Datasheet

Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Part No.: E12LR2C-O
Features:
z Highest Flux Red
z High reliability and Very long operating life
(up to 100K hrs)
z Low voltage DC operated
z More Energy Efficient than Incandescent
and most Halogen lamps
z NO UV
z Superior ESD protection
A node(+)
Cath ODE(-)
z RoHS Compliant
Typical Applications:
z Reading lights (car, bus, aircraft)
z Portable (flashlight, bicycle)
z Automotive Exterior (Stop-Tail-Turn,
CHMSL, Mirror Side Repeat)
NOTE:
z Decorative
z
z
All dimensions are millimeters.
Tolerance is ±0.1mm unless noted
T a= 25 °C
IF = 3 5 0m A
D IR E C T IV IT Y
10
20
30
30
40
50
50
40
90
80
80
70
70
60
60
55
55
10 0% 90 %
80%
70 %
6 0% 50 %
40 %
30 %
20 %
10 %
0
10%
2 0%
30 %
40 %
5 0% 6 0%
7 0%
8 0%
90
Relative Luminous
00
10
20
90% 10 0%
R a dia tio n A n gle
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LED SPECIFICATION
Hebei I.T. (Shanghai) Co., Ltd.
Part No.: E12LR2C-O
Absolute maximum ratings(Ta = 25℃)
Value
Parameter
Symbol
Test
Condition
Unit
Min.
DC Forward Current
Peak Pulse Current
Power Dissipation
LED Junction Temperature
Operating Temperature
Storage Temperature
ESD Sensitivity
Soldering Temperature
IF
Ipeak
Pd
Tj
Topr
Tstr
-----
---Duty=0.1ms,1kHz
------------HBM
-----
Max.
----------
350
mA
500
mA
1.20
W
120
℃
-25
+100
℃
-40
+120
℃
8000
--V
260℃ for 5 Seconds max
Electrical and optical characteristics (Ta = 25℃)
Value
Parameter
Symbol
Forward Voltage
Luminous Flux
Viewing Angle
Viewing Angle
VF
Φv
2θ1/2-X
2θ1/2-Y
Dominant Wavelength
λd
Test
Condition
IF = 350mA
Unit
Min.
Typ.
Max.
---30
-------
2.6
40
110
160
3.5
----------
V
lm
Deg.
Deg
620
----
630
nm
Luminous Flux Bins(Ta = 25℃)Unit:lm
Bin
Min
Max
G
30
40
H
40
50
Note
1. Flux is measured with an accuracy of ±15%
2. CCT is measured with an accuracy of ± 200K
3. Forward Voltage is measured with an accuracy of ± 0.15V
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Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Heat Plate Soldering Condition
1. Soldering Process for Solder Paste
Use Solder Mask to print Solder Paste on MCPCB.
Place Emitter on MCPCB.
Put MCPCB on Heat Plate until Solder Paste melt. Put Emitter on MCPCB. Take the MCPCB out
The Solder Paste sould be melted within 10 seconds. from Heat Plate within 10 seconds.
Take out MCPCB out from Heat Plate within 10 seconds.
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Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
2. Soldering Process for Solder Wire
Put MCPCB on Heat Plate.
Place Solder Wire to the solder pad of MCPCB.
Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds.
.
.
.
● Heat plate temperature: 230°C max for Lead Solder and 260°C
max
for
Lead-Free Solder.
● When soldering, do not put stress on the LEDs during heating.
.
● After soldering, do not warp the circuit board.
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Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
3. Manual Hand Soldering
Place Themal Comductive Glue on the MCPCB
Place Emitter on the MCPCB
Use Soldering lron to solder the leads of Emtter within 5 seconds
.
● For prototype builds or small series production runs it possible to place and solder the
.
● Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
.
●
emitters by hand.
Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause a short
circuit in the array.
.
●
Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and
damage emitter.
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