±0.5
13
D
min
21
D
min
20.2
N
±1.0
62
N
±0.5
75
G
+0.8;-0
12.2
G
+2.0;-0
12.4
T
max
14.6
T
max
18.4
Unit (mm)
Suggested PAD Layout
Symbol
A
B
C
D
E
Unit(mm)
2.3
2.5
4.3
1.8
6.7
Version:I13
Dimensions
DIM.
Unit(mm)
Unit(inch)
Min
Max
Min
Max
A
1.95
2.10
0.077
0.083
B
3.48
3.73
0.137
0.147
C
4.25
4.75
0.167
0.187
D
1.99
2.61
0.078
0.103
E
0.90
1.41
0.035
0.056
F
5.10
5.30
0.201
0.209
G
0.10
0.20
0.004
0.008
H
I
0.15
0.15
0.31
0.31
0.006
0.006
0.012
0.012
Marking Diagram
P/N
= Specific Device Code
G
= Green Compound
YW
= Date Code
F=
Factory Code
Version:I13