MOTOROLA MC14583BD

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 620
The MC14583B is a dual Schmitt trigger constructed with complementary
P–channel and N–channel MOS devices on a monolithic silicon substrate.
Each Schmitt trigger is functionally independent except for a common
3–state input and an internally–connected Exclusive OR output for use in
line receiver applications. Trigger levels are adjustable through the positive,
negative, and common terminals with the use of external resistors.
Applications include the speed–up of a slow waveform edge in interface
receivers, level detectors, etc.
P SUFFIX
PLASTIC
CASE 648
•
•
•
•
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Single Supply Operation
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Resistor Adjustable Trigger Levels
D SUFFIX
SOIC
CASE 751B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Parameter
Symbol
VDD
Unit
– 0.5 to + 18.0
V
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Iin, Iout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
260
_C
TL
DC Supply Voltage
Value
Lead Temperature (8–Second Soldering)
TA = – 55° to 125°C for all packages.
BLOCK DIAGRAM
6
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
Plastic
Ceramic
SOIC
5
7
VDD = PIN 16
VSS = PIN 8
APos ANeg ACom
Aout
Ain
Aout
Dis
9
13
4
11
14
10
Bout
Bin
Bout
BPos BNeg BCom
15
LOGIC DIAGRAM
12
POSITIVE A NEGATIVE A
6 5
7 COMMON A
Ain 9
2
4
3
1
Aout
TRUTH TABLE
Inputs
11 Aout
3–STATE
OUTPUT DISABLE
13
14 EXCLUSIVE OR
Bin 15
10 Bout
12 Bout
1 COMMON B
2 3
POSITIVE B2 NEGATIVE B
A
B
0
0
0
0
0
0
1
1
1
1
1
1
0
0
1
1
Outputs
Dis Aout Aout Bout Bout
0
0
Z
0
Z
1
0
1
0
1
0
0
Z
1
Z
1
0
1
1
0
0
1
0
1
1
1
1
1
Z
0
Z
0
0
0
1
1
Z
1
Z
0
ę
0
0
1
1
1
1
0
0
Z = High impedance at output
VDD = PIN 16
VSS = PIN 8
REV 3
1/94
MOTOROLA
Motorola, Inc. 1995
CMOS LOGIC DATA
MC14583B
1
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 1.2
– 0.25
– 1.62
– 1.8
—
—
—
—
– 1.0
– 0.2
– 0.5
– 1.5
– 1.7
– 0.36
– 0.9
– 3.5
—
—
—
—
– 0.7
– 0.14
– 0.35
– 1.1
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
0.25
0.5
1.0
—
—
—
0.0005
0.0010
0.0015
0.25
0.5
1.0
—
—
—
7.5
15
30
µAdc
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
Three–State Leakage Current
ITL
15
Vin = 0 or VDD
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
“1” Level
VIH
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Vdc
Vdc
IOH
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
mAdc
IT = (1.33 µA/kHz) f + IDD
IT = (2.65 µA/kHz) f + IDD
IT = (3.98 µA/kHz) f + IDD
—
± 0.1
—
± 0.0001
µAdc
± 0.1
—
± 3.0
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.005.
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
MC14583B
2
PIN ASSIGNMENT
BCom
1
16
VDD
BPos
2
15
Bin
BNeg
3
14
Aout
4
13
DIS
ANeg
5
12
Bout
APos
6
11
Aout
ACom
7
10
Bout
VSS
8
9
Ain
MOTOROLA CMOS LOGIC DATA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise Time
tTLH = (3.0 ns/pF) CL + 30 ns
tTLH = (1.5 ns/pF) CL + 15 ns
tTLH = (1.1 ns/pF) CL + 10 ns
tTLH
Output Fall Time
tTHL = (1.5 ns/pF) CL + 25 ns
tTHL = (0.75 ns/pF) CL + 12.5 ns
tTHL = (0.55 ns/pF) CL + 9.5 ns
tTHL
Propagation Delay Time
Ain, Bin to Aout, Bout
tPLH, tPHL = (1.7 ns/pF) CL + 565 ns
tPLH, tPHL = (0.66 ns/pF) CL + 197 ns
tPLH, tPHL = (0.5 ns/pF) CL + 125 ns
tPLH,
tPHL
Ain, Bin to Aout, Bout
tPLH, tPHL = (1.7 ns/pF) CL + 1015 ns
tPLH, tPHL = (0.66 ns/pF) CL + 347 ns
tPLH, tPHL = (0.5 ns/pF) CL + 235 ns
tPLH,
tPHL
Ain, Bin to Exclusive OR
tPLH, tPHL = (1.7 ns/pF) CL + 665 ns
tPLH, tPHL = (0.66 ns/pF) CL + 257 ns
tPLH, tPHL = (0.5 ns/pF) CL + 145 ns
tPLH,
tPHL
3–State Enable, Disable Delay Time (see figure 5)
ton, toff = (1.7 ns/pF) CL + 140 ns
ton, toff = (0.66 ns/pF) CL + 57 ns
ton, toff = (0.5 ns/pF) CL + 30 ns
ton,
toff
Positive Threshold Voltage
(R1, R2 = 5.0 kΩ)
VDD
Min
Typ #
Max
5.0
10
15
—
—
—
180
90
65
360
180
130
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
ns
ns
5.0
10
15
—
—
—
650
230
150
1300
460
300
5.0
10
15
—
—
—
1100
380
260
2200
760
520
5.0
10
15
—
—
—
750
280
170
1500
560
340
5.0
10
15
—
—
—
225
90
55
450
180
110
VT+
5.0
10
15
—
—
—
3.30
5.70
8.20
—
—
—
Vdc
Negative Threshold Voltage
(R1, R2 = 5.0 kΩ)
VT–
5.0
10
15
—
—
—
1.70
4.30
6.80
—
—
—
Vdc
Hysteresis Voltage
(R1, R2 = 5.0 kΩ)
VH
5.0
10
15
0.85
0.70
0.70
1.70
1.40
1.40
3.40
2.80
2.80
Vdc
Threshold Voltage Variation, A to B
(R1, R2 = 5.0 kΩ)
∆VT
5.0
10
15
—
—
—
0.1
0.15
0.20
—
—
—
Vdc
ns
ns
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
MOTOROLA CMOS LOGIC DATA
MC14583B
3
VDD
Vout
VDD
1
VSS
SW1
Aout
Aout
Ain
DIS
Bin
Bout
Bout
2
2
SW2
1
Output
Under Test
IO
Output Source
Characteristics
Output Sink
Characteristics
Test
NJ VGS = – VDD
Value VDS = Vout – VDD
Switch Position
SW1
SW2
Test
NJ VGS = VDD
Value VDS = Vout
Switch Position
SW1
SW2
Aout, Bout
1
1
2
2
Aout, Bout
Exclusive OR
2
2
1
1
1
2
1
1
EXTERNAL
POWER
SUPPLY
VSS
Figure 1. Typical Output Source and Sink Characteristics Test Circuit
VDD
500 µF
0.01 µF
CERAMIC
ID
PULSE
GENERATOR 1
Ain
PULSE
GENERATOR 2
Aout
Aout
DIS
Bin
Bout
Bout
VSS
fout, Ain
fout, Bin
CL
CL
CL
CL
CL
Figure 2. Power Dissipation Test Circuit and Waveforms
80
R1
70
POSITIVE
COMMON
NEGATIVE
R2
B — Feedback scheme for hysteresis adjustment:
POSITIVE
COMMON
NEGATIVE
R1
TYPICAL THRESHOLD POINT (%VDD)
A — Feedback scheme for independent threshold adjustment:
60
50
40
30
VSS = 0
VDD = 5.0 V
VDD = 10 V
VDD = 15 V
20
10
6 8
10 20 40 100
1.0 k
10 k
R1, R2, RESISTANCE (OHMS)
100 k
1.0 M
Figure 3. Typical Threshold Points
MC14583B
4
MOTOROLA CMOS LOGIC DATA
VDD
PULSE
GENERATOR 1
Ain
PULSE
GENERATOR 2
DIS
Bin
Bout
Bout
PULSE
GENERATOR 3
Aout
Aout
CL
VSS
CL
CL
CL
CL
INPUT = tr = tf = 20 ns
VDD
Ain
50%
VSS
VDD
50%
Bin
VSS
VDD
3–STATE
DISABLE
50%
tPLH
tPHL
Aout
tr
tf
90%
50%
10%
tPHL
tr
tf
tPLH
90%
50%
Bout
10%
tPHL
tPLH
50%
Aout
ton
tf toff
90%
tPHL
tr
90%
EXCLUSIVE
OR
VOH
VOL
VOH
Bout
tr
VOL
VOL
ton
toff
tf
VOH
VOH
10%
tPLH
VSS
tPHL
tPLH
tPHL
tPLH
50%
10%
tf
tr
VOL
VOH
VOL
NOTE: Dashed lines indicate high output resistance
Figure 4. Switching Time Test Circuit and Waveforms
MOTOROLA CMOS LOGIC DATA
MC14583B
5
VDD
VDD
1 k*
PULSE
GENERATOR 1
Ain
PULSE
GENERATOR 2
DIS
Bin
Aout
Aout
1
SW
2
Bout
Bout
Test
Switch Position
ton HL
ton LH
1
toff HL
toff LH
2
2
1
1 k*
CL
* Metal film, ± 1%, 1/4 W or greater
VSS
CL = 15 pF, which includes test circuit capacitance.
VDD
Ain
VSS
VDD
Bin
VSS
VDD
3–STATE
DISABLE
50%
ton LH
Aout
10%
VOL
ton LH
Bout
10%
90%
VOH′
SWITCH POSITION 2
toff LH
ton HL
VOH′
90%
toff HL
VOH′
VSS
toff LH
90%
VOH
toff LH
90%
VOH
VOH
10% (VOH – VOL′)
VOL′
VOL
VOH
10% (VOH – VOL′)
VOL′
VOL
SWITCH POSITION 1
VOL′ and VOH′ refer to the levels present as a result of the 1 k ohm load resistors.
Figure 5. 3–State Switching Time Test Circuit and Waveforms
MC14583B
6
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
J
16 PL
0.25 (0.010)
MOTOROLA CMOS LOGIC DATA
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC14583B
7
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
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MC14583B
8
◊
*MC14583B/D*
MOTOROLA CMOS LOGIC
DATA
MC14583B/D