DXT696BK 180V NPN MEDIUM POWER HIGH GAIN TRANSISTOR IN TO252 Features Mechanical Data BVCEO > 180V IC = 0.5A high Continuous Collector Current ICM = 1A Peak Pulse Current High gain device > 500 at IC =100mA Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Case: TO252 (DPAK) Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads; Solderable per MIL-STD-202, Method 208 Weight: 0.34 grams (approximate) Applications Voltage Regulator Transistors Startup Switches Darlington Replacement DC Fans Relays and Solenoid Driving C C TO252 (DPAK) B C E B Top View Equivalent Circuit E Top View Pin-Out Ordering Information (Note 4) Product DXT696BK-13 Notes: Package TO252 (DPAK) Marking DXT696B Reel size (inches) 13 Tape width (mm) 16 Quantity per reel 2,500 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free,"Green" and Lead-Free. 3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html Marking Information DXT696B YYWW DXT696BK Document number: DS36574 Rev. 1 - 2 = Manufacturers’ code marking DXT 696B = Product Type Marking Code YYWW = Date Code Marking YY = Last Digit of Year, (ex: 13 = 2013) WW = Week Code 01 - 52 1 of 7 www.diodes.com December 2013 © Diodes Incorporated DXT696BK Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Peak Base Current Symbol VCBO VCEO VEBO IC ICM IBM Value 180 180 7 0.5 1 0.5 Unit V V V A A A Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Power Dissipation Thermal Resistance, Junction to Ambient Air Thermal Resistance, Junction to Leads Thermal Resistance, Junction to Case Operating and Storage Temperature Range Symbol (Note 5) (Note 6) (Note 7) (Note 5) (Note 6) (Note 7) (Note 8) (Note 9) PD RθJA RθJL RθJC TJ, TSTG Value 3.9 2.1 1.6 32 59 80 8.4 14.6 -55 to +150 Unit W C/W C ESD Ratings (Note 10) Characteristic Electrostatic Discharge - Human Body Model Electrostatic Discharge - Machine Model Notes: Symbol ESD HBM ESD MM Value 4,000 400 Unit V V JEDEC Class 3A C 5. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except mounted on minimum recommended pad (MRP) layout. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Thermal resistance from junction to the top of the case. 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. DXT696BK Document number: DS36574 Rev. 1 - 2 2 of 7 www.diodes.com December 2013 © Diodes Incorporated DXT696BK 1 DC 1s 100m 100ms 10ms 1ms 100µs 25mm x 25mm 1oz FR4 1 1 DC 10 100ms 10ms 10m 100 50mm x 50mm 2oz FR4 10 50 40 Safe Operating Area D=0.5 30 20 D=0.2 Single Pulse 10 0 100µ D=0.05 D=0.1 1m 10m 100m 1 10 100 1k Pulse Width (s) Single Pulse T amb=25°C 50mm x 50mm 2oz FR4 10 25mm x 25mm 1oz FR4 1 100µ 1m 10m 100m 1 10 100 Pulse Width (s) 50mm x 50mm 2oz FR4 20 D=0.5 10 D=0.2 Document number: DS36574 Rev. 1 - 2 Single Pulse D=0.05 0 100µ D=0.1 1m 10m 100m 1 10 100 1k Pulse Width (s) 1k 4.0 3.5 50mm x 50mm 2oz FR4 3.0 25mm x 25mm 1oz FR4 2.5 2.0 1.5 1.0 0.5 0.0 Pulse Power Dissipation DXT696BK T amb=25°C 30 Transient Thermal Impedance Max Power Dissipation (W) Max Power Dissipation (W) Transient Thermal Impedance 100 100 VCE Collector-Emitter Voltage (V) Thermal Resistance (°C/W) Thermal Resistance (°C/W) T amb=25°C 100µs 1 Safe Operating Area 25mm x 25mm 1oz FR4 1ms T amb=25°C VCE Collector-Emitter Voltage (V) 60 1s 100m Tamb=25°C 10m IC Collector Current (A) IC Collector Current (A) Thermal Characteristics and Derating Information 0 20 40 60 80 100 120 140 160 Temperature (°C) Derating Curve 3 of 7 www.diodes.com December 2013 © Diodes Incorporated DXT696BK Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Symbol Min Typ Max Unit Collector-Base Breakdown Voltage Characteristic BVCBO 180 — — V Test Condition Collector-Emitter Breakdown Voltage (Note 11) BVCEO 180 — — V IC = 1mA Emitter-Base Breakdown Voltage BVEBO 7 — — V IE = 100µA IC = 100µA Collector-Base Cutoff Current ICBO — — 100 nA VCB = 140V Emitter Cutoff Current IEBO — — 100 nA VEB = 5V DC Current Gain (Note 11) hFE 500 150 — — — — Collector-Emitter Saturation Voltage (Note 11) VCE(sat) — — — — — — 200 200 250 Base-Emitter Saturation Voltage (Note 11) VBE(sat) — — 900 mV IC = 200mA, IB = 5mA Base-Emitter Turn-On Voltage (Note 11) VBE(on) — — 900 mV IC = 200mA, VCE = 5V Cibo — 200 — pF VEB = 0.5V, f = 1MHz 6 — pF VCE = 10V, f = 1MHz Input Capacitance Output Capacitance IC = 100mA, VCE = 5V IC = 200mA, VCE = 5V mV Cobo — Current Gain-Bandwidth Product fT 70 — — MHz Turn-On Time ton — 80 — ns Turn-Off Time toff — 4,400 — ns Note: IC = 50mA, IB = 0.5mA Ic = 100mA, IB = 2.0mA IC = 200mA, IB = 5.0mA VCE = 5V, IC = 50mA, f=50MHz VCC = 50V, IC = 100mA IB1 = -IB2 = 10mA 11. Measured under pulsed conditions. Pulse width ≤ 300 µs. Duty cycle ≤ 2%. DXT696BK Document number: DS36574 Rev. 1 - 2 4 of 7 www.diodes.com December 2013 © Diodes Incorporated DXT696BK Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.) DXT696BK Document number: DS36574 Rev. 1 - 2 5 of 7 www.diodes.com December 2013 © Diodes Incorporated DXT696BK Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. E TO252 Dim Min Max Typ A 2.19 2.39 2.29 A1 0.00 0.13 0.08 A2 0.97 1.17 1.07 b 0.64 0.88 0.783 b2 0.76 1.14 0.95 b3 5.21 5.46 5.33 c2 0.45 0.58 0.531 D 6.00 6.20 6.10 D1 5.21 e 2.286 E 6.45 6.70 6.58 E1 4.32 H 9.40 10.41 9.91 L 1.40 1.78 1.59 L3 0.88 1.27 1.08 L4 0.64 1.02 0.83 a 0° 10° All Dimensions in mm A b3 c2 L3 A2 D E1 H L4 A1 L e 2X b2 3X b a Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. X2 Y2 C Y1 X1 Z Dimensions Z X1 X2 Y1 Y2 C E1 Value (in mm) 11.6 1.5 7.0 2.5 7.0 6.9 2.3 E1 Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device Terminals and PCB tracking. DXT696BK Document number: DS36574 Rev. 1 - 2 6 of 7 www.diodes.com December 2013 © Diodes Incorporated DXT696BK IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 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