パッケージの体系/形状/構造

/
/
1.
2.
3.
DB81-10002-2
1
/
/
1.
1.
,
,
PGA
2
SOP
TSOP I
TSOP II
LSSOP
TSSOP
4
QFP
LQFP
TQFP
UQFP
HQFP
4
QFN
BGA
FBGA
SPGA
2
2
DTP
4
QTP
DB81-10002-2
/
/
1.
(mm)
PGA
Pin Grid Array Package
SOP
Small Outline Package (
Small Outline L-Leaded Package
SSOP
Shrink Small Outline L-Leaded Package
0.65/0.80/1.00
TSOP (1)
Thin Small Outline L-Leaded Package (1)
0.50/0.55/0.60
TSOP (2)
Thin Small Outline L-Leaded Package (2)
0.50/0.80/1.00/1.27
SON
Small Outline Non-Leaded Package
QFP
Quad Flat Package (
Quad Flat L-Leaded Package
LQFP *
1.27/2.54
)
0.50/1.00
)
Low-Profile Quad Flat L-Leaded Package
TQFP
Thin Quad Flat L-Leaded Package
HQFP
QFP with Heat Sink
LCC *
Leadless Chip Carrier
1.27
0.40/0.50/0.65/0.80/1.00
0.40/0.50/0.65/0.80
0.40/0.50
0.40/0.50/0.65
1.016/1.27
QFN
Quad Flat Non-Leaded Package
BGA
Ball Grid Array
FBGA
Fine pitch Ball Grid Array
0.8/0.75/0.65/0.5
DTP
Dual Tape Carrier Package
⎯
QTP
Quad Tape Carrier Package
⎯
1.27/1.0
*
DB81-10002-2
3
/
/
2.
2.
,
:
:
,
1
PGA
: 2.54mm
,
,
, 64
,
,
,
1.27mm
2
SOP
SOL *
: 1.27mm
2
,
(L
)
,
JEDEC
SOL
QFP
4
1.00mm
0.80mm
0.65mm
,
(L
SSOP
LQFP *
)
SOP, QFP
,
,
(
)
SSOP : 0.65mm/0.80mm/
1.00mm
LQFP : 0.40mm/0.50mm
*:
(
4
)
DB81-10002-2
/
/
2.
TSOP
TQFP
SOP, QFP
: 1.27mmMAX)
LCC
QFN
DTP
QTP
TSOP : 0.50mm/0.55mm/
0.60mm
TQFP : 0.40mm/0.50mm
(
: 1.27mm
LCC
1.016mm, 0.635mm
,
0.50
TAB
IC
,
0.15mm
,
TAB
160-01
JAPAN
,
35mm,
48mm, 70mm
BGA
3
BGA
(
)
1.00mm
1.27mm
BGA
• E-BGA
• T-BGA
• FC-BGA
FBGA
DB81-10002-2
BGA
0.5mm
0.65mm
0.75mm
0.8mm
5
/
/
3.
3.
3.1
PGA (
)
(
)
(
(
)
)
(
(
)
)
Au
FBGA
Au
BGA (
)
Au
6
DB81-10002-2
/
/
3.
BGA (
)
Au
LCC (BCC
)
Au
Au
Pd/Ni/Pd
QFP
Au
(Fe-Ni
or Cu
)
(Cu)
(Cu)
Sn
DB81-10002-2
7
/
/
3.
3.2
IC
(
)
1
Ag
Ag
,
,
F
,
JAPAN
MBXXXX
LSI
,
(
8
)
DB81-10002-2
/
/
3.
BGA
IC
,
IC
,
,
, IC
,
(
DB81-10002-2
)
9
/
/
3.
3.3
Al2O3 90
95
Al2O3
,
PbO, B2O3, SiO2, Al2O3
,
,
,
,
Kovar (
Fe, Ni, Co
)
,
Fe, Ni
42 alloy
,
(42 %Ni)
,
Cu (
Cu
)
(Cu-Ni-Sn
)
,
,
,
Cu
CuMo
, Cu
(
)
,
W(
)
,
Ag (
)
Ag
,
Ag
Al (
(Ultra Sonic Type)
)
,
Al
Au (
,
Al
(Nailhead Type)
)
,
Au
Sn (
Sn
AuSn (20 %Sn)
)
,
Pb-Sn (
Pb-Sn
)
Pb-Sn
)
(
,
,
Sn-Bi (
Sn-Ag-Cu (
,
)
, BGA
)
TCP
,
10
,
,
DB81-10002-2
/
/
3.
■
,
,
,
,
,
,
, 2000
10
(1)
QFP
Sn-Bi
BGA
Sn-AgCu
(
)
,
(2)
,
,
10
20 °C
,
(3)
E1
E1
(
DB81-10002-2
)
11