A Product Line of Diodes Incorporated Green ZXMN6A11G 60V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits ID V(BR)DSS RDS(on) TA = +25°C 120mΩ @ VGS= 10V 4.4A 180mΩ @ VGS= 4.5V 3.5A 60V Mechanical Data Description and Applications This MOSFET is designed to minimize the on-state resistance and yet maintain superior switching performance, making it ideal for high efficiency power management applications. Fast Switching Speed Low Gate Drive Low Input Capacitance Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability DC-DC Converters Power Management Functions Disconnect Switches Motor Control Uninterrupted Power Supply Case: SOT223 Case Material: Molded Plastic, “Green” Molding Compound; UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals Connections: See Diagram Below Terminals: Finish - Matte Tin Annealed over Copper Leadframe; Solderable per MIL-STD-202, Method 208 Weight: 0.112 grams (Approximate) D SOT223 G S Pin Out - Top View Top View Equivalent Circuit Ordering Information (Note 4) Product ZXMN6A11GTA Notes: Marking See below Reel size (inches) 7 Tape width (mm) 12 Quantity per reel 1,000 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information ZVN ZXMN ZXMN 6A11 4310 ZXMN6A11G Document number: DS33556 Rev. 6 - 2 YWW SOT223 ZXMN6A11 = Product Type Marking Code YWW = Date Code Marking Y or Y = Last Digit of Year (ex: 5= 2015) WW or WW = Week Code (01~53) 1 of 8 www.diodes.com March 2015 © Diodes Incorporated A Product Line of Diodes Incorporated ZXMN6A11G Maximum Ratings (@TA = +25°C unless otherwise specified.) Characteristic Symbol VDSS VGS Drain-Source Voltage Gate-Source Voltage Continuous Drain Current VGS = 10V Pulsed Drain Current VGS = 10V Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) (Note 6) TA = +70°C (Note 6) (Note 5) (Note 7) (Note 6) (Note 7) Value 60 ±20 Units V 4.4 ID 3.5 3.1 IDM IS ISM 15.6 5 15.6 A Symbol Value 2.0 16 3.9 31 62.5 32.0 9.8 -55 to +150 Unit Thermal Characteristics (@TA = +25°C unless otherwise specified.) Characteristic Power Dissipation Linear Derating Factor Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Lead Operating and Storage Temperature Range Notes: (Note 5) PD (Note 6) (Note 5) (Note 6) (Note 8) RθJA RθJL TJ, TSTG W mW/°C °C/W °C 5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 6. Same as Note 5, except the device is measured at t ≤ 10 seconds. 7. Same as Note 5, except the device is pulsed with D = 0.02 and pulse width 300μs. 8. Thermal resistance from junction to solder-point (at the end of the drain lead). ZXMN6A11G Document number: DS33556 Rev. 6 - 2 2 of 8 www.diodes.com March 2015 © Diodes Incorporated A Product Line of Diodes Incorporated ZXMN6A11G Max Power Dissipation (W) ID Drain Current (A) Thermal Characteristics 10 RDS(on) 2.00 Limited 1.50 1 1.25 DC 1.00 1s 100m 100ms T amb=25°C 10m 25mm x 25mm 1oz FR4 1.75 0.75 10ms 25mm x 25mm 1oz FR4 0.50 1ms 100µs 1 0.25 0.00 10 VDS Drain-Source Voltage (V) 0 20 50 40 D=0.5 30 20 Single Pulse D=0.2 D=0.05 10 0 100µ D=0.1 1m 10m 100m 1 10 100 1k Single Pulse T amb=25°C 25mm x 25mm 1oz FR4 10 1 100µ 1m 10m 100m 1 10 100 1k Pulse Width (s) Transient Thermal Impedance Document number: DS33556 Rev. 6 - 2 100 120 140 160 100 Pulse Width (s) ZXMN6A11G 80 Derating Curve Maximum Power (W) Thermal Resistance (°C/W) T amb=25°C 25mm x 25mm 1oz FR4 60 Temperature (°C) Safe Operating Area 60 40 Pulse Power Dissipation 3 of 8 www.diodes.com March 2015 © Diodes Incorporated A Product Line of Diodes Incorporated ZXMN6A11G Electrical Characteristics (@TA = +25°C unless otherwise specified.) Characteristic OFF CHARACTERISTICS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage ON CHARACTERISTICS Gate Threshold Voltage Symbol Min Typ Max Unit BVDSS IDSS IGSS 60 1.0 100 V µA nA ID = 250A, VGS = 0V VDS = 60V, VGS = 0V VGS = 20V, VDS = 0V VGS(th) RDS (ON) gfs VSD trr Qrr 0.105 0.150 4.9 0.85 21.5 20.5 3.0 0.120 0.180 0.95 V Static Drain-Source On-Resistance (Note 6) 1.0 ID = 250A, VDS = VGS VGS = 10V, ID = 2.5A VGS = 4.5V, ID = 2A VDS = 15V, ID = 2.5A IS = 2.8A, VGS = 0V, TJ = +25°C IS = 2.8A, di/dt = 100A/µs TJ = +25°C Ciss Coss Crss Qg Qg Qgs Qgd tD(on) tr tD(off) tf 330 35.2 17.1 3.0 5.7 1.25 0.86 1.95 3.5 8.2 4.6 Forward Transconductance (Notes 6 & 7) Diode Forward Voltage (Note 6) Reverse Recovery Time (Note 7) Reverse Recovery Charge (Note 7) DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Charge (Note 8) Total Gate Charge (Note 8) Gate-Source Charge (Note 8) Gate-Drain Charge (Note 8) Turn-On Delay Time (Note 8) Turn-On Rise Time (Note 8) Turn-Off Delay Time (Note 8) Turn-Off Fall Time (Note 8) Notes: Ω S V ns nC pF Test Condition VDS = 40V, VGS = 0V, f = 1.0MHz VGS = 4.5V nC ns VGS = 10V VDS = 15V ID = 2.5A VDD = 30V, ID = 2.5A, RG = 6, VGS = 10V 6. Measured under pulsed conditions. Pulse width ≤ 300µs; duty cycle ≤ 2%. 7. For design aid only, not subject to production testing. 8. Switching characteristics are independent of operating junction temperature. ZXMN6A11G Document number: DS33556 Rev. 6 - 2 4 of 8 www.diodes.com March 2015 © Diodes Incorporated A Product Line of Diodes Incorporated ZXMN6A11G Typical Characteristics T = 150°C 10V 5V ID Drain Current (A) ID Drain Current (A) T = 25°C 10 4V 3.5V 1 3V VGS 0.1 2.5V 0.1 1 2.5V 4 5 VGS Gate-Source Voltage (V) Normalised RDS(on) and VGS(th) ID Drain Current (A) 0.1 1.8 5V 10V 0.1 T = 25°C 10 On-Resistance v Drain Current Document number: DS33556 Rev. 6 - 2 RDS(on) 1.4 1.2 1.0 VGS(th) 0.8 VGS = VDS 0.6 0.4 -50 ID = 250uA 0 50 100 150 Normalised Curves v Temperature ISD Reverse Drain Current (A) RDS(on) Drain-Source On-Resistance () 4.5V VGS ZXMN6A11G ID = 2.5A Tj Junction Temperature (°C) 1 1 VGS = 10V 1.6 Typical Transfer Characteristics ID Drain Current (A) 10 Output Characteristics T = 25°C 4V 1 VDS Drain-Source Voltage (V) 1 3.5V 2V 0.1 T = 150°C 3V VGS 0.1 10 VDS = 10V 3 3V 1 Output Characteristics 2 4V 3.5V VDS Drain-Source Voltage (V) 10 10V 5V 10 10 1 T = 150°C T = 25°C 0.1 0.4 0.6 0.8 1.0 VSD Source-Drain Voltage (V) 1.2 Source-Drain Diode Forward Voltage 5 of 8 www.diodes.com March 2015 © Diodes Incorporated A Product Line of Diodes Incorporated ZXMN6A11G C Capacitance (pF) 500 VGS = 0V 400 f = 1MHz 300 CISS COSS 200 CRSS 100 0 1 10 VDS - Drain - Source Voltage (V) Capacitance v Drain-Source Voltage VGS Gate-Source Voltage (V) Typical Characteristics (cont.) 10 ID = 2.5A 8 6 VDS = 30V 4 2 0 0 1 2 3 4 Q - Charge (nC) 5 6 Gate-Source Voltage v Gate Charge Test Circuit ZXMN6A11G Document number: DS33556 Rev. 6 - 2 6 of 8 www.diodes.com March 2015 © Diodes Incorporated A Product Line of Diodes Incorporated ZXMN6A11G Package Outline Dimensions Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version D Q b1 C E E1 Gauge Plane 0.25 Seating Plane e1 L b 0° -1 0° e A1 7° 7° A SOT223 Dim Min Max Typ A 1.55 1.65 1.60 A1 0.010 0.15 0.05 b 0.60 0.80 0.70 b1 2.90 3.10 3.00 C 0.20 0.30 0.25 D 6.45 6.55 6.50 E 3.45 3.55 3.50 E1 6.90 7.10 7.00 e 4.60 e1 2.30 L 0.85 1.05 0.95 Q 0.84 0.94 0.89 All Dimensions in mm Suggested Pad Layout Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version X1 Y1 C1 Dimensions Value (in mm) C 2.30 C1 6.40 X 1.20 X1 3.30 Y 1.60 Y1 1.60 Y2 8.00 Y2 Y X ZXMN6A11G Document number: DS33556 Rev. 6 - 2 C 7 of 8 www.diodes.com March 2015 © Diodes Incorporated A Product Line of Diodes Incorporated ZXMN6A11G IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 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