GAU215P 15405 U i GAU215P‐15405 Universal Gate Drive Prototype Board lG t D i P t t B d Feature >Built in the isolated DC-DC converter for gate drive >Output peak current is +/-15A(max) >Built in short circuit protection >Electrical isolation voltage is 4000Vrms (for 1 minute) >Built Built in gate shut down speed control circuit (When short circuit protection work.) Size : 77 x 100 x 37.6t : 77 x 100 x 37.6t Image Photo Gate Driver : VLA574‐01R DCDC converter : VLA134‐15255 http://www.idc-com.co.jp Block diagram Block diagram DETECT VIN C1 LATCH TIMER INTER FACE IN1 FO GATE SHUT DOWN F.O. VD G1 E1 REGU‐ LATOR UVL REGU‐ LATOR UVL DC‐AC CONVERTER GND DC－AC CONVERTER DETECT LATCH INTER FACE IN2 TIMER GATE SHUT DOWN DOWN F.O. G2 E2 http://www.idc-com.co.jp MAXIMUM RATINGS (Unless otherwise noted, Ta=25deg C) Symbol Parameter Conditions Ratings Unit VD Supply voltage DC ‐1~16.5 V VI Input signal voltage Applied between VI+ ‐ IN1,2 50% Duty cycle , pulse width 1ms ‐1 ~ +7 V ‐15 A O t t Output peak current k t P l Pulse width 2us idth 2 15 A IOHP IOLP Viso Isolation voltage between input and output Isolation voltage between input and output for 1 minute 4000 Vrms Topr Operating temperature No condensation allowable ‐25 ~ 70 deg C Tstg Storage temperature No condensation allowable(*1) ‐40 ~ 100 deg C Idrive Gate drive current Gate average current (Per one circuit) 210 mA (*1) Differs from heat cycle condition ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25deg C, VD=15V) Symbol Parameter Conditions VD Supply voltage VIN Pull‐up voltage on input side IIH f Limits Unit Min Typ Max Recommended range 14.2 15 15.8 V Recommended range 4.75 5 5.25 V “H” input signal current(*2) Recommended range 10 13 16 mA Switching frequency Switching frequency Recommended range Recommended range ‐ ‐ 20 kHz RG Gate resistance Recommended range 0.51 ‐ ‐ ohm VOH “H” output voltage (*2) ‐ 14 15.3 16.5 V VOL “L” output voltage (*2) ‐ ‐5.5 ‐7 ‐11 V tPLH “L‐H” propagation time (*2) IIH = 13mA 0.2 0.4 1 μs tPHL “H‐L” propagation time (*2) IIH = 13mA 0.2 0.3 1 μs VSC SC detect voltage Collector voltage of module 15 ‐ ‐ V UVLO+_VCC Under voltage lock out (Operation start) Voltage of VCC 11.5 12.5 13.5 V UVLO‐_VCC Under voltage lock out (Operation stop) Voltage of VCC 10.5 11.5 12.7 V ((*2) 2) When LED of PC is ON, Vo is high. When LED of PC is ON Vo is high http://www.idc-com.co.jp INNER CIRCUIT Hic2 14 15 16 5 6 VD GND NC FO IN1 IN2 VIN 1 2 3 4 C1 1 2 3 4 CN4 Hic1 17 18 8 D3 + R2 C2 + 19 20 6 2 RG3 2 RG2 1 DZ1 RG4 G1 E1 7 2 13 14 PC2 C1 CN1 5 6 7 C5 C7 Hic4 HIC1,3 VLA574‐01R ISAHAYA HIC2,4 VLA134‐15255 ISAHAYA PC1,2 TLP785 compatible TOSHIBA D1,2 RP1H SANKEN D3,4 M1FS6 SHINDENGEN DZ1 2 DZ1,2 Vz=30V, over than 500mW Vz=30V over than 500mW RG Gate Resistor (*3) R1,2,3,4 4.7kΩ, 250mW CN1,2,3 5273‐02A MOLEX CN4 5045‐07A MOLEX C1,2,3,4 470uF,50V ( Low impedance) C5,6,7,8 Refer to (*4) , , , ( ) 1 D1 1 RG1 5 CN3 3 4 PC1 PC1 R1 5 6 1 2 3 4 D2 14 15 16 Hic3 4 C3 17 18 19 20 8 PC2 R3 D4 + R4 3 C4 1 + 6 5 RG5 1 RG6 13 14 CN2 RG7 RG8 DZ2 7 2 C6 C8 *3) Gate Resistor is not installed at the time of shipment. Please solder the chosen resistor. *4) C5,6,7,8 is not installed at the time of shipment. Please solder the chosen condenser if needed. (50V,ceramic) http://www.idc-com.co.jp 2 G2 E2 APPLICATION EXAMPLE Hi 2 Hic2 15V 5V 4.7k ohm RC filter ~10us CN4 VD GND NC FO IN1 IN2 VIN Input Signal p g GND 5 6 1 2 3 4 14 15 16 Hic1 4 D3 R2 C2 D1 C1 1 + 5 6 7 2 13 14 PC2 P CN3 3 19 20 PC1 PC1 R1 + C1 17 18 8 RG1 RG3 RG2 RG4 CN1 DZ1 G1 E1 C5 C7 HC04 etc. U or V or W GND Hic4 14 15 16 5 6 1 17 2 18 3 4 19 20 ※When you confirm the gate output without connecting IGBT, please invalidate a short‐circuit p ease a date a s o t c cu t protection. If connect resistance of 4.7k ohm between the C1(E1) and E1(E2), the short circuit protection becomes invalid. D2 Hic3 4 C3 8 PC2 R3 D4 + R4 3 C4 1 + 6 13 14 5 7 2 RG5 RG7 RG6 RG8 C6 C8 CN2 G2 DZ2 E2 N http://www.idc-com.co.jp Dimension : mm Part arrangement & Size Gate Resistor (RG1～4) G t R i t (RG1 4) (This part is not installed at the time of shipment) SScrew hole h l 4 ‐ Φ3.5 Gate driver VLA574‐01R DC‐DC converter C C co e e CONNECTOR 5 CONNECTOR 7 77 VLA134‐15255 100 5 http://www.idc-com.co.jp FOR SAFETY USING Great detail and careful attention are g given to the p production activity y of devices,, such as the development, p , the q quality y of p production,, and in it’s reliability. However the reliability of devices depends not only on their own factors but also in their condition of usage. When handle the devices, please note the following cautions. CAUTIONS Packing The materials used in packing devices can only withstand normal external conditions. When exposed to outside shocks, rain and certain environmental contaminators, the packing materials will deteriorates. Please take care in handling. Carrying 1) 2) 3) 4) 5) Storage When storing the devices, please observe the following notices or possible deterioration of their electrical characteristics, risk of solderability, and external damage may occur. 1) Devices must be stored where fluctuation of temperature and humidity is minimal minimal, and must not be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius with humidity at 40 to 60%. 1) Avoid locations where corrosive gasses are generated or where much dust accumulates. 2) Storage cases must be static proof. 3) Avoid putting weight on boxes. Extended storage When extended storage is necessary, the devices must be kept non-processed. When using devices which have been stored for more than one year or under severe conditions, be sure to check that the exterior is free from flaw and other damages. Maximum ratings To prevent any electrical damages, use devices within the maximum ratings. The temperature, current, voltage, etc. must not exceed these conditions. Polarity To protect devices from destruction and deterioration due to wrong insertion, make sure of polarity in inserting leads into the board holes, conforming to the external view for the terminal arrangement. Don’t stack boxes too high. Avoid placing heavy materials on boxes. Boxes must be positioned correctly during transportation to avoid breakage. Don't throw or drop boxes. K Keep bboxes ddry. A Avoid id rain i or snow. Minimal vibration and shock during transportation is desirable. http://www.idc-com.co.jp Keep safety first in your circuit designs! ・ISAHAYA Electronics Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (1)placement of substitutive, auxiliary circuits, (2)use of non-flammable material or ( ) (3)prevention against any malfunction f or mishap. 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