HD74ALVC2G53 2-channel Analog Multiplexer Demultiplexer REJ03D0168–0400Z (Previous ADE-205-636C (Z)) Rev.4.00 Dec.18.2003 Description The HD74ALVC2G53 has 2-channel analog multiplexer / demultiplexer in an 8 pin package. Applications include signal gating, chopping, modulation, or demodulation (modem), and signal multiplexing for analog to digital and digital to analog conversion systems. Low voltage and high-speed operation is suitable for the battery powered products (e.g., notebook computers), and the low power consumption extends the battery life. Features • The basic gate function is lined up as Renesas uni logic series. • Supplied on emboss taping for high-speed automatic mounting. • Supply voltage range : 1.2 to 3.6 V Operating temperature range: −40 to +85°C • All control input VIH (Max.) = 3.6 V (@VCC = 0 V to 3.6 V) • Ordering Information Part Name Package Type Package Code Package Abbreviation Taping Abbreviation (Quantity) HD74ALVC2G53USE SSOP-8 pin TTP-8DBV US E (3,000 pcs/reel) Rev.4.00, Dec.18.2003, page 1 of 13 HD74ALVC2G53 Outline and Article Indication • HD74ALVC2G53 Index band Lot No. Y M W A 5 3 Y : Year code (the last digit of year) M : Month code W : Week code SSOP-8 Marking Function Table Control inputs INH A On channel H X None L H Y1 L L Y0 H: L: X: High level Low level Immaterial Rev.4.00, Dec.18.2003, page 2 of 13 HD74ALVC2G53 Pin Arrangement COM 1 INH 2 O GND 3 O GND 4 (Top view) Rev.4.00, Dec.18.2003, page 3 of 13 C C 8 VCC I 7 Y0 I 6 Y1 5 A HD74ALVC2G53 Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage range VCC −0.5 to 4.6 V Input voltage range *1 VI −0.5 to 4.6 V VO −0.5 to VCC+0.5 V Output : H or L Input clamp current IIK −50 mA VI < 0 Output clamp current IOK ±50 mA VO < 0 or VO > VCC Continuous output current IO ±50 mA VO = 0 to VCC Continuous current through VCC or GND ICC or IGND ±100 mA Maximum power dissipation *3 at Ta = 25°C (in still air) PT 200 mW Storage temperature Tstg −65 to 150 °C Output voltage range Notes: *1, 2 Conditions The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150°C. Recommended Operating Conditions Item Symbol Min Supply voltage range VCC 1.2 3.6 V Input voltage range VI 0 3.6 V Input / output voltage range VI/O 0 VCC V Input transition rise or fall rate ∆t / ∆v 0 20 ns / V 0 10 −40 85 Operating free-air temperature Ta Note: Unused or floating inputs must be held high or low. Rev.4.00, Dec.18.2003, page 4 of 13 Max Unit Conditions VCC = 1.2 to 2.7 V VCC = 3.3±0.3 V °C HD74ALVC2G53 Electrical Characteristics Ta=25°C Test Ta=-40 to 85°C Item Symbol VCC (V) Min Typ Max Min Input voltage VIH 1.2 VCC×0.75 1.4 to 1.6 VCC×0.7 1.65 to 1.95 VCC×0.7 2.3 to 2.7 1.7 3.0 to 3.6 2.0 1.2 VCC×0.25 1.4 to 1.6 VCC×0.3 1.65 to 1.95 VCC×0.3 2.3 to 2.7 0.7 3.0 to 3.6 0.8 1.2 14 29 VI = 1.2 V, IO = 1 mA 12 25 30 VI = 0 V, IO = 2 mA 21 35 40 VI = 1.4 V, IO = 2 mA 10 17 20 VI = 0 V, IO = 4 mA 17 27 30 VI = 1.65 V, IO = 4 mA 8 11 13 VI = 0 V, IO = 8 mA 13 18 20 VI = 2.3 V, IO = 8 mA 7 9.5 10 VI = 0 V, IO = 24 mA 11 14.5 15.5 VI = 3.0 V, IO = 24 mA 1.2 280 1.4 125 250 350 IO = 2 mA 1.65 55 110 150 IO = 4 mA 2.3 20 30 35 IO = 8 mA 3.0 13 18 20 1.2 1.0 1.4 0.8 12 15 VIL On-state switch resistance RON 1.4 1.65 2.3 3.0 Peak on RON (p) resistance Difference of on-state ∆RON Rev.4.00, Dec.18.2003, page 5 of 13 Typ Max Unit conditions V Control input only Ω Ω VI = 0 V, IO = 1 mA IO = 1 mA IO = 24 mA Ω IO = 1 mA IO = 2 mA HD74ALVC2G53 Electrical Characteristics (cont) Ta=25°C Item Symbol resistance between switches Test Ta=-40 to 85°C VCC (V) Min Typ Max Min 1.65 0.6 9 12 IO = 4 mA 2.3 0.5 5 9 IO = 8 mA 3.0 0.2 3 4 IO = 24 mA Typ Max Unit conditions Off-state switch leakage current IS (OFF) 3.6 ±0.1 ±1.0 µA VIN = VCC, VOUT = GND or VIN = GND, VO = VCC, VC = VIL On-state switch leakage current IS (ON) 3.6 ±0.1 ±1.0 µA VIN = VCC or GND VC = VIH Input current IIN 0 to 3.6 ±0.1 ±1.0 µA VIN = 3.6 V or GND Quiescent supply current ICC 3.6 10 µA VIN = VCC or GND Control input capacitance CIC 4.5 pF Switch terminal capacitance CIN / OUT 5.5 pF Feed through capacitance CIN-OUT 0.2 pF Rev.4.00, Dec.18.2003, page 6 of 13 HD74ALVC2G53 Switching Characteristics (Ta = −40 to 85°C) VCC = 1.2 V Item Symbol Min Typ Max Unit Test conditions FROM (Input) TO (Output) Propagation *1 delay time tPLH tPHL 0.4 ns CL = 15 pF COM or Yn Yn or COM Enable time tZH tZL 6.5 ns CL = 15 pF INH COM or Yn Disable time tHZ tLZ 7.2 ns CL = 15 pF INH COM or Yn Item Symbol Min Typ Max Unit Test conditions FROM (Input) TO (Output) Propagation delay time *1 tPLH tPHL 0.3 ns CL = 15 pF COM or Yn Yn or COM Enable time tZH tZL 2.0 9.0 ns CL = 15 pF INH COM or Yn Disable time tHZ tLZ 2.0 10.0 ns CL = 15 pF INH COM or Yn Item Symbol Min Typ Max Unit Test conditions FROM (Input) TO (Output) Propagation delay time *1 tPLH tPHL 0.48 ns CL = 30 pF COM or Yn Yn or COM Enable time tZH tZL 1.5 7.0 ns CL = 30 pF INH COM or Yn Disable time tHZ tLZ 1.5 8.0 ns CL = 30 pF INH COM or Yn VCC = 1.5±0.1 V VCC = 1.8±0.15 V Rev.4.00, Dec.18.2003, page 7 of 13 HD74ALVC2G53 Switching Characteristics (cont) VCC = 2.5±0.2 V Item Symbol Min Typ Max Unit Test conditions FROM (Input) TO (Output) Propagation delay time *1 tPLH tPHL 0.35 ns CL = 30 pF COM or Yn Yn or COM Enable time tZH tZL 1.0 5.0 ns CL = 30 pF INH COM or Yn Disable time tHZ tLZ 1.0 6.0 ns CL = 30 pF INH COM or Yn Item Symbol Min Typ Max Unit Test conditions FROM (Input) TO (Output) Propagation delay time *1 tPLH tPHL 0.3 ns CL = 30 pF COM or Yn Yn or COM Enable time tZH tZL 1.0 4.0 ns CL = 30 pF INH COM or Yn Disable time tHZ tLZ 1.0 5.0 ns CL = 30 pF INH COM or Yn VCC = 3.3±0.3 V Note: 1. The propagation delay time is calculated by the RC (on-resistance and load capacitance) time constant. Operating Characteristics (Ta = 25°C) Item Symbol VCC (V) Min Typ Max Unit Test conditions Power dissipation CPD 1.5 11.5 pF f = 10 MHz 1.8 11.5 2.5 12.5 3.3 14.0 capacitance Rev.4.00, Dec.18.2003, page 8 of 13 HD74ALVC2G53 Test Circuit · R ON VCC VC =VIH VCC VIN =VCC (ON) VOUT R ON = GND 1.0 mA + V VIN-OUT 10 -3 (W) - VIN - V OUT • IS (off), I S (on) VCC VCC VC =VIL VC =VIH VCC A VIN =VCC or GND VCC (OFF) GND Rev.4.00, Dec.18.2003, page 9 of 13 A VOUT =GND or VCC VIN =VCC or GND (ON) GND VOUT OPEN HD74ALVC2G53 • t PLH, t PHL VCC VC =VIH Switch input VCC VIN tf tr (ON) 10% VOUT GND CL 90% 90% Vref Vref t PLH VIH 10% t PHL Switch RL Vref output GND VOH Vref VOL Symbol V CC = 1.2 V, V = 2.5±0.2 V, V = 1.8±0.15 V CC 1.5±0.1 V CC 3.3±0.3 V RL 2.0 kΩ 1.0 kΩ 500 Ω CL 15 pF 30 pF 30 pF Symbol V CC = 1.2 V, 1.5±0.1 V, V CC = 2.5±0.2 V 1.8±0.15 V V CC = 3.3±0.3 V tr / t f 2.0 ns 2.5 ns 2.5 ns V IH VCC VCC 2.7 V V ref 50% 50% 1.5 V Rev.4.00, Dec.18.2003, page 10 of 13 HD74ALVC2G53 • t ZH ,t ZL/ t HZ,t LZ VCC VCC×2 or 6.0 V VC RL S1 VCC VIN VOUT GND CL S2 tr Control input 10% tf 90% Vref 10% GND t LZ t ZL RL VIH 90% Vref RL VOH Vref Switch output t ZH VL VOL t HZ Vref VH VOH VOL S2 S1 V CC = 1.2 V, V CC = 1.2 V, 1.5±0.1 V, 1.5±0.1 V, Symbol V = 3.3±0.3 V V = 3.3±0.3 V 1.8±0.15 V, CC 1.8±0.15 V, CC 2.5±0.2 V 2.5±0.2 V tHZ / tZH VCC VCC GND GND tLZ / tZL GND GND VCC×2 6.0 V Symbol V CC = 1.2 V, V = 2.5±0.2 V, V = 1.8±0.15 V CC 1.5±0.1 V CC 3.3±0.3 V RL 2.0 kΩ 1.0 kΩ 500 Ω CL 15 pF 30 pF 30 pF Symbol V CC = 1.2 V, V = 1.8±0.15 V V CC = 2.5±0.2 V 1.5±0.1 V CC V CC = 3.3±0.3 V tr / t f 2.0 ns 2.0 ns 2.5 ns 2.5 ns V IH VCC VCC VCC 2.7 V 50% 50% 50% V ref VH / VL VH = VOH-0.1 V VH = VOH-0.15 V VH = VOH-0.15 V VL = VOL+0.1 V VL = VOL+0.15 V VL = VOL+0.15 V Rev.4.00, Dec.18.2003, page 11 of 13 1.5 V VH = VOH-0.3 V VL = VOL+0.3 V HD74ALVC2G53 • CIN/OUT, C IN-OUT CIN-OUT VC =GND VCC VCC (OFF) CIN/OUT Rev.4.00, Dec.18.2003, page 12 of 13 GND CIN/OUT HD74ALVC2G53 Package Dimensions 2.0 ± 0.2 1.5 ± 0.2 + 0.1 (0.17) 8 − 0.2 − 0.05 Package Code JEDEC JEITA Mass (reference value) Rev.4.00, Dec.18.2003, page 13 of 13 + 0.1 0.13 − 0.05 0 − 0.1 0.7 ± 0.1 (0.4) 2.3 ± 0.1 (0.5) (0.5) (0.5) 3.1 ± 0.3 (0.4) Unit: mm TTP–8DBV 0.010 g Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 © 2003. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon 1.0