NSC LM4995

LM4995 1.3 W Audio Power Amplifier
General Description
Key Specifications
The LM4995 is an audio power amplifier primarily designed
for demanding applications in mobile phones and other
portable communication device applications. It is capable of
delivering 1.2W of continuous average power to an 8Ω BTL
load with less than 1% distortion (THD+N) from a 5VDC power
supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4995 does not require output
coupling capacitors or bootstrap capacitors, and therefore is
ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement.
The LM4995 features a low-power consumption shutdown
mode, which is achieved by driving the shutdown pin with
logic low. Additionally, the LM4995 features an internal thermal shutdown protection mechanism.
The LM4995 contains advanced pop & click circuitry which
eliminates noise which would otherwise occur during turn-on
and turn-off transitions.
The LM4995 is unity-gain stable and can be configured by
external gain-setting resistors.
■ PSRR at 3.6V (217Hz & 1kHz)
75dB
■ Output Power at 5.0V, 1% THD+N, 8Ω
1.3W (typ)
■ Output Power at 3.6V, 1% THD+N, 8Ω
625mW (typ)
■ Shutdown Current
0.01µA (typ)
Features
■
■
■
■
■
■
■
■
■
Available in space-saving 0.4mm pitch μSMD package
Ultra low current shutdown mode
BTL output can drive capacitive loads
Improved pop & click circuitry eliminates noise during turnon and turn-off transitions
2.4 - 5.5V operation
No output coupling capacitors, snubber networks or
bootstrap capacitors required
Unity-gain stable
External gain configuration capability
LLP package: 0.5mm pitch, 3 x 3 mm
Applications
■ Mobile Phones
■ PDAs
■ Portable electronic devices
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2007 National Semiconductor Corporation
201599
www.national.com
LM4995 1.3 W Audio Power Amplifier
September 2007
LM4995
Typical Application
201599d3
FIGURE 1. Typical Audio Amplifier Application Circuit
www.national.com
2
LM4995
Connection Diagrams
TM Package
TM Marking
Top View
Order Number LM4995TM
See NS Package Number TMD09AAA
Top View
X - Date Code
V - Die Traceability
G - Boomer Family
G8 - LM4995TM
SD Package
SD Marking
20159949
20159903
20159957
Top View
Order Number LM4995SD
See NS Package Number SDA08A
20159999
Top View
Z - Assembly Plant code
XY - 2 Digit date code
TT - Die Traceability
L4995 - LM4995SD
3
www.national.com
LM4995
Junction Temperature
Thermal Resistance
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 10)
Storage Temperature
Input Voltage
Power Dissipation (Notes 3, 11)
ESD Susceptibility (Note 4)
ESD Susceptibility (Note 5)
6.0V
−65°C to +150°C
−0.3V to VDD +0.3V
Internally Limited
2000V
200V
150°C
θJA (TM)
96.5°C/W
θJA (SD)
56°C/W
Operating Ratings
Temperature Range
TMIN ≤ TA ≤ TMAX
Supply Voltage
−40°C ≤ TA ≤ 85°C
2.4V ≤ VDD ≤ 5.5V
Electrical Characteristics VDD = 5V
(Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25°C.
LM4995
Symbol
Parameter
Conditions
VIN = 0V, Io = 0A, No Load
Units
(Limits)
Typical
Limit
(Note 6)
(Notes 7, 8)
1.5
2.5
mA (max)
IDD
Quiescent Power Supply Current
VIN = 0V, Io = 0A, 8Ω Load
1.8
ISD
Shutdown Current
VSD = VGND
0.01
1
µA (max)
VOS
Output Offset Voltage
No Load
5
26
mV (max)
Po
Output Power
THD+N = 1% (max); f = 1 kHz
TWU
Wake-up time
THD+N
Total Harmonic Distortion + Noise
Po = 500mWRMS; f = 1kHz
PSRR
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
Input terminated to GND
VSDIH
Shutdown Voltage Input High
1.5
V
VSDIL
Shutdown Voltage Input Low
1.2
V
mA
1.3 (TM)
1.25 (SD)
W
165
ms
0.08
%
73 (f = 217Hz)
73 (f = 1kHz)
dB
Electrical Characteristics VDD = 3.6V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25°C.
LM4995
Symbol
Parameter
Conditions
VIN = 0V, Io = 0A, No Load
Units
(Limits)
Typical
Limit
(Note 6)
(Notes 7, 8)
1.3
2.3
mA (max)
IDD
Quiescent Power Supply Current
VIN = 0V, Io = 0A, 8Ω Load
1.6
ISD
Shutdown Current
VSD = VGND
0.01
1
µA (max)
VOS
Output Offset Voltage
No Load
5
26
mV (max)
Output Power
THD+N = 1% (max); f = 1 kHz
Po
mA
625 (TM)
610 (SD)
mW
130
ms
0.07
%
TWU
Wake-up time
THD+N
Total Harmonic Distortion + Noise
Po = 300mWRMS; f = 1kHz
PSRR
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
Input terminated to GND
VSDIH
Shutdown Voltage Input High
1.3
V
VSDIL
Shutdown Voltage Input Low
1
V
www.national.com
4
75 (f = 217Hz)
76 (f = 1kHz)
dB
LM4995
Electrical Characteristics VDD = 3.0V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25°C.
LM4995
Symbol
Parameter
Conditions
Typical
Limit
(Note 6)
(Notes 7, 8)
Units
(Limits)
VIN = 0V, Io = 0A, No Load
1.3
mA
VIN = 0V, Io = 0A, 8Ω Load
1.6
mA
0.01
µA
5
mV
400
mW
110
ms
IDD
Quiescent Power Supply Current
ISD
Shutdown Current
VSD = VGND
VOS
Output Offset Voltage
No Load
Po
Output Power
THD+N = 1% (max); f = 1 kHz
TWU
Wake-up time
THD+N
Total Harmonic Distortion + Noise
Po = 250mWRMS; f = 1kHz
PSRR
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
Input terminated to GND
VSDIH
VSDIL
0.07
%
74 (f = 217Hz)
75 (f = 1kHz)
dB
Shutdown Voltage Input High
1.2
V
Shutdown Voltage Input Low
1
V
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4995, see power derating
curves for additional information.
Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 5: Machine Model, 220pF–240pF discharged through all pins.
Note 6: Typicals are measured at 25°C and represent the parametric norm.
Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 9: ROUT is measured from the output pin to ground. This value represents the parallel combination of the 10kΩ output resistors and the two 20kΩ resistors.
Note 10: If the product is in Shutdown mode and VDD exceeds 6V (to a max of 8V VDD), then most of the excess current will flow through the ESD protection
circuits. If the source impedance limits the current to a max of 10mA, then the device will be protected. If the device is enabled when VDD is greater than 5.5V
and less than 6.5V, no damage will occur, although operation life will be reduced. Operation above 6.5V with no current limit will result in permanent damage.
Note 11: Maximum power dissipation in the device (PDMAX) occurs at an output power level significantly below full output power. PDMAX can be calculated using
Equation 1 shown in the Application Information section. It may also be obtained from the power dissipation graphs.
External Components Description
(Figure 1)
Components
1.
Ri
Functional Description
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high
pass filter with Ci at fC= 1/(2π RiCi).
2.
Ci
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a highpass filter
with Ri at fC = 1/(2π RiCi). Refer to the section, Proper Selection of External Components, for an explanation of
how to determine the value of Ci.
3.
Rf
Feedback resistance which sets the closed-loop gain in conjunction with Ri.
4.
CS
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for
information concerning proper placement and selection of the supply bypass capacitor.
5.
CB
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
5
www.national.com
LM4995
Typical Performance Characteristics
THD+N vs Output Power
VDD = 3V, RL = 8Ω
THD+N vs Output Power
VDD = 3.6V, RL = 8Ω
20159918
20159917
THD+N vs Output Power
VDD = 5V, RL = 8Ω
THD+N vs Frequency
VDD = 3V, RL = 8Ω,
f = 1kHz, PO = 250mW
20159919
20159942
THD+N vs Frequency
VDD = 3.6V, RL = 8Ω,
f = 1kHz, PO = 300mW
THD+N vs Frequency
VDD = 5V, RL = 8Ω,
f = 1kHz, PO = 500mW
20159941
www.national.com
20159943
6
LM4995
PSRR vs Frequency
VDD = 3V, RL = 8Ω
PSRR vs Frequency
VDD = 3.6V, RL = 8Ω
20159950
20159933
PSRR vs Frequency
VDD = 5V, RL = 8Ω
Power Dissipation vs Output Power
VDD = 3V, RL = 8Ω
20159909
20159951
Power Dissipation vs Output Power
VDD = 3.6V, RL = 8Ω
Power Dissipation vs Output Power
VDD = 5V, RL = 8Ω
20159908
20159910
7
www.national.com
LM4995
Output Level vs Frequency Response
(Three different caps)
Shutdown Voltage VSDIH
VDD = 3V
20159906
20159936
Shutdown Voltage VSDIH
VDD = 3.6V
Shutdown Voltage VSDIH
VDD = 5V
20159947
20159937
Shutdown Voltage VSDIL
VDD = 3V
Shutdown Voltage VSDIL
VDD = 3.6V
20159939
www.national.com
20159948
8
LM4995
Shutdown Voltage VSDIL
VDD = 5V
Output Power vs Supply Voltage
RL = 8Ω
20159907
20159940
9
www.national.com
LM4995
Application Information
output pins. Refer to the application information on the
LM4995 reference design board for an example of good heat
sinking. If TJMAX still exceeds 150°C, then additional changes
must be made. These changes can include reduced supply
voltage, higher load impedance, or reduced ambient temperature. Internal power dissipation is a function of output power.
Refer to the Typical Performance Characteristics curves
for power dissipation information for different output powers
and output loading.
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4995 has two internal operational amplifiers. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in a unitygain, inverting configuration. The closed-loop gain of the first
amplifier is set by selecting the ratio of Rf to Ri while the second amplifier's gain is fixed by the two internal 20kΩ resistors.
Figure 1 shows that the output of amplifier one serves as the
input to amplifier two which results in both amplifiers producing signals identical in magnitude, but out of phase by 180°.
Consequently, the differential gain for the IC is
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high supply rejection. The capacitor location on both the bypass and power supply pins should
be as close to the device as possible. A ceramic 0.1μF placed
in parallel with the tantalum 2.2μF bypass (CB) capacitor will
aid in supply stability. This does not eliminate the need for
bypassing the power supply pins of the LM4995. The selection of a bypass capacitor, especially CB, is dependent upon
PSRR requirements, click and pop performance (as explained in the section, Proper Selection of External Components), system cost, and size constraints.
AVD= 2 *(Rf/Ri)
By driving the load differentially through outputs Vo1 and Vo2,
an amplifier configuration commonly referred to as “bridged
mode” is established. Bridged mode operation is different
from the classical single-ended amplifier configuration where
one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential drive
to the load, thus doubling output swing for a specified supply
voltage. Four times the output power is possible as compared
to a single-ended amplifier under the same conditions. This
increase in attainable output power assumes that the amplifier is not current limited or clipped. In order to choose an
amplifier's closed-loop gain without causing excessive clipping, please refer to the Audio Power Amplifier Design
section.
A bridge configuration, such as the one used in LM4995, also
creates a second advantage over single-ended amplifiers.
Since the differential outputs, Vo1 and Vo2, are biased at halfsupply, no net DC voltage exists across the load. This eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configuration. Without an output coupling capacitor, the half-supply
bias across the load would result in both increased internal IC
power dissipation and also possible loudspeaker damage.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4995 contains shutdown circuitry that is used to turn off the
amplifier's bias circuitry. This shutdown feature turns the amplifier off when logic low is placed on the shutdown pin. By
switching the shutdown pin to GND, the LM4995 supply current draw will be minimized in idle mode. Idle current is
measured with the shutdown pin connected to GND. The trigger point for shutdown is shown as a typical value in the
Shutdown Hysteresis Voltage graphs in the Typical Performance Characteristics section. It is best to switch between
ground and supply for maximum performance. While the device may be disabled with shutdown voltages in between
ground and supply, the idle current may be greater than the
typical value of 0.01µA. In either case, the shutdown pin
should be tied to a definite voltage to avoid unwanted state
changes.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or singleended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the LM4995 has two operational amplifiers in one package, the maximum internal power
dissipation is 4 times that of a single-ended amplifier. The
maximum power dissipation for a given application can be
derived from the power dissipation graphs or from Equation
1.
PDMAX = 4*(VDD)2/(2π2RL)
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry, which provides a quick, smooth transition to shutdown. Another solution
is to use a single-throw switch in conjunction with an external
pull-up resistor. This scheme guarantees that the shutdown
pin will not float, thus preventing unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using
integrated power amplifiers is critical to optimize device and
system performance. While the LM4995 is tolerant of external
component combinations, consideration to component values
must be used to maximize overall system quality.
The LM4995 is unity-gain stable which gives the designer
maximum system flexibility. The LM4995 should be used in
low gain configurations to minimize THD+N values, and maximize the signal to noise ratio. Low gain configurations require
large input signals to obtain a given output power. Input signals equal to or greater than 1 Vrms are available from
sources such as audio codecs. Please refer to the section,
Audio Power Amplifier Design, for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closedloop bandwidth of the amplifier. To a large extent, the band-
(1)
It is critical that the maximum junction temperature TJMAX of
150°C is not exceeded. TJMAX can be determined from the
power derating curves by using PDMAX and the PC board foil
area. By adding copper foil, the thermal resistance of the application can be reduced from the free air value of θJA, resulting in higher PDMAX values without thermal shutdown
protection circuitry being activated. Additional copper foil can
be added to any of the leads connected to the LM4995. It is
especially effective when connected to VDD, GND, and the
www.national.com
10
Selection Of Input Capacitor Size
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenuation. But in many cases the speakers used in portable systems, whether internal or external, have little ability to
reproduce signals below 100Hz to 150Hz. Thus, using a large
input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance
is effected by the size of the input coupling capacitor, Ci. A
larger input coupling capacitor requires more charge to reach
its quiescent DC voltage (nominally 1/2 VDD). This charge
comes from the output via the feedback and is apt to create
pops upon device enable. Thus, by minimizing the capacitor
size based on necessary low frequency response, turn-on
pops can be minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value. Bypass
capacitor, CB, is the most critical component to minimize turnon pops since it determines how fast the LM4995 turns on.
The slower the LM4995's outputs ramp to their quiescent DC
voltage (nominally 1/2 VDD), the smaller the turn-on pop.
Choosing CB equal to 1.0µF along with a small value of Ci (in
the range of 0.1µF to 0.39µF), should produce a virtually
clickless and popless shutdown function. While the device will
function properly, (no oscillations or motorboating), with CB
equal to 0.1µF, the device will be much more susceptible to
turn-on clicks and pops. Thus, a value of CB equal to 1.0µF is
recommended in all but the most cost sensitive designs.
(2)
Rf/Ri = AVD/2
From Equation 2, the minimum AVD is 2.83; use AVD = 3.
Since the desired input impedance was 20 kΩ, and with a
AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results in an
allocation of Ri = 20 kΩ and Rf = 30 kΩ. The final design step
is to address the bandwidth requirements which must be stated as a pair of −3 dB frequency points. Five times away from
a −3 dB point is 0.17 dB down from passband response which
is better than the required ±0.25 dB specified.
fL = 100Hz/5 = 20Hz
fH = 20kHz * 5 = 100kHz
As stated in the External Components section, Ri in conjunction with Ci create a highpass filter.
Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
The high frequency pole is determined by the product of the
desired frequency pole, fH, and the differential gain, AVD. With
a AVD = 3 and fH = 100kHz, the resulting GBWP = 300kHz
which is much smaller than the LM4995 GBWP of 2.5MHz.
This figure displays that if a designer has a need to design an
amplifier with a higher differential gain, the LM4995 can still
be used without running into bandwidth limitations.
The LM4995 is unity-gain stable and requires no external
components besides gain-setting resistors, an input coupling
capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential gain of greater
than 10 is required, a feedback capacitor (C4) may be needed
as shown in Figure 2 to bandwidth limit the amplifier. This
feedback capacitor creates a low pass filter that eliminates
possible high frequency oscillations. Care should be taken
when calculating the -3dB frequency in that an incorrect combination of R3 and C4 will cause rolloff before 20kHz. A typical
combination of feedback resistor and capacitor that will not
produce audio band high frequency rolloff is R3 = 20kΩ and
C4 = 25pf. These components result in a -3dB point of approximately 320kHz.
AUDIO POWER AMPLIFIER DESIGN
A 1W/8Ω Audio Amplifier
Given:
Power Output
Load Impedance
Input Level
Input Impedance
Bandwidth
1 Wrms
8Ω
1 Vrms
20 kΩ
100 Hz–20 kHz ± 0.25 dB
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Performance Characteristics section, the supply rail can be
easily found.
11
www.national.com
LM4995
5V is a standard voltage in most applications, it is chosen for
the supply rail. Extra supply voltage creates headroom that
allows the LM4995 to reproduce peaks in excess of 1W without producing audible distortion. At this time, the designer
must make sure that the power supply choice along with the
output impedance does not violate the conditions explained
in the Power Dissipation section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equation 2.
width is dictated by the choice of external components shown
in Figure 1. The input coupling capacitor, Ci, forms a first order
high pass filter which limits low frequency response. This value should be chosen based on needed frequency response
for a few distinct reasons.
LM4995
201599d4
FIGURE 2. HIGHER GAIN AUDIO AMPLIFIER
201599d5
FIGURE 3. DIFFERENTIAL AMPLIFIER CONFIGURATION FOR LM4995
www.national.com
12
LM4995
201599d6
FIGURE 4. REFERENCE DESIGN BOARD SCHEMATIC
13
www.national.com
LM4995
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A "Pi-filter" can be helpful
in minimizing High Frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digital
and analog ground traces to minimize noise coupling.
GENERAL MIXED SIGNAL LAYOUT RECOMMENDATION
Placement of Digital and Analog Components
All digital components and high-speed digital signal traces
should be located as far away as possible from analog components and circuit traces.
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bringing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can have a major
impact on low level signal performance. Star trace routing
refers to using individual traces to feed power and ground to
each circuit or even device. This technique will require a
greater amount of design time but will not increase the final
price of the board. The only extra parts required will be some
jumpers.
www.national.com
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces parallel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each other
from the top to the bottom side as much as possible will minimize capacitive noise coupling and cross talk.
14
LM4995
Revision History
Rev
Date
Description
1.0
04/05/06
Initial WEB released of the datasheet.
1.1
05/17/06
Added the SD package.
1.2
08/07/06
Text edits.
1.3
08/22/06
Edited the THD+N Typical values on
the 3 EC tables, then re-released the D/
S to the WEB (per Allan S.).
1.4
09/11/07
Updated the SD pkg. diagram.
15
www.national.com
LM4995
Physical Dimensions inches (millimeters) unless otherwise noted
TM Package
Order Number LM4995TM
NS Package Number TMD09AAA
SDPackage
Order Number LM4995SD
NS Package Number SDA08A
www.national.com
16
LM4995
Notes
17
www.national.com
LM4995 1.3 W Audio Power Amplifier
Notes
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2007 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Customer
Support Center
Email:
[email protected]
Tel: 1-800-272-9959
www.national.com
National Semiconductor Europe
Customer Support Center
Fax: +49 (0) 180-530-85-86
Email: [email protected]
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +49 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor Asia
Pacific Customer Support Center
Email: [email protected]
National Semiconductor Japan
Customer Support Center
Fax: 81-3-5639-7507
Email: [email protected]
Tel: 81-3-5639-7560