This specification documents the detailed requirements for Analog Devices space qualified die including die qualification as described for Class K in MIL-PRF-38534, Appendix C, Table C-II except as modified herein. The manufacturing flow described in the STANDARD DIE PRODUCTS PROGRAM brochure at http://www.analog.com/aerospace is to be considered a part of this specification. This data sheet specifically details the space grade version of this product. A more detailed operational description and a complete data sheet for commercial product grades can be found at www.analog.com/AD561 The complete part number(s) of this specification follow: Part Number Description AD561-000C Low Cost 10-Bit Monolithic D/A Converter 1. GND 2. BPOS 3. -Vs 4. LSB 5. BIT 9 6. BIT 8 7. BIT 7 8. BIT 6 9. BIT 5 10. BIT 4 11. BIT 3 12. BIT 2 13. MSB 14. +Vs 15. IOUT 16. RFB Digital Input Voltage (VIN) .......................................................... Output Voltage Compliance (VOUT) ............................................. 10V Span Resistor to Ground ................................................... Bipolar Offset Resistor To Ground ............................................ Operating Temperature Range ................................................. Storage Temperature Range .................................................... Supply Voltage .......................................................................... Junction Temperature (TJ)………………………………... ............ VCC to Ground -2V to +10V VCC to VEE VCC to VEE -55C to +125C -65C to +150C ±16.5V 175°C Absolute Maximum Ratings Notes 1/ 2/ TA = 25C, unless otherwise noted. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. In accordance with class-K version of MIL-PRF-38534, Appendix C, Table C-II, except as modified herein. (a) Qual Sample Size and Qual Acceptance Criteria – 25/2 (b) Qual Sample Package – Sidebrazed DIP (c) Pre-screen electrical test over temperature performed post-assembly prior to die qualification. Table I Notes: 1/ 2/ VCC = +5V, VEE = -15V, TA = 25C, unless otherwise specified. Also tested in CMOS mode. VCC = +15V, VEE = -15V, VIH = 10.5V, VIL = 4.5V. Table II Notes: 1/ 2/ VCC = +5V, VEE = -15V, unless otherwise specified. Also tested in CMOS mode. VCC = +15V, VEE = -15V, VIH = 10.5V, VIL = 4.5V. 5.1 5.2 5.3 HTRB is not applicable for this drawing. Burn-in is per MIL-STD-883 Method 1015 test condition B or C. Steady state life test is per MIL-STD-883 Method 1005.