LED SPECIFICATION Hebei I.T. (Shanghai) Co., Ltd. Part No.： E12LY9C-O Features： z High est Flux z High reliability and Very long operating life (up to 100K hrs) z Low voltage DC operated z More Energy Efficient than Incandescent and most Halogen lamps z NO UV z Superior ESD protection z RoHS Compliant A node(+) Cath ODE(-) Typical Applications： z Reading lights (car, bus, aircraft) z Portable (flashlight, bicycle) z Automotive Exterior (Stop-Tail-Turn, CHMSL, Mirror Side Repeat) NOTE: z Decorative z z All dimensions are millimeters. Tolerance is ±0.1mm unless noted D IR E C T IV IT Y 10 20 30 30 40 50 50 40 60 60 55 55 90 80 80 70 70 100% 90% 80% 70% 6 0 % 5 0% 40% 3 0% 20 % 10% 0 10% 20% 30% 40% 50 % 6 0% 70% 8 0% 90 Relative Luminous 00 10 20 T a= 2 5°C IF = 3 50m A 90 % 1 0 0 % R a d ia tio n An g le www.ledz.com 1/5 Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Part No.：E12LY9C-O Absolute maximum ratings（Ta = 25℃） Parameter Symbol Test Condition DC Forward Current Peak Pulse Current Power Dissipation LED Junction Temperature Operating Temperature Storage T emperature ESD Sensitivity Soldering Temperature IF Ipeak Pd Tj Topr Tstr ----- ---Duty=0.1mS，1kHz ------------HBM ---- Value Min. Max. Unit ---350 mA ---500 mA ---1.20 W ---120 ℃ -25 +100 ℃ -40 +120 ℃ 8000 --V 240℃ for 5 Seconds max Electrical and optical characteristics （Ta = 25℃） Parameter Symbol Forward Voltage Luminous Flux Viewing Angle Viewing Angle VF Φv 2θ1/2-X 2θ1/2-Y Dominant Wavelength λd Test Condition IF = 350mA Value Unit Min. Typ. Max. ---30 ------- 2.6 40 110 160 3.5 ---------- V lm Deg. Deg. 585 ---- 595 nm Luminous Flux Bins（Ta = 25℃）Unit: lm Bin Min Max G 30 40 H 40 50 Note 1． Flux is measured with an accuracy of ±15% 2． CCT is measured with an accuracy of ± 200K 3． Forward Voltage is measured with an accuracy of ± 0.15V www.ledz.com 2/5 Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION Heat Plate Soldering Condition 1. Soldering Process for Solder Paste Use Solder Mask to print Solder Paste on MCPCB. Place Emitter on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. Put Emitter on MCPCB. Take the MCPCB out The Solder Paste sould be melted within 10 seconds. from Heat Plate within 10 seconds. Take out MCPCB out from Heat Plate within 10 seconds. www.ledz.com 3/5 Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION 2. Soldering Process for Solder Wire Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. . . . ● Heat plate temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder. ● When soldering, do not put stress on the LEDs during heating. . ● After soldering, do not warp the circuit board. www.ledz.com 4/5 Hebei I.T. (Shanghai) Co., Ltd. LED SPECIFICATION 3. Manual Hand Soldering Place Themal Comductive Glue on the MCPCB Place Emitter on the MCPCB Use Soldering lron to solder the leads of Emtter within 5 seconds . ● For prototype builds or small series production runs it possible to place and solder the . ● Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder. . ● emitters by hand. Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause a short circuit in the array. . ● Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and damage emitter. www.ledz.com 5/5