IGBR www.vishay.com Vishay Electro-Films Thin Film, High Power Back-Contact Resistor FEATURES • • • • • • • Wire bondable Small size High power rating Single wire bond assembly Moisture resistant Case size 0202 to 0808 Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • • • • • The high power back-contact resistor (IGBR) series thin film chip resistor utilizes the excellent thermal properties of silicon to allow ultra high power rating with miniature case size for hybrid (chip and wire) assemblies. Gate resistor for IGBT based power converters Current limiting for LED lighting applications High power applications Alternative energy Hybrid assemblies TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES PARAMETER Total Resistance Range Standard Tolerances TCR VALUE 3 to 25 5, 10, 25 ± 500 UNIT % ppm/°C TCR (ppm/°C) BY CASE SIZE AND VALUE Case Size (mil) 20 x 20 n/a 40 x 40 n/a 60 x 60 500 400 300 80 x 80 450 350 300 3 500 5 400 8 10 400 300 300 250 250 200 250 15 200 20 22 25 Value (Ω) STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Operating Film Temperature Range Operating Temperature Range Working Voltage Breakdown Voltage Thermal Resistivity (1) DC Power Rating (1)(2) Load Life Stability, 1000 h, Film Temperature 200 °C Short Time Overload, 5 x Rated Power, 25 °C, 5 s Thermal Shock, MIL-STD-202, Method 107 F Moisture Resistance, MIL-STD-202, Method 106 (3) High Temperature Exposure, 100 h, +250 °C Low Temperature Operation, -65 °C, 45 min, 200 VDC VALUE 200 max. -55 to +125 75 max. 400 Down to 2 Up to 4 ± 1 R/R ± 0.25 R/R ± 1 R/R ± 0.25 R/R ± 0.5 R/R ± 0.5 R/R UNIT °C °C V V K/W W % % % % % % Notes (1) See table “Power Rating by Case Size”. (2) Power rating determined by application specific heat sink properties. Film temperature should not exceed 200 °C. See table “Power Rating by Case Size” for more details. (3) Aluminum pads and aluminum wire bonds are sensitive to high moisture environments. Adequate application level packaging is required to protect the components and wire bonds from moisture related damage. Revision: 03-Aug-15 Document Number: 61107 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 IGBR www.vishay.com Vishay Electro-Films POWER RATING BY CASE SIZE CHIP SIZE mil (mm) (2) BOND PAD SIZE mil (mm) DIE THICKNESS mm (mil) (2) TYPICAL R THERMAL (1) K/W R MIN. R MAX. 0202 20 x 20 (0.5 x 0.5) 10 x 16 (0.25 x 0.41) 10 (0.25) 10 15 25 0404 40 x 40 (1 x 1) 15 x 36 (0.38 x 0.91) 10 (0.25) 7 5 25 0606 60 x 60 (1.5 x 1.5) 20 x 56 (0.51 x 1.42) 10 (0.25) 5 3 25 0808 80 x 80 (2 x 2) 27 x 76 (0.69 x 1.93) 10 (0.25) 2 3 25 CASE SIZE Notes (1) Typical R thermal between film and back contact. Does not include die attach joint (epoxy or solder). (2) Dimension tolerances are ± 0.05 mm (± 2 mil). SCHEMATIC MATERIAL SPECIFICATIONS PARAMETER Chip Substrate Material Film Material Case Size Passivation Number of Pads Top Terminations Suitable for Heavy Gage Aluminum Wire-Bonding Back Termination (for epoxy, lead (Pb)-free solder or silver compression assembly) Oxidized silicon, 10 kÅ minimum SiO2 Tantalum Nitride See table “Power Rating by Case Size” None 1 Al (2.5 μm min.) TiW/Pd/Au or TiW/Ni/Au GLOBAL PART NUMBER INFORMATION Global Part Number: IGBRB3000CJOPCST Global Part Number Description: IGBR 1 mm 3 5 % 300 ppm/°C PD Commercial Tape I G B R B MODEL SIZE RESISTANCE () IGBR A = 20 x 20 B = 40 x 40 C = 60 x 60 D = 80 x 80 First 4 digits are significant figures of capacitance High power backcontact resistor Revision: 03-Aug-15 3 0 0 RESISTANCE MULTILPLIER CODE TOL. CODE (%) C = 0.001 B = 0.01 A = 0.1 F=1 J=5 K = 10 M = 20 L = 25 0 C J O P C S T TCR (ppm/°C) BACKSIDE TERMINATION VISUAL CLASS PACKAGING CODE J = ± 500 W = ± 350 O = ± 300 M = ± 250 P = TiW/Pd/Au N = TiW/Ni/Au C = commercial H = class H K = class K WS = waffle pack 100 min., 1 mult FW = full wafer (3") ST = diced on tape Document Number: 61107 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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