Wound Chip Baluns ATB Series Type: ATB3225-75011CT (3.22.52.3mm) ATB3225-75032CT (3.22.52.3mm) ATB3225-75034CT (3.22.52.3mm) Issue date: June 2012 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (1/6) Wound Chip Baluns Conformity to RoHS Directive ATB Series ATB3225-75011CT PRODUCT IDENTIFICATION FEATURES • Case size of ATB3225 is L3.2 W2.5 H2.3mm. • This case size is smaller than traditional Balun. • Frequency band width is 5 to 200MHz. • Low insertion loss and good balance parameter. • It is a product conforming to RoHS directive. ATB (1) 11 CT (4) (5) (1) Series name (2) Case size (3) Impedance[at 100MHz] 750: 75 (4) Impedance ratio 11 → 1:1 (5) Type CT: Center tap APPLICATIONS Cable modems SHAPES AND DIMENSIONS 3.2±0.2 3 3225 - 750 (2) (3) 4 6 RECOMMENDED SOLDERING CONDITIONS RECOMMENDED TEMPERATURE PROFILE FOR LEAD-FREE SOLDER 2.3 6 2 5 3 4 0.18 0.45 0.4 Peak 245˚C max. 0.45 1 –25 to +85°C –25 to +85°C 0.9 1 Operating Storage(After mount) (0.9) 5 1.8 2 2.3±0.1 2.5±0.2 TEMPERATURE RANGES Mark for direction Natural cooling 230˚C 180˚C 150˚C 60 to 120s 10 to 30s Time (s) Dimensions in mm REFLOW PROFILE FOR SOLDER HEAT RESISTANCE RECOMMENDED PC BORARD PATTERN 1.0 Peak 260˚C max. 2.0 Natural cooling 0.55 230˚C 2.25 180˚C 0.3 150˚C 60 to 120s 4.0 Dimensions in mm 40s max. Time (s) CIRCUIT DIAGRAM Unbalance port 1 Balance port 3 5 2 6 GND or Vcc 4 • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • All specifications are subject to change without notice. 001-02 / 20120628 / e751_woundbalun_atb3225 (2/6) ELECTRICAL CHARACTERISTICS Part No. ATB3225-75011CT DC resistance ( )max. 0.7 Impedance ratio 1:1 (75 :75 ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Amplitude unbalance (dB)max. Phase unbalance (deg.) 10 0.5 180±5 0 0 50 100 150 Frequency (MHz) 0 50 100 150 Frequency (MHz) 5 10 15 20 25 200 0 50 100 150 Frequency (MHz) 200 PHASE UNBALANCE Phase unbalance (dB) Amplitude unbalance (dB) Return loss (dB)min. RETURN LOSS AMPLITUDE UNBALANCE 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Insertion loss (dB) typ. max. 0.8 1.5 Return loss (dB) Insertion loss (dB) FREQUENCY CHARACTERISTICS INSERTION LOSS Frequency range (MHz) 5 to 200 200 190 188 186 184 182 180 178 176 174 172 170 0 50 100 150 Frequency (MHz) 200 • All specifications are subject to change without notice. 001-02 / 20120628 / e751_woundbalun_atb3225 (3/6) Wound Chip Baluns Conformity to RoHS Directive ATB Series ATB3225-75032CT PRODUCT IDENTIFICATION FEATURES • Case size of ATB3225 is L3.2 W2.5 H2.3mm. • This case size is smaller than traditional Balun. • Frequency band width is 5 to 100MHz. • Low insertion loss and good balance parameter. • It is a product conforming to RoHS directive. ATB (1) 32 CT (4) (5) (1) Series name (2) Case size (3) Impedance[at 100MHz] 750: 75 (4) Impedance ratio 32 → 3:2 (5) Type CT: Center tap APPLICATIONS Cable modems SHAPES AND DIMENSIONS 3.2±0.2 3 3225 - 750 (2) (3) 4 6 RECOMMENDED SOLDERING CONDITIONS RECOMMENDED TEMPERATURE PROFILE FOR LEAD-FREE SOLDER 2.3 6 2 5 3 4 0.18 0.45 0.4 Peak 245˚C max. 0.45 1 –25 to +85°C –25 to +85°C 0.9 1 Operating Storage(After mount) (0.9) 5 1.8 2 2.3±0.1 2.5±0.2 TEMPERATURE RANGES Mark for direction Natural cooling 230˚C 180˚C 150˚C 60 to 120s 10 to 30s Time (s) Dimensions in mm REFLOW PROFILE FOR SOLDER HEAT RESISTANCE RECOMMENDED PC BORARD PATTERN 1.0 Peak 260˚C max. 2.0 Natural cooling 0.55 230˚C 2.25 180˚C 0.3 150˚C 60 to 120s 4.0 Dimensions in mm 40s max. Time (s) CIRCUIT DIAGRAM Unbalance port 1 Balance port 3 5 2 6 GND or Vcc 4 • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • All specifications are subject to change without notice. 001-02 / 20120628 / e751_woundbalun_atb3225 (4/6) ELECTRICAL CHARACTERISTICS Part No. ATB3225-75032CT DC resistance ( )max. 0.7 Impedance ratio 3:2 (75 :50 ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Amplitude unbalance (dB)max. Phase unbalance (deg.) 5 1 180±10 RETURN LOSS 5 10 15 20 25 0 30 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) 0 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) 0 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) PHASE UNBALANCE Phase unbalance (dB) Amplitude unbalance (dB) Return loss (dB)min. 0 AMPLITUDE UNBALANCE 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Insertion loss (dB) typ. max. 0.8 2 Return loss (dB) Insertion loss (dB) FREQUENCY CHARACTERISTICS INSERTION LOSS Frequency range (MHz) 5 to 100 190 188 186 184 182 180 178 176 174 172 170 0 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) • All specifications are subject to change without notice. 001-02 / 20120628 / e751_woundbalun_atb3225 (5/6) Wound Chip Baluns Conformity to RoHS Directive ATB Series ATB3225-75034CT PRODUCT IDENTIFICATION FEATURES • Case size of ATB3225 is L3.2 W2.5 H2.3mm. • This case size is smaller than traditional Balun. • Frequency band width is 1 to 100MHz. • Low insertion loss and good balance parameter. • It is a product conforming to RoHS directive. ATB (1) 34 CT (4) (5) (1) Series name (2) Case size (3) Impedance[at 100MHz] 750: 75 (4) Impedance ratio 34 → 3:4 (5) Type CT: Center tap APPLICATIONS Cable modems SHAPES AND DIMENSIONS 3.2±0.2 3 3225 - 750 (2) (3) 4 6 RECOMMENDED SOLDERING CONDITIONS RECOMMENDED TEMPERATURE PROFILE FOR LEAD-FREE SOLDER 2.3 6 2 5 3 4 0.18 0.45 0.4 Peak 245˚C max. 0.45 1 –25 to +85°C –25 to +85°C 0.9 1 Operating Storage(After mount) (0.9) 5 1.8 2 2.3±0.1 2.5±0.2 TEMPERATURE RANGES Mark for direction Natural cooling 230˚C 180˚C 150˚C 60 to 120s 10 to 30s Time (s) Dimensions in mm REFLOW PROFILE FOR SOLDER HEAT RESISTANCE RECOMMENDED PC BORARD PATTERN 1.0 Peak 260˚C max. 2.0 Natural cooling 0.55 230˚C 2.25 180˚C 0.3 150˚C 60 to 120s 4.0 Dimensions in mm 40s max. Time (s) CIRCUIT DIAGRAM Unbalance port 1 Balance port 3 5 2 6 GND or Vcc 4 • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • All specifications are subject to change without notice. 001-02 / 20120628 / e751_woundbalun_atb3225 (6/6) ELECTRICAL CHARACTERISTICS Part No. ATB3225-75034CT DC resistance ( )max. 0.7 Impedance ratio 3:4 (75 :100 ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Amplitude unbalance (dB)max. Phase unbalance (deg.) 5 1 180±10 RETURN LOSS 5 10 15 20 25 0 30 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) 0 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) 0 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) PHASE UNBALANCE Phase unbalance (dB) Amplitude unbalance (dB) Return loss (dB)min. 0 AMPLITUDE UNBALANCE 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Insertion loss (dB) typ. max. 0.5 2 Return loss (dB) Insertion loss (dB) FREQUENCY CHARACTERISTICS INSERTION LOSS Frequency range (MHz) 1 to 100 185 184 183 182 181 180 179 178 177 176 175 0 10 20 30 40 50 60 70 80 90 100 Frequency (MHz) • All specifications are subject to change without notice. 001-02 / 20120628 / e751_woundbalun_atb3225