CY7C1302DV25 9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture 9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture Features Functional Description ■ Separate independent Read and Write data ports ❐ Supports concurrent transactions ■ 167-MHz clock for high bandwidth ❐ 2.5 ns Clock-to-Valid access time ■ 2-word burst on all accesses ■ Double Data Rate (DDR) interfaces on both Read and Write ports (data transferred at 333 MHz) @ 167 MHz ■ Two input clocks (K and K) for precise DDR timing ❐ SRAM uses rising edges only ■ Two input clocks for output data (C and C) to minimize clock-skew and flight-time mismatches. ■ Single multiplexed address input bus latches address inputs for both Read and Write ports ■ Separate Port Selects for depth expansion ■ Synchronous internally self-timed writes ■ 2.5 V core power supply with HSTL Inputs and Outputs ■ Available in 165-ball FBGA package (13 × 15 × 1.4 mm) ■ Variable drive HSTL output buffers ■ Expanded HSTL output voltage (1.4 V–1.9 V) ■ JTAG Interface Configurations CY7C1302DV25 – 512 K × 18 Cypress Semiconductor Corporation Document Number: 38-05625 Rev. *D • The CY7C1302DV25 is a 2.5 V Synchronous Pipelined SRAM equipped with QDR™ architecture. QDR architecture consists of two separate ports to access the memory array. The Read port has dedicated data outputs to support Read operations and the Write Port has dedicated data inputs to support Write operations. Access to each port is accomplished through a common address bus. The Read address is latched on the rising edge of the K clock and the Write address is latched on the rising edge of K clock. QDR has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common I/O devices. Accesses to the CY7C1302DV25 Read and Write ports are completely independent of one another. All accesses are initiated synchronously on the rising edge of the positive input clock (K). In order to maximize data throughput, both Read and Write ports are equipped with DDR interfaces. Therefore, data can be transferred into the device on every rising edge of both input clocks (K and K) and out of the device on every rising edge of the output clock (C and C, or K and K in a single clock domain) thereby maximizing performance while simplifying system design. Each address location is associated with two 18-bit words that burst sequentially into or out of the device. Depth expansion is accomplished with a Port Select input for each port. Each Port Select allows each port to operate independently. All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry. 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised May 9, 2011 [+] Feedback CY7C1302DV25 Logic Block Diagram - CY7C1302DV25 Address Register 18 K K CLK Gen. Write Data Reg 256Kx18 Memory Array Write Data Reg 256Kx18 Memory Array Read Add. Decode A(17:0) 18 Write Add. Decode D[17:0] Address Register Control Logic Read Data Reg. 36 Vref WPS BWS0 Control Logic BWS1 Document Number: 38-05625 Rev. *D 18 Reg. 18 Reg. 18 Reg. 18 A(17:0) 18 RPS C C 18 Q[17:0] Page 2 of 25 [+] Feedback CY7C1302DV25 Contents Selection Guide ................................................................ 4 Pin Configuration ............................................................. 4 165-ball FBGA (13 × 15 × 1.4 mm) Pinout .................. 4 Pin Definitions .................................................................. 4 Introduction ....................................................................... 5 Functional Overview .................................................... 5 Read Operations ......................................................... 6 Write Operations ......................................................... 6 Byte Write Operations ................................................. 6 Single Clock Mode ...................................................... 6 Concurrent Transactions ............................................. 6 Depth Expansion ......................................................... 6 Programmable Impedance .......................................... 6 Application Example ........................................................ 7 Truth Table ........................................................................ 8 Write Cycle Descriptions ................................................. 8 IEEE 1149.1 Serial Boundary Scan (JTAG) .................... 9 Disabling the JTAG Feature ........................................ 9 Test Access Port—Test Clock ..................................... 9 Test Mode Select ........................................................ 9 Test Data-In (TDI) ....................................................... 9 Test Data-Out (TDO) ................................................... 9 Performing a TAP Reset ............................................. 9 TAP Registers ............................................................. 9 TAP Instruction Set ..................................................... 9 TAP Controller State Diagram ....................................... 11 TAP Controller Block Diagram ...................................... 12 TAP Electrical Characteristics ...................................... 12 Document Number: 38-05625 Rev. *D TAP AC Switching Characteristics ............................... 13 TAP Timing and Test Conditions .................................. 14 Identification Register Definitions ................................ 14 Scan Register Sizes ....................................................... 15 Instruction Codes ........................................................... 15 Boundary Scan Order .................................................... 16 Maximum Ratings ........................................................... 17 Operating Range ............................................................. 17 Electrical Characteristics ............................................... 17 DC Electrical Characteristics ..................................... 17 AC Input Requirements ............................................. 17 Thermal Resistance ........................................................ 18 Capacitance .................................................................... 18 AC Test Loads and Waveforms ..................................... 18 Switching Characteristics .............................................. 18 Switching Waveforms .................................................... 20 Ordering Information ...................................................... 21 Ordering Code Definitions ......................................... 21 Package Diagram ............................................................ 22 Acronyms ........................................................................ 23 Document Conventions ................................................. 23 Units of Measure ....................................................... 23 Document History Page ................................................. 24 Sales, Solutions, and Legal Information ...................... 25 Worldwide Sales and Design Support ....................... 25 Products .................................................................... 25 PSoC Solutions ......................................................... 25 Page 3 of 25 [+] Feedback CY7C1302DV25 Selection Guide CY7C1302DV25-167 Unit Maximum Operating Frequency 167 MHz Maximum Operating Current 500 mA Pin Configuration 165-ball FBGA (13 × 15 × 1.4 mm) Pinout CY7C1302DV25 (512 K × 18) 1 2 3 4 5 6 7 8 9 WPS BWS1 K NC RPS D9 A NC K BWS0 A NC D10 VSS A A A VSS D11 Q10 VSS VSS VSS VSS VSS Q11 VDDQ VSS VSS VSS VDDQ NC A NC B NC Gnd/144M NC/36M C NC D NC E NC NC Q9 10 NC/18M Gnd/72M NC 11 NC NC Q8 NC Q7 D8 NC NC D7 D6 Q6 F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5 G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5 H NC VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4 K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3 L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2 M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2 N NC D17 Q16 VSS A A A VSS NC NC D1 P NC NC Q17 A A C A A NC D0 Q0 R TDO TCK A A A C A A A TMS TDI Pin Definitions Name I/O Description D[17:0] InputData input signals, sampled on the rising edge of K and K clocks during valid Write Synchronous operations. WPS InputWrite Port Select, active LOW. Sampled on the rising edge of the K clock. When asserted active, Synchronous a Write operation is initiated. Deasserting will deselect the Write port. Deselecting the Write port will cause D[17:0] to be ignored. BWS0, BWS1 InputByte Write Select 0, 1, active LOW. Sampled on the rising edge of the K and K clocks during Synchronous Write operations. Used to select which byte is written into the device during the current portion of the Write operations. Bytes not written remain unaltered. BWS0 controls D[8:0] and BWS1 controls D[17:9]. All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select will cause the corresponding byte of data to be ignored and not written into the device. A InputAddress Inputs. Sampled on the rising edge of the K (read address) and K (write address) clocks Synchronous for active Read and Write operations. These address inputs are multiplexed for both Read and Write operations. Internally, the device is organized as 512 K × 18 (2 arrays each of 256 K × 18). These inputs are ignored when the appropriate port is deselected. Q[17:0] OutputsData Output signals. These pins drive out the requested data during a Read operation. Valid data Synchronous is driven out on the rising edge of both the C and C clocks during Read operations or K and K when in single clock mode. When the Read port is deselected, Q[17:0] are automatically three-stated. Document Number: 38-05625 Rev. *D Page 4 of 25 [+] Feedback CY7C1302DV25 Pin Definitions (continued) Name RPS I/O Description InputRead Port Select, active LOW. Sampled on the rising edge of positive input clock (K). When Synchronous active, a Read operation is initiated. Deasserting will cause the Read port to be deselected. When deselected, the pending access is allowed to complete and the output drivers are automatically three-stated following the next rising edge of the C clock. Each read access consists of a burst of two sequential transfers. C Input-Clock Positive Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board back to the controller. See application example for further details. C Input-Clock Negative Input Clock for Output Data. C is used in conjunction with C to clock out the Read data from the device. C and C can be used together to deskew the flight times of various devices on the board cack to the controller. See application example for further details. K Input-Clock Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device and to drive out data through Q[17:0] when in single clock mode. All accesses are initiated on the rising edge of K. K Input-Clock Negative Input Clock Input. K is used to capture synchronous inputs being presented to the device and to drive out data through Q[17:0] when in single clock mode. Input Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus impedance. Q[17:0] output impedance is set to 0.2 × RQ, where RQ is a resistor connected between ZQ and ground. Alternately, this pin can be connected directly to VDDQ, which enables the minimum impedance mode. This pin cannot be connected directly to GND or left unconnected. ZQ TDO Output TCK Input TDO for JTAG. TCK pin for JTAG. TDI Input TDI pin for JTAG. TMS Input TMS pin for JTAG. NC/18M N/A Address expansion for 18M. This is not connected to the die and so can be tied to any voltage level. NC/36M N/A Address expansion for 36M. This is not connected to the die and so can be tied to any voltage level. GND/72M Input Address expansion for 72M. This must be tied LOW. GND/144M Input Address expansion for 144M. This must be tied LOW. N/A Not connected to the die. Can be tied to any voltage level. NC VREF VDD VSS VDDQ InputReference Reference Voltage Input. Static input used to set the reference level for HSTL inputs and Outputs as well as AC measurement points. Power Supply Power supply inputs to the core of the device. Ground Ground for the device. Power Supply Power supply inputs for the outputs of the device. Introduction Functional Overview The CY7C1302DV25 is a synchronous pipelined Burst SRAM equipped with both a Read port and a Write port. The Read port is dedicated to Read operations and the Write port is dedicated to Write operations. Data flows into the SRAM through the Write port and out through the Read port. These devices multiplex the address inputs in order to minimize the number of address pins required. By having separate Read and Write ports, the QDR-I completely eliminates the need to “turn-around” the data bus and avoids any possible data contention, thereby simplifying system design. Document Number: 38-05625 Rev. *D Accesses for both ports are initiated on the rising edge of the Positive Input Clock (K). All synchronous input timing is referenced from the rising edge of the input clocks (K and K) and all output timing is referenced to the output clocks (C and C, or K and K when in single clock mode). All synchronous data inputs (D[17:0]) pass through input registers controlled by the input clocks (K and K). All synchronous data outputs (Q[17:0]) pass through output registers controlled by the rising edge of the output clocks (C and C, or K and K when in single clock mode). All synchronous control (RPS, WPS, BWS[1:0]) inputs pass through input registers controlled by the rising edge of input clocks (K and K). Page 5 of 25 [+] Feedback CY7C1302DV25 Read Operations The CY7C1302DV25 is organized internally as 2 arrays of 256 K × 18. Accesses are completed in a burst of two sequential 18-bit data words. Read operations are initiated by asserting RPS active at the rising edge of the positive input clock (K). The address is latched on the rising edge of the K clock. Following the next K clock rise the corresponding lower order 18-bit word of data is driven onto the Q[17:0] using C as the output timing reference. On the subsequent rising edge of C the higher order data word is driven onto the Q[17:0]. The requested data will be valid 2.5 ns from the rising edge of the output clock (C and C, or K and K when in single clock mode, 167-MHz device). Synchronous internal circuitry will automatically three-state the outputs following the next rising edge of the positive output clock (C). This will allow for a seamless transition between devices without the insertion of wait states in a depth expanded memory. Write Operations Write operations are initiated by asserting WPS active at the rising edge of the positive input clock (K). On the same K clock rise the data presented to D[17:0] is latched into the lower 18-bit Write Data register provided BWS[1:0] are both asserted active. On the subsequent rising edge of the negative input clock (K), the address is latched and the information presented to D[17:0] is stored into the Write Data register provided BWS[1:0] are both asserted active. The 36 bits of data are then written into the memory array at the specified location. When deselected, the Write port will ignore all inputs after the pending Write operations have been completed. Byte Write Operations Byte Write operations are supported by the CY7C1302DV25. A Write operation is initiated as described in the Write Operation section above. The bytes that are written are determined by BWS0 and BWS1 which are sampled with each set of 18-bit data word. Asserting the appropriate Byte Write Select input during the data portion of a write will allow the data being presented to be latched and written into the device. Deasserting the Byte Write Select input during the data portion of a write will allow the data stored in the device for that byte to remain unaltered. This Document Number: 38-05625 Rev. *D feature can be used to simplify Read/Modify/Write operations to a Byte Write operation. Single Clock Mode The CY7C1302DV25 can be used with a single clock mode. In this mode the device will recognize only the pair of input clocks (K and K) that control both the input and output registers. This operation is identical to the operation if the device had zero skew between the K/K and C/C clocks. All timing parameters remain the same in this mode. To use this mode of operation, the user must tie C and C HIGH at power-up.This function is a strap option and not alterable during device operation. Concurrent Transactions The Read and Write ports on the CY7C1302DV25 operate completely independently of one another. Since each port latches the address inputs on different clock edges, the user can Read or Write to any location, regardless of the transaction on the other port. Also, reads and writes can be started in the same clock cycle. If the ports access the same location at the same time, the SRAM will deliver the most recent information associated with the specified address location. This includes forwarding data from a Write cycle that was initiated on the previous K clock rise. Depth Expansion The CY7C1302DV25 has a Port Select input for each port. This allows for easy depth expansion. Both Port Selects are sampled on the rising edge of the Positive Input Clock only (K). Each port select input can deselect the specified port. Deselecting a port will not affect the other port. All pending transactions (Read and Write) will be completed prior to the device being deselected. Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5 × the value of the intended line impedance driven by the SRAM, The allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175 and 350 , with VDDQ = 1.5 V. The output impedance is adjusted every 1024 cycles to account for drifts in supply voltage and temperature. Page 6 of 25 [+] Feedback CY7C1302DV25 Application Example[1] Note 1. The above application shows 4 QDR-I being used. Document Number: 38-05625 Rev. *D Page 7 of 25 [+] Feedback CY7C1302DV25 Truth Table[2, 3, 4, 5, 6, 7] Operation K RPS WPS DQ DQ Write Cycle: Load address on the rising edge of K clock; input write data on K and K rising edges. L–H X L D(A+0) at K(t) D(A+1) at K(t) Read Cycle: Load address on the rising edge of K clock; wait one cycle; read data on 2 consecutive C and C rising edges. L–H L X Q(A+0) at C(t+1) Q(A+1) at C(t+1) NOP: No Operation L–H H H D=X Q = High Z D=X Q = High Z Stopped X X Previous State Previous State Standby: Clock Stopped Write Cycle Descriptions[2, 8] BWS0 BWS1 K K Comments L L L–H – During the Data portion of a Write sequence, both bytes (D[17:0]) are written into the device. L L – L–H During the Data portion of a Write sequence, both bytes (D[17:0]) are written into the device. L H L–H – During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[17:9] remains unaltered. L H – L–H During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written into the device. D[17:9] remains unaltered. H L L–H – During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] remains unaltered. H L – L–H During the Data portion of a Write sequence, only the byte (D[17:9]) is written into the device. D[8:0] remains unaltered. H H L–H – No data is written into the device during this portion of a Write operation. H H – L–H No data is written into the device during this portion of a Write operation. Notes 2. ,X = Don't Care, H = Logic HIGH, L = Logic LOW represents rising edge. 3. Device will power-up deselected and the outputs in a three-state condition. 4. “A” represents address location latched by the devices when transaction was initiated. A+0, A+1 represent the addresses sequence in the burst. 5. “t” represents the cycle at which a Read/Write operation is started. t+1 is the first clock cycle succeeding the “t” clock cycle. 6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode. 7. It is recommended that K = K and C = C when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically. 8. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. BWS0, BWS1 can be altered on different portions of a Write cycle, as long as the set-up and hold requirements are achieved. Document Number: 38-05625 Rev. *D Page 8 of 25 [+] Feedback CY7C1302DV25 IEEE 1149.1 Serial Boundary Scan (JTAG) These SRAMs incorporate a serial boundary scan test access port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-1900. The TAP operates using JEDEC standard 2.5 V I/O logic levels. Disabling the JTAG Feature It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device. Test Access Port—Test Clock The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. Test Mode Select The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. Test Data-In (TDI) The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) on any register. Test Data-Out (TDO) The TDO output pin is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine (see Instruction codes). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. Performing a TAP Reset A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power-up, the TAP is reset internally to ensure that TDO comes up in a high Z state. TAP Registers Registers are connected between the TDI and TDO pins and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 38-05625 Rev. *D Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the Capture IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board level serial test path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The boundary scan register is connected to all of the input and output pins on the SRAM. Several no connect (NC) pins are also included in the scan register to reserve pins for higher density devices. The boundary scan register is loaded with the contents of the RAM Input and Output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the Input and Output ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI, and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table. TAP Instruction Set Eight different instructions are possible with the three-bit instruction register. All combinations are listed in the Instruction Code table. Three of these instructions are listed as RESERVED and should not be used. The other five instructions are described in detail below. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO pins. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state. Page 9 of 25 [+] Feedback CY7C1302DV25 IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state. The SAMPLE Z command puts the output bus into a high Z state until the next command is given during the “Update IR” state. SAMPLE/PRELOAD SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register. The user must be aware that the TAP controller clock can only operate at a frequency up to 10 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This will not harm the device, but there is no guarantee as to the value that will be captured. Repeatable results may not be possible. To guarantee that the boundary scan register will capture the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller’s capture set-up plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 38-05625 Rev. *D PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. EXTEST The EXTEST instruction enables the preloaded data to be driven out through the system output pins. This instruction also selects the boundary scan register to be connected for serial access between the TDI and TDO in the shift-DR controller state. EXTEST Output Bus Three-state IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a three-state mode. The boundary scan register has a special bit located at bit #47. When this scan cell, called the “extest output bus three-state”, is latched into the preload register during the “Update-DR” state in the TAP controller, it will directly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will enable the output buffers to drive the output bus. When LOW, this bit will place the output bus into a high Z condition. This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the “Shift-DR” state. During “Update-DR”, the value loaded into that shift-register cell will latch into the preload register. When the EXTEST instruction is entered, this bit will directly control the output Q-bus pins. Note that this bit is pre-set HIGH to enable the output when the device is powered-up, and also when the TAP controller is in the “Test-Logic-Reset” state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. Page 10 of 25 [+] Feedback CY7C1302DV25 TAP Controller State Diagram[9] 1 TEST-LOGIC RESET 0 0 TEST-LOGIC/ IDLE 1 1 SELECT DR-SCAN SELECT IR-SCAN 0 0 1 1 CAPTURE-DR CAPTURE-DR 0 0 SHIFT-DR 0 1 1 EXIT1-DR 1 EXIT1-IR 0 0 PAUSE-DR 0 0 PAUSE-IR 1 1 0 EXIT2-DR EXIT2-IR 1 1 UPDATE-DR 1 0 SHIFT-IR 1 0 1 0 UPDATE-IR 1 0 Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 38-05625 Rev. *D Page 11 of 25 [+] Feedback CY7C1302DV25 TAP Controller Block Diagram 0 Bypass Register Selection Circuitry TDI 2 1 0 1 0 Selection Circuitry Instruction Register 31 30 29 . . 2 TDO Identification Register 106 . . . . 2 1 0 Boundary Scan Register TCK TMS TAP Controller TAP Electrical Characteristics Over the Operating Range [10, 11, 12] Parameter Description Test Conditions Min Max Unit VOH1 Output HIGH Voltage IOH =2.0 mA 1.7 – V VOH2 Output HIGH Voltage IOH =100 A 2.1 – V VOL1 Output LOW Voltage IOL = 2.0 mA – 0.7 V VOL2 Output LOW Voltage IOL = 100 A – 0.2 V VIH Input HIGH Voltage 1.7 VDD + 0.3 V VIL Input LOW Voltage –0.3 0.7 V IX Input and Output Load Current –5 5 A GND VI VDDQ Notes 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics table. 11. Overshoot: VIH(AC) < VDDQ + 0.85 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > –1.5 V (Pulse width less than tCYC/2). 12. All voltage referenced to Ground. Document Number: 38-05625 Rev. *D Page 12 of 25 [+] Feedback CY7C1302DV25 TAP AC Switching Characteristics Over the Operating Range[13, 14] Parameter Description Min Max Unit 50 – ns TCK Clock Frequency – 20 MHz TCK Clock HIGH 20 – ns TCK Clock LOW 20 – ns tTMSS TMS Set-up to TCK Clock Rise 10 – ns tTDIS TDI Set-up to TCK Clock Rise 10 – ns tCS Capture Set-up to TCK Rise 10 – ns tTCYC TCK Clock Cycle Time tTF tTH tTL Set-up Times Hold Times tTMSH TMS Hold after TCK Clock Rise 10 – ns tTDIH TDI Hold after Clock Rise 10 – ns tCH Capture Hold after Clock Rise 10 – ns tTDOV TCK Clock LOW to TDO Valid – 20 ns tTDOX TCK Clock LOW to TDO Invalid 0 – ns Output Times Notes 13. TCS and TCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 14. Test conditions are specified using the load in TAP AC test conditions. Tr/Tf = 1 ns. Document Number: 38-05625 Rev. *D Page 13 of 25 [+] Feedback CY7C1302DV25 TAP Timing and Test Conditions[15] 1.25 V 50 ALL INPUT PULSES 2.5 V 1.25 V TDO Z0 = 50 (a) CL = 20 pF 0V GND tTH tTL Test Clock TCK tTCYC tTMSS tTMSH Test Mode Select TMS tTDIS tTDIH Test Data-In TDI Test Data-Out TDO tTDOX tTDOV Identification Register Definitions Instruction Field Revision Number (31:29) Value Description CY7C1302DV25 000 Cypress Device ID (28:12) 01011010010010110 Cypress JEDEC ID (11:1) 00000110100 ID Register Presence (0) 1 Version number. Defines the type of SRAM. Allows unique identification of SRAM vendor. Indicate the presence of an ID register. Note 15. Test conditions are specified using the load in TAP AC test conditions. Tr/Tf = 1 ns. Document Number: 38-05625 Rev. *D Page 14 of 25 [+] Feedback CY7C1302DV25 Scan Register Sizes Register Name Bit Size Instruction 3 Bypass 1 ID 32 Boundary Scan 107 Instruction Codes Instruction Code Description EXTEST 000 Captures the Input/Output ring contents. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operation. SAMPLE Z 010 Captures the Input/Output contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a high Z state. RESERVED 011 Do Not Use: This instruction is reserved for future use. SAMPLE/PRELOAD 100 Captures the Input/Output ring contents. Places the boundary scan register between TDI and TDO. Does not affect the SRAM operation. RESERVED 101 Do Not Use: This instruction is reserved for future use. RESERVED 110 Do Not Use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 38-05625 Rev. *D Page 15 of 25 [+] Feedback CY7C1302DV25 Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bump ID 0 6R 27 11H 54 7B 81 3G 1 6P 28 10G 55 6B 82 2G 2 6N 29 9G 56 6A 83 1J 3 7P 30 11F 57 5B 84 2J 4 7N 31 11G 58 5A 85 3K 5 7R 32 9F 59 4A 86 3J 6 8R 33 10F 60 5C 87 2K 7 8P 34 11E 61 4B 88 1K 8 9R 35 10E 62 3A 89 2L 9 11P 36 10D 63 1H 90 3L 10 10P 37 9E 64 1A 91 1M 11 10N 38 10C 65 2B 92 1L 12 9P 39 11D 66 3B 93 3N 13 10M 40 9C 67 1C 94 3M 14 11N 41 9D 68 1B 95 1N 15 9M 42 11B 69 3D 96 2M 16 9N 43 11C 70 3C 97 3P 17 11L 44 9B 71 1D 98 2N 18 11M 45 10B 72 2C 99 2P 19 9L 46 11A 73 3E 100 1P 20 10L 47 Internal 74 2D 101 3R 21 11K 48 9A 75 2E 102 4R 22 10K 49 8B 76 1E 103 4P 23 9J 50 7C 77 2F 104 5P 24 9K 51 6C 78 3F 105 5N 25 10J 52 8A 79 1G 106 5R 26 11J 53 7A 80 1F Document Number: 38-05625 Rev. *D Page 16 of 25 [+] Feedback CY7C1302DV25 Maximum Ratings Current into Outputs (LOW) ........................................ 20 mA Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Storage Temperature .............................. –65 °C to + 150 °C Ambient Temperature with Power Applied ........................................ –55 °C to + 125 °C Static Discharge Voltage ........................................ > 2001 V (per MIL-STD-883, Method 3015) Latch-up Current ................................................... > 200 mA Operating Range Ambient Temperature (TA) Supply Voltage on VDD Relative to GND .....–0.5 V to +3.6 V Range Supply Voltage on VDDQ Relative to GND .... –0.5 V to +VDD Commercial DC Applied to Outputs in high Z .......–0.5 V to VDDQ + 0.5 V Industrial 0 °C to +70 °C VDD[17] VDDQ[17] 2.5 ± 0.1 V 1.4 V to 1.9 V –40 °C to +85 °C DC Input Voltage[16] ............................. –0.5 V to VDD + 0.5 V Electrical Characteristics Over the Operating Range[18] DC Electrical Characteristics Over the Operating Range Parameter Description Test Conditions VDD Power Supply Voltage VDDQ I/O Supply Voltage VOH Output HIGH Voltage Note 19 VOL Output LOW Voltage Note 20 VOH(LOW) Output HIGH Voltage IOH = –0.1 mA, Nominal Impedance VOL(LOW) Output LOW Voltage IOL = 0.1 mA, Nominal Impedance VIH Input HIGH Voltage[16] Voltage[16, 21] VIL Input LOW IX Input Load Current GND VI VDDQ IOZ Output Leakage Current GND VI VDDQ, Output Disabled VREF Input Reference Voltage[22] Typical value = 0.75 V IDD VDD Operating Supply ISB1 Automatic Power-Down Current Min Typ Max Unit 2.4 2.5 2.6 V 1.4 1.5 1.9 V VDDQ/2 – 0.12 – VDDQ/2 + 0.12 V VDDQ/2 – 0.12 – VDDQ/2 + 0.12 V VDDQ – 0.2 – VDDQ V VSS – 0.2 V VREF + 0.1 – VDDQ + 0.3 V –0.3 – VREF – 0.1 V –5 – 5 A –5 – 5 A 0.68 0.75 0.95 V VDD = Max., IOUT = 0 mA, f = fMAX = 1/tCYC – – 500 mA Max. VDD, Both Ports Deselected, VIN VIH or VIN VIL, f = fMAX = 1/tCYC, Inputs Static – – 240 mA AC Input Requirements Over the Operating Range Min Typ Max Unit VIH Parameter Input HIGH Voltage Description Test Conditions VREF + 0.2 – – V VIL Input LOW Voltage – – VREF – 0.2 V Notes 16. Overshoot: VIH(AC) < VDDQ + 0.85 V (Pulse width less than tCYC/2), Undershoot: VIL(AC) > –1.5 V (Pulse width less than tCYC/2). 17. Power-up: Assumes a linear ramp from 0 V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD. 18. All voltage referenced to Ground. 19. Output are impedance controlled. IOH = –(VDDQ/2)/(RQ/5) for values of 175 RQ 350 . 20. Output are impedance controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175 RQ 350 . 21. This spec is for all inputs except C and C Clock. For C and C Clock, VIL(Max) = VREF – 0.2 V. 22. VREF (Min.) = 0.68 V or 0.46 VDDQ, whichever is larger, VREF (Max) = 0.95 V or 0.54 VDDQ, whichever is smaller. Document Number: 38-05625 Rev. *D Page 17 of 25 [+] Feedback CY7C1302DV25 Thermal Resistance[23] Parameter Test Conditions 165-ball FBGA Package Unit Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51. 16.7 C/W 2.5 C/W Test Conditions Max Unit Description JA Thermal Resistance (Junction to Ambient) JC Thermal Resistance (Junction to Case) Capacitance[23] Parameter Description TA = 25 C, f = 1 MHz, VDD = 2.5 V, VDDQ = 1.5 V CIN Input Capacitance 5 pF CCLK Clock Input Capacitance 6 pF CO Output Capacitance 7 pF AC Test Loads and Waveforms VREF = 0.75 V 0.75 V VREF VREF OUTPUT Z0 = 50 Device Under Test RL = 50 RQ = 250 R = 50 ALL INPUT PULSES 1.25 V 0.75 V OUTPUT Device Under VREF = 0.75 V Test ZQ ZQ 0.75 V 5 pF [24] 0.25 V Slew Rate = 2 V/ns RQ = 250 (a) (b) Switching Characteristics Over the Operating Range[24] Cypress Parameter Consortium Parameter tPower[25] Description VCC (typical) to the First Access Read or Write 167 MHz Unit Min Max 10 – s Cycle Time tCYC tKHKH K Clock and C Clock Cycle Time 6.0 – ns tKH tKHKL Input Clock (K/K and C/C) HIGH 2.4 – ns tKL tKLKH Input Clock (K/K and C/C) LOW 2.4 – ns tKHKH tKHKH K/K Clock Rise to K/K Clock Rise and C/C to C/C Rise (rising edge to rising edge) 2.7 3.3 ns tKHCH tKHCH K/K Clock Rise to C/C Clock Rise (rising edge to rising edge) 0.0 2.0 ns Set-up Times tSA tSA Address Set-up to Clock (K and K) Rise 0.7 – ns tSC tSC Control Set-up to Clock (K and K) Rise (RPS, WPS, BWS0, BWS1) 0.7 – ns tSD tSD D[17:0] Set-up to Clock (K and K) Rise 0.7 – ns Notes 23. Tested initially and after any design or process change that may affect these parameters. 24. Unless otherwise noted, test conditions assume signal transition time of 2 V/ns, timing reference levels of 0.75 V,Vref = 0.75 V, RQ = 250 W, VDDQ = 1.5V , input pulse levels of 0.25 V to 1.25 V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC test loads. 25. This part has a voltage regulator that steps down the voltage internally; tPower is the time power needs to be supplied above VDD minimum initially before a read or write operation can be initiated. Document Number: 38-05625 Rev. *D Page 18 of 25 [+] Feedback CY7C1302DV25 Switching Characteristics (continued) Over the Operating Range[24] Cypress Parameter Consortium Parameter Description 167 MHz Min Max Unit Hold Times tHA tHA Address Hold after Clock (K and K) Rise 0.7 – ns tHC tHC Control Signals Hold after Clock (K and K) Rise (RPS, WPS, BWS0, BWS1) 0.7 – ns tHD tHD D[17:0] Hold after Clock (K and K) Rise 0.7 – ns Output Times tCO tCHQV C/C Clock Rise (or K/K in single clock mode) to Data Valid tDOH tCHQX Data Output Hold after Output C/C Clock Rise (Active to Active) tCHZ tCHZ Clock (C and C) Rise to high Z (Active to high Z)[26, 27] tCLZ tCLZ Clock (C and C) Rise to low Z[26, 27] – 2.5 ns 1.2 – ns – 2.5 ns 1.2 – ns Notes 26. tCHZ, tCLZ, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ± 100 mV from steady-state voltage. 27. At any given voltage and temperature tCHZ is less than tCLZ and, tCHZ less than tCO. Document Number: 38-05625 Rev. *D Page 19 of 25 [+] Feedback CY7C1302DV25 Switching Waveforms[28, 29, 30] READ WRITE READ WRITE READ WRITE NOP WRITE NOP 1 2 3 4 5 6 7 8 9 10 K tKH tKL tKHKH tCYC K RPS tSC tHC WPS A A0 D D10 A1 A2 tSA tHA tSA tHA D11 D30 A3 A4 A5 D31 D50 D51 Q Q00 tKHCH tKHCH tCO Q01 tDOH tCLZ D60 tSD tHD tSD A6 Q20 D61 tHD Q21 Q40 Q41 tCHZ tDOH tCO C tKH tKL tKHKH tCYC C DON’T CARE UNDEFINED Notes 28. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0 i.e., A0 + 1. 29. Outputs are disabled (High Z) one clock cycle after a NOP. 30. In this example, if address A2 = A1 then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results.This note applies to the whole diagram. Document Number: 38-05625 Rev. *D Page 20 of 25 [+] Feedback CY7C1302DV25 Ordering Information Cypress offers other versions of this type of product in many different configurations and features. The below table contains only the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at www.cypress.com and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative. Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office closest to you, visit us at t http://www.cypress.com/go/datasheet/offices. Speed (MHz) 167 Package Diagram Ordering Code CY7C1302DV25-167BZC Package Type 51-85180 165-ball Fine-Pitch Ball Grid Array (13 × 15 × 1.4 mm) Operating Range Commercial Ordering Code Definitions CY 7C 1302 D V25 - 167 BZ X C Temperature Range: C = Commercial = 0 °C to +70 °C X = Pb-free; X Absent = Leaded Package Type: BZ = 165-ball FBGA Speed: 167 MHz V25 = 2.5 V Process Technology: 90 nm Part Identifier Marketing Code: 7C = SRAM Company ID: CY = Cypress Document Number: 38-05625 Rev. *D Page 21 of 25 [+] Feedback CY7C1302DV25 Package Diagram 51-85180 *C Document Number: 38-05625 Rev. *D Page 22 of 25 [+] Feedback CY7C1302DV25 Acronyms Document Conventions Acronym Description BWS byte write select DDR double data rate FBGA fine-pitch ball grid array HSTL high-speed transceiver logic I/O Input/output JTAG joint test action group LSB least significant bit MSB Units of Measure Symbol Unit of Measure °C degree Celcius µA micro Amperes µs micro seconds mA milli Amperes mm milli meter most significant bit mV milli Volts NC no connect mW milli Watts QDR quad data rate MHz Mega Hertz SRAM static random access memory ns nano seconds TAP test access port ohms TCK test clock % percent TDI test data-in pF pico Farad TDO test data-out V Volts TMS test mode select W Watts Document Number: 38-05625 Rev. *D Page 23 of 25 [+] Feedback CY7C1302DV25 Document History Page Document Title: CY7C1302DV25, 9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture Document Number: 38-05625 REV. ECN NO. Submission Date Orig. of Change Description of Change ** 253010 See ECN SYT New Data Sheet *A 436864 See ECN NXR Converted from Preliminary to Final Removed 133 MHz & 100 MHz from product offering Included the Industrial Operating Range. Changed C/C Description in the Features Section & Pin Description Table Changed tTCYC from 100 ns to 50 ns, changed tTF from 10 MHz to 20 MHz and changed tTH and tTL from 40 ns to 20 ns in TAP AC Switching Characteristics table Modified the ZQ pin definition as follows: Alternately, this pin can be connected directly to VDDQ, which enables the minimum impedance mode Included Maximum Ratings for Supply Voltage on VDDQ Relative to GND Changed the Maximum Ratings for DC Input Voltage from VDDQ to VDD Modified the Description of IX from Input Load current to Input Leakage Current on page # 13 Modified test condition in note# 14 from VDDQ < VDD to VDDQ VDD Updated the Ordering Information table and replaced the Package Name Column with Package Diagram *B 2896202 03/19/2010 NJY Removed inactive parts from the Ordering Information table; Updated package diagram. *C 3122015 12/28/2010 NJY Updated Ordering Information and added Ordering Code Definitions. Added Acronyms and Units of Measure. Minor edits and updated in new template. *D 3249352 05/05/2011 NJY Updated Ordering Information. Minor edits across the document. Document Number: 38-05625 Rev. *D Page 24 of 25 [+] Feedback CY7C1302DV25 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive Clocks & Buffers Interface Lighting & Power Control PSoC Solutions cypress.com/go/automotive cypress.com/go/clocks psoc.cypress.com/solutions cypress.com/go/interface PSoC 1 | PSoC 3 | PSoC 5 cypress.com/go/powerpsoc cypress.com/go/plc Memory Optical & Image Sensing cypress.com/go/memory cypress.com/go/image PSoC cypress.com/go/psoc Touch Sensing cypress.com/go/touch USB Controllers Wireless/RF cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2004-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-05625 Rev. *D Revised May 9, 2011 Page 25 of 25 Quad Data Rate SRAM and QDR SRAM comprise a new family of products developed by Cypress, IDT, NEC, Renesas and Samsung. All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback