MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Rev V6 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling RoHS Compliant Description This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. 1. Backside metal: 0.1 µM thick. 2. Yellow hatched areas indicate backside ohmic gold INCHES MM DIM Min. Max. Min. Max. A 0.046 0.051 1.170 1.290 B 0.017 0.021 0.432 0.533 C 0.004 0.006 0.102 0.203 D 0.015 0.017 0.381 0.432 E 0.014 0.016 0.356 0.406 Applications These surmount devices are suitable for usage in moderate incident power (5W C.W.) or higher incident peak power (50W) series, shunt, or series-shunt switches. Lower parasitic inductance, 0.45nH, and excellent RC constant (0.23pS), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts. ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Absolute Maximum Ratings @ TAMB = 25°C (unless otherwise specified) Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated Power ( RF & DC ) Mounting Temperature Absolute Maximum 250mA -100V -55°C to +125°C -55 °C to +150°C +175°C 1W +280°C for 30 seconds • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Rev V6 Electrical Specifications @ TAMB = +25°C Symbol Conditions Units CT1,3 -40V, 1MHz CT1,3 Min. Typical Max. pF 0.055 0.06 -40V, 1GHz pF 0.045 RS2,3 10mA, 1GHz Ω 5.0 5.8 VF 10mA V 0.90 1.00 VR -10μA V IR -70V μA -0.1 RØJL4 IH=1A, IL=10mA °C/W 150 TL +10mA / -6mA ( 50% - 90% V ) nS 200 -70 -100 -10 400 1. Total Capacitance, CT, is equivalent to the sum of Junction Capacitance and Parasitic Capacitance. CT = CJ (Junction Capacitance) + CPAR (Parasitic Capacitance) 2. Series resistance RS is equivalent to the total diode resistance: RS = RJ (Junction Capacitance Junction Resistance) + RO (Ohmic Resistance) 3 RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package with conductive silver epoxy. 4. Steady-state RØJL measured with die mounted in an ODS-186 package with conductive silver epoxy. ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Rev V6 MA4SPS402 Typical RF Performance @ TAMB +25°C Rs as a Function of Forward Current and Frequency 20 500uA 15 1m A 10 2m A 5 10m A 50m A 0 0 100 200 300 400 500 600 700 800 900 1000 F re q u e n c y (M H z ) MA4SPS402 Rs vs I at 100 MHZ and 1,000 MHz 1000.0 100 MHz Rs_100 MHz Rs_1,000 MHz 100.0 Rs ( Ohms ) 1 GHz 10.0 1.0 0.1 0.01 0.10 1.00 10.00 100.00 I ( mA ) ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Rev V6 MA4SPS402 Typical RF Performance @ TAMB +25°C CT as a Function of Reverse Voltage and Frequency 0 .0 7 0 0V 0 .0 6 0 -5 V 0 .0 5 0 -4 0 V 0 .0 4 0 0 .0 3 0 0 .0 2 0 0 .0 1 0 0 .0 0 0 0 100 200 300 400 500 600 700 800 900 1000 F re q u e n c y (M H z ) MA4SPS402 Ct vs V at 100 MHz and 1,000 MHz 0.060 0.056 Ct ( pF ) 0.052 Ct @ 100 MHz 0.048 0.044 Ct @ 1000 MHz 0.040 0.00 10.00 20.00 30.00 40.00 Reverse Voltage ( V ) ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Rev V6 RP as a Function of Reverse Voltage and Frequency MA4SPS402 Rp vs V at 100 MHz and 1,000 MHz 1.E+06 Rp ( Ohms ) Rp @ 100 MHz Rp @ 1000 MHz 1.E+05 1.E+04 0.00 10.00 20.00 30.00 40.00 Reverse Voltage ( V ) ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Rev V6 MA4SPS402 ADS SPICE Model & Schematic MA4SPS402 SPICE Model PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=6.5 um Rr=20 K Ohm Cmin=0.045 Tau=0.20 usec Rs=0.1 Ohm Cj0=0.06 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=1.0E+6 A/m^2 Kf=0.0 Af=1.0 MA4SPS402 Schematic wBv=100 V wPmax=1.0 W Ffe=1.0 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Rev V6 Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Die Attach Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn, 60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but could result in an increase in series and thermal resistance. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce thermal and/or mechanical stresses. It is also not recommended to reflow solder by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attach is completed. Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in Application Note M538 , “Surface Mounting Instructions“. Ordering Information MA4SPS402 SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/A-COM website at www.macomtech.com. Part Number Tape and Reel Waffle Pack Gel Pack MA4SPS402 MADP-000402-12530G ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Pocket Tape MADP-000402-12530P • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.