Data Sheet - Diodes Incorporated

A Product Line of
Diodes Incorporated
FCX591
60V PNP MEDIUM POWER TRANSISTOR IN SOT89
Features
Mechanical Data
•
BVCEO > -60V
•
•
IC = -1A high Continuous Collector Current
•
•
ICM = -2A Peak Collector Current
•
•
RCE(SAT) = 295mΩ for a Low Equivalent On-Resistance
hFE characterized up to 2A for high current gain hold up
•
Complementary NPN type: FCX491
•
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Case: SOT89
Case Material: Molded Plastic. “Green” Molding Compound
UL Flammability Rating 94V-0
•
•
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
•
Weight: 0.05 grams (Approximate)
SOT89
C
E
B
C
C
B
E
Top View
Top View
Pin Out
Device Symbol
Ordering Information (Note 4)
Product
FCX591TA
Notes:
Marking
P1
Reel size (inches)
7
Tape width (mm)
12
Quantity per reel
1,000
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
P1
FCX591
Datasheet Number: DS33061 Rev. 4 - 2
P1 = Product Type Marking Code
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A Product Line of
Diodes Incorporated
FCX591
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
Limit
-80
-60
-7
-1
-2
-200
Unit
V
V
V
A
A
mA
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Symbol
(Note 5)
(Note 6)
(Note 7)
(Note 5)
(Note 6)
(Note 7)
Thermal Resistance, Junction to Lead
(Note 8)
Thermal Resistance, Junction to Case
(Note 9)
Operating and Storage Temperature Range
Value
Unit
1
1.5
2.0
125
83
60
PD
RθJA
W
°C/W
22
RθJL
RθJC
16
TJ, TSTG
-65 to +150
°C
ESD Ratings (Note 10)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Notes:
Symbol
ESD HBM
ESD MM
Value
4,000
400
Unit
V
V
JEDEC Class
3A
C
5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured
under still air conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.
7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
9. Thermal resistance from junction to the top of the case.
10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
FCX591
Datasheet Number: DS33061 Rev. 4 - 2
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A Product Line of
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FCX591
1.0
Thermal Resistance (°C/W)
Max Power Dissipation (W)
Thermal Characteristics and Derating Information
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Temperature (°C)
120
100
80
D=0.5
60
40
Single Pulse
D=0.2
D=0.05
20
0
100µ
D=0.1
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
Derating Curve
Max Power Dissipation (W)
100
Single Pulse. T amb=25°C
10
1
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
140.0
3
T amb=25°C
120.0
100.0
80.0
1oz copper
60.0
40.0
2oz copper
0
500
1000
1500
2000
Copper Area (sqmm)
FCX591
Datasheet Number: DS33061 Rev. 4 - 2
2500
Maximum Power (W)
Thermal Resistance (°C/W)
Pulse Power Dissipation
2oz copper
2
1oz copper
1
0
Tamb=25°C
0
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500
1000
1500
2000
Copper Area (sqmm)
2500
February 2014
© Diodes Incorporated
A Product Line of
Diodes Incorporated
FCX591
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Symbol
Min
Typ
Max
Unit
Collector-Base Breakdown Voltage
Characteristic
BVCBO
-80
—
—
V
Test Condition
Collector-Emitter Breakdown Voltage (Note 11)
BVCEO
-60
—
—
V
IC = -10mA, IB = 0
Emitter-Base Breakdown Voltage
BVEBO
-7
-8.1
—
V
IE = -100µA, IC = 0
IC = -100µA, IE = 0
Collector Cutoff Current
ICBO
—
<1
-100
nA
VCB = -60V
Emitter Cutoff Current
IEBO
—
<1
-100
nA
VEB = -5.6V, IC = 0
Emitter Cutoff Current
ICES
—
<1
-100
nA
VCES = -60V
hFE
100
100
80
15
220
175
155
40
—
—
300
—
—
IC = -1mA, VCE = -5V
IC = -500mA, VCE = -5V
IC = -1A, VCE = -5V
IC = -2A, VCE = -5V
Collector-Emitter Saturation Voltage (Note 11)
VCE(sat)
—
-155
-295
-300
-600
mV
IC = -500mA, IB = -50mA
IC = -1A, IB = -100mA
Base-Emitter Saturation Voltage (Note 11)
VBE(sat)
—
-965
-1200
mV
IC = -1A, IB = -100mA
Base-Emitter Turn-on Voltage (Note 11)
VBE(on)
—
-830
-1000
mV
IC = -1A, VCE = -5V
fT
150
—
—
MHz
IE = -50mA, VCE = -10V
f = 100MHz
Cobo
—
—
10
pF
VCB = -10V, f = 1MHz,
DC current transfer Static ratio (Note 11)
Transitional Frequency
Output capacitance
Note:
11. Measured under pulsed conditions. Pulse width ≤ 300μs. Duty cycle ≤ 2%.
FCX591
Datasheet Number: DS33061 Rev. 4 - 2
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A Product Line of
Diodes Incorporated
FCX591
Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
FCX591
Datasheet Number: DS33061 Rev. 4 - 2
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A Product Line of
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FCX591
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D1
0
.20
R0
C
1
SOT89
Dim
Min
Max
A
1.40
1.60
B
0.44
0.62
B1
0.35
0.54
C
0.35
0.44
D
4.40
4.60
D1
1.62
1.83
E
2.29
2.60
e
1.50 Typ
H
3.94
4.25
H1
2.63
2.93
L
0.89
1.20
All Dimensions in mm
H
H
E
B1
L
B
e
8° (4X)
A
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
X2 (2x)
Y1
Y3
Y4
Y2
Y
C
Dimensions Value (in mm)
X
0.900
X1
1.733
X2
0.416
Y
1.300
Y1
4.600
Y2
1.475
Y3
0.950
Y4
1.125
C
1.500
X (3x)
FCX591
Datasheet Number: DS33061 Rev. 4 - 2
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FCX591
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
FCX591
Datasheet Number: DS33061 Rev. 4 - 2
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February 2014
© Diodes Incorporated