FAIRCHILD 74LVT16245GX

Revised June 2005
74LVT16245 • 74LVTH16245
Low Voltage 16-Bit Transceiver with 3-STATE Outputs
General Description
Features
The LVT16245 and LVTH16245 contain sixteen non-inverting bidirectional buffers with 3-STATE outputs and is
intended for bus oriented applications. The device is byte
controlled. Each byte has separate control inputs which
can be shorted together for full 16-bit operation. The T/R
inputs determine the direction of data flow through the
device. The OE inputs disable both the A and B ports by
placing them in a high impedance state.
■ Input and output interface capability to systems at
5V VCC
The LVTH16245 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These non-inverting transceivers are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT16245
and LVTH16245 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16245),
also available without bushold feature (74LVT16245).
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink 32 mA/64 mA
■ Functionally compatible with the 74 series 16245
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human-body model !2000V
Machine model !200V
Charged-device !1000V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Order Number
74LVT16245GX
(Note 1)
Package
Number
BGA54A
(Preliminary)
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
74LVT16245MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16245MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16245GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
74LVTH16245MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16245MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 1: BGA package available in Tape and Reel only.
Note 2: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
© 2005 Fairchild Semiconductor Corporation
DS500152
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74LVT16245 • 74LVTH16245 Low Voltage 16-Bit Transceiver with 3-STATE Outputs
January 1999
74LVT16245 • 74LVTH16245
Connection Diagrams
Pin Descriptions
Pin Assignment for SSOP and TSSOP
Pin Names
Description
OEn
Output Enable Input (Active LOW)
T/Rn
Transmit/Receive Input
A0–A15
Side A Inputs/3-STATE Outputs
B0–B15
Side B Inputs/3-STATE Outputs
NC
No Connect
FBGA Pin Assignments
1
2
3
4
5
6
A
B0
NC
T/R1
OE1
NC
A0
B
B2
B1
NC
NC
A1
A2
C
B4
B3
VCC
VCC
A3
A4
D
B6
B5
GND
GND
A5
A6
E
B8
B7
GND
GND
A7
A8
F
B10
B9
GND
GND
A9
A10
G
B12
B11
VCC
VCC
A11
A12
H
B14
B13
NC
NC
A13
A14
J
B15
NC
T/R2
OE2
NC
A15
Truth Tables
Inputs
Pin Assignment for FBGA
OE1
T/R1
Outputs
L
L
Bus B0–B7 Data to Bus A0–A7
L
H
Bus A0–A7 Data to Bus B0–B7
H
X
HIGH–Z State on A0–A7,B0–B7
Inputs
OE2
2
Outputs
L
L
Bus B8–B15 Data to Bus A8–A15
L
H
Bus A8–A15 Data to Bus B8–B15
H
X
HIGH–Z State on A8–A15,B8–B15
H HIGH Voltage Level
L LOW Voltage Level
X Immaterial
Z High Impedance
(Top Thru View)
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T/R2
The LVT16245 and LVTH16245 contain sixteen non-inverting bidirectional buffers with 3-STATE outputs. The device is byte
controlled with each byte functioning identically, but independent of the other. The control pins can be shorted together to
obtain full 16-bit operation.
Logic Diagrams
Note: Please note that these diagrams are provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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74LVT16245 • 74LVTH16245
Functional Description
74LVT16245 • 74LVTH16245
Absolute Maximum Ratings(Note 3)
Symbol
Parameter
VCC
Supply Voltage
VI
DC Input Voltage
VO
Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Current
Value
Conditions
0.5 to 4.6
0.5 to 7.0
0.5 to 7.0
0.5 to 7.0
50
50
ICC
DC Supply Current per Supply Pin
IGND
DC Ground Current per Ground Pin
TSTG
Storage Temperature Range
Units
V
V
Output in 3-STATE
V
Output in HIGH or LOW State (Note 4)
VI GND
mA
VO GND
mA
64
Output at HIGH State, VO ! VCC
128
Output at LOW State, VO ! VCC
mA
r64
r128
65 to 150
mA
mA
qC
Recommended Operating Conditions
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
Min
Max
2.7
3.6
Units
V
0
5.5
V
IOH
HIGH-Level Output Current
32
mA
IOL
LOW-Level Output Current
64
mA
TA
Free-Air Operating Temperature
't/'V
Input Edge Rate, VIN
0.8V–2.0V, VCC
3.0V
40
85
qC
0
10
ns/V
Note 3: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
Note 4: IO Absolute Maximum Ratings must be observed.
DC Electrical Characteristics
Symbol
VIK
Input Clamp Diode Voltage
TA
VCC
Parameter
(V)
40qC to 85qC
Min
VIH
Input HIGH Voltage
2.7–3.6
VIL
Input LOW Voltage
2.7–3.6
VOH
Output HIGH Voltage
2.7–3.6
VCC 0.2
2.7
2.4
3.0
2.0
VOL
II(HOLD)
Output LOW Voltage
Bushold Input Over-Drive
(Note 5)
Current to Change State
II
Input Current
Data Pins
Power Off Leakage Current
IPU/PD
Power Up/Down 3-STATE
Output Current
Units
II
V
VO d 0.1V or
V
VO t VCC 0.1V
V
2.7
0.5
3.0
0.4
3.0
3.0
Conditions
18 mA
V
0.2
IOH
100 PA
IOH
8 mA
IOH
32 mA
IOL
100 PA
IOL
24 mA
IOL
16 mA
0.5
IOL
32 mA
0.55
IOL
75
V
PA
75
500
3.0
Control Pins
IOFF
0.8
3.0
(Note 5)
II(OD)
2.0
2.7
Bushold Input Minimum Drive
Max
1.2
2.7
PA
500
64 mA
VI
0.8V
VI
2.0V
(Note 6)
(Note 7)
3.6
10
VI
5.5V
3.6
r1
VI
0V or VCC
VI
0V
VI
VCC
5
3.6
PA
1
0
r100
PA
0–1.5
r100
PA
0V d VI or VO d 5.5V
VO
VI
0.5V to 3.0V
GND or VCC
IOZL
3-STATE Output Leakage Current
3.6
5
PA
VO
0.5V
IOZL
3-STATE Output Leakage Current
3.6
5
PA
VO
0.0V
(Note 5)
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Symbol
74LVT16245 • 74LVTH16245
DC Electrical Characteristics
(Continued)
VCC
Parameter
TA
(V)
40qC to 85qC
Min
Units
Conditions
Max
IOZH
3-STATE Output Leakage Current
3.6
5
PA
VO
3.0V
IOZH
3-STATE Output Leakage Current
3.6
5
PA
VO
3.6V
(Note 5)
IOZH
3-STATE Output Leakage Current
3.6
10
PA
VCC VO d 5.5V
ICCH
Power Supply Current
3.6
0.19
mA
Outputs HIGH
ICCL
Power Supply Current
3.6
5.0
mA
Outputs LOW
ICCZ
Power Supply Current
3.6
0.19
mA
Outputs Disabled
ICCZ
Power Supply Current
3.6
0.19
mA
VCC d VO d 5.5V,
Outputs Disabled
'ICC
Increase in Power Supply Current
3.6
0.2
One Input at VCC 0.6V
mA
Other Inputs at VCC or GND
(Note 8)
Note 5: Applies to bushold versions only (74LVTH16245).
Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
Note 8: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics
Symbol
(Note 9)
VCC
Parameter
(V)
25qC
TA
Min
Typ
Conditions
Units
Max
CL
500:
50 pF, RL
VOLP
Quiet Output Maximum Dynamic VOL
3.3
0.8
V
(Note 10)
VOLV
Quiet Output Minimum Dynamic VOL
3.3
0.8
V
(Note 10)
Note 9: Characterized in SSOP package. Guaranteed parameter, but not tested.
Note 10: Max number of outputs defined as (n). n1 data inputs are driven 0V to 3V. Output under test held LOW.
AC Electrical Characteristics
TA
Symbol
tPLH
CL
Parameter
3.3V r 0.3V
Min
Max
Min
Max
1.5
3.5
1.5
3.9
1.3
3.5
1.3
3.9
1.5
4.5
1.5
5.3
1.6
5.3
1.6
6.9
2.3
5.4
2.3
6.1
2.2
5.1
2.2
5.4
Propagation Delay Data to Output
Output Enable Time
tPZL
tPHZ
Output Disable Time
tPLZ
tOSHL
Output to Output Skew
tOSLH
(Note 11)
500:
VCC
tPHL
tPZH
40qC to 85qC
50 pF, RL
VCC
1.0
2.7V
Units
ns
ns
ns
1.0
ns
Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design.
Capacitance
Symbol
(Note 12)
Parameter
Conditions
CIN
Input Capacitance
VCC
0V, VI
CI/O
Input/Output Capacitance
VCC
3.0V, VO
Note 12: Capacitance is measured at frequency f
0V or VCC
0V or VCC
Typical
Units
4
pF
8
pF
1 MHz, per MIL-STD-883, Method 3012.
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74LVT16245 • 74LVTH16245
Physical Dimensions inches (millimeters) unless otherwise noted
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
Package Number BGA54A
Preliminary
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6
74LVT16245 • 74LVTH16245
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
Package Number MS48A
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74LVT16245 • 74LVTH16245 Low Voltage 16-Bit Transceiver with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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