Glenair Interconnect Solutions Seminar Series Brochure

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June 2011
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Glenair Interconnect Solutions
Seminar Series
Free On-Site Technical Seminars from the Glenair Factory:
Hosted Lunch-and-Learns on Key Interconnect Design Topics—
From Weight Reduction and Miniaturization to EMI Filtering
© 2012 Glenair, Inc.
Spain
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Japan
Glenair Interconnect Solutions Seminar Series
The interconnect industry’s most
innovative engineering and design
team is just a phone call away—ready to
deliver the best technical seminar your
staff will attend this year.
Interconnect Seminar No. 3:
PROTECTING ELECTRONIC EQUIPMENT FROM
COSTLY ENVIRONMENTAL DAMAGE WITH
ADVANCED CONNECTOR SEALING TECHNOLOGIES
This in-depth seminar covers:
• Environmental connector
classes and duties
• Materials selection for
maximum durability
• Metal-to-glass hermetics
• Learn new ways to optimize interconnect system
performance—from size and weight reduction to
improved environmental sealing
• Take advantage of unprecedented face time with
Glenair’s application development and engineering
team
Interconnect Seminar No. 4:
• Walk away with all the samples, technical literature,
and design ideas necessary to solve your toughest
interconnect system challenges
This in-depth seminar covers:
Choose from the following eight seminars—or contact the
factory to arrange a session tailored to meet your exact
requirements.
Interconnect Seminar No. 1:
FAST, EFFECTIVE AND PROVEN SOLUTIONS TO
ELECTROMAGNETIC INTERFERENCE
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EMI/EMC Basics
EMC Design Strategies and Solutions
Cost Effective EMC Technologies
Connector Filtering as a Design Solution
EMP Connector and Box Solutions
DESIGN INNOVATIONS GUARANTEED TO ADVANCE
INTERCONNECT SYSTEM PERFORMANCE
Interconnect Seminar No. 5:
INTEGRATION OF ETHERNET AND OTHER
HIGH-SPEED DATA BUS PROTOCOLS IN
MISSION-CRITICAL APPLICATIONS
This survey-level seminar covers:
• Connector Miniaturization
• System Weight Reduction
• EMI Filtering and Shielding
• Advanced Environmental Sealing
• High-Speed Interconnections
Interconnect Seminar No. 2:
COST-EFFECTIVE SIZE AND WEIGHT REDUCTION
IN INTERCONNECT SYSTEMS
This in-depth seminar covers:
• Composite thermoplastics
• Micro-filament cable shield
termination processes and
technologies
• Connector Miniaturization
• Contact density
optimization
• Submersible/Marine solutions
• Accessory sealing solutions
• CBRN qualified components
This survey-level seminar covers:
• Data bus protocols
• High-speed MS circulars
• USB/RJ field solutions
Interconnect Seminar No. 6:
OPTIMIZING BANDWIDTH, SPEED AND SECURITY
WITH FIBER OPTIC TECHNOLOGIES
This in-depth seminar covers:
• Fiber optic data-link technology
• Singlemode vs. multimode
• Termini design protocols
• Fiber optic interconnect
system design
• Innovation in expandedbeam systems
• Alternatives to standard
ethernet connectors
• Optimizing contact/wire
performance
Interconnect Seminar No. 7:
DESIGNING PERFORMANCE INTO INTERCONNECT
CABLES—FROM THE GROUND UP
This in-depth seminar covers:
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Factors that impact cable design and construction
Strengths and weaknesses of available cable design options
Practical application checklist for cable designers
Glenair’s cable design, construction and testing capabilities
Interconnect Seminar No. 8:
TAKING ADVANTAGES OF THE STRENGTHS AND
WEAKNESSES OF COMPOSITE THERMOPLASTIC
INTERCONNECT SYSTEMS
This in-depth seminar covers:
• Composite thermoplastic
material science
• Weight savings and corrosion
resistance
• Composite thermoplastics and
lightning strike
• Qualifications and
performance benchmarks
• Next-generation composite
interconnect technologies
Contact your local Glenair sales group or visit www.glenair.com/
seminars for more information. Seminars are offered on-site
and/or at the Glenair factory.
Glenair, Inc. 1211 Air Way, Glendale, CA 91201
818-247-6000