/ / 1. 2. 3. DB81-10002-2 1 / / 1. 1. , , PGA 2 SOP TSOP I TSOP II LSSOP TSSOP 4 QFP LQFP TQFP UQFP HQFP 4 QFN BGA FBGA SPGA 2 2 DTP 4 QTP DB81-10002-2 / / 1. (mm) PGA Pin Grid Array Package SOP Small Outline Package ( Small Outline L-Leaded Package SSOP Shrink Small Outline L-Leaded Package 0.65/0.80/1.00 TSOP (1) Thin Small Outline L-Leaded Package (1) 0.50/0.55/0.60 TSOP (2) Thin Small Outline L-Leaded Package (2) 0.50/0.80/1.00/1.27 SON Small Outline Non-Leaded Package QFP Quad Flat Package ( Quad Flat L-Leaded Package LQFP * 1.27/2.54 ) 0.50/1.00 ) Low-Profile Quad Flat L-Leaded Package TQFP Thin Quad Flat L-Leaded Package HQFP QFP with Heat Sink LCC * Leadless Chip Carrier 1.27 0.40/0.50/0.65/0.80/1.00 0.40/0.50/0.65/0.80 0.40/0.50 0.40/0.50/0.65 1.016/1.27 QFN Quad Flat Non-Leaded Package BGA Ball Grid Array FBGA Fine pitch Ball Grid Array 0.8/0.75/0.65/0.5 DTP Dual Tape Carrier Package ⎯ QTP Quad Tape Carrier Package ⎯ 1.27/1.0 * DB81-10002-2 3 / / 2. 2. , : : , 1 PGA : 2.54mm , , , 64 , , , 1.27mm 2 SOP SOL * : 1.27mm 2 , (L ) , JEDEC SOL QFP 4 1.00mm 0.80mm 0.65mm , (L SSOP LQFP * ) SOP, QFP , , ( ) SSOP : 0.65mm/0.80mm/ 1.00mm LQFP : 0.40mm/0.50mm *: ( 4 ) DB81-10002-2 / / 2. TSOP TQFP SOP, QFP : 1.27mmMAX) LCC QFN DTP QTP TSOP : 0.50mm/0.55mm/ 0.60mm TQFP : 0.40mm/0.50mm ( : 1.27mm LCC 1.016mm, 0.635mm , 0.50 TAB IC , 0.15mm , TAB 160-01 JAPAN , 35mm, 48mm, 70mm BGA 3 BGA ( ) 1.00mm 1.27mm BGA • E-BGA • T-BGA • FC-BGA FBGA DB81-10002-2 BGA 0.5mm 0.65mm 0.75mm 0.8mm 5 / / 3. 3. 3.1 PGA ( ) ( ) ( ( ) ) ( ( ) ) Au FBGA Au BGA ( ) Au 6 DB81-10002-2 / / 3. BGA ( ) Au LCC (BCC ) Au Au Pd/Ni/Pd QFP Au (Fe-Ni or Cu ) (Cu) (Cu) Sn DB81-10002-2 7 / / 3. 3.2 IC ( ) 1 Ag Ag , , F , JAPAN MBXXXX LSI , ( 8 ) DB81-10002-2 / / 3. BGA IC , IC , , , IC , ( DB81-10002-2 ) 9 / / 3. 3.3 Al2O3 90 95 Al2O3 , PbO, B2O3, SiO2, Al2O3 , , , , Kovar ( Fe, Ni, Co ) , Fe, Ni 42 alloy , (42 %Ni) , Cu ( Cu ) (Cu-Ni-Sn ) , , , Cu CuMo , Cu ( ) , W( ) , Ag ( ) Ag , Ag Al ( (Ultra Sonic Type) ) , Al Au ( , Al (Nailhead Type) ) , Au Sn ( Sn AuSn (20 %Sn) ) , Pb-Sn ( Pb-Sn ) Pb-Sn ) ( , , Sn-Bi ( Sn-Ag-Cu ( , ) , BGA ) TCP , 10 , , DB81-10002-2 / / 3. ■ , , , , , , , 2000 10 (1) QFP Sn-Bi BGA Sn-AgCu ( ) , (2) , , 10 20 °C , (3) E1 E1 ( DB81-10002-2 ) 11